JPH0357621B2 - - Google Patents

Info

Publication number
JPH0357621B2
JPH0357621B2 JP14387683A JP14387683A JPH0357621B2 JP H0357621 B2 JPH0357621 B2 JP H0357621B2 JP 14387683 A JP14387683 A JP 14387683A JP 14387683 A JP14387683 A JP 14387683A JP H0357621 B2 JPH0357621 B2 JP H0357621B2
Authority
JP
Japan
Prior art keywords
contact
positioning
inclined surface
jig
link bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14387683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6035530A (ja
Inventor
Takashi Terajima
Shunei Uematsu
Yasuo Kawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Hokkai Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Hokkai Semiconductor Ltd filed Critical Hitachi Hokkai Semiconductor Ltd
Priority to JP14387683A priority Critical patent/JPS6035530A/ja
Publication of JPS6035530A publication Critical patent/JPS6035530A/ja
Publication of JPH0357621B2 publication Critical patent/JPH0357621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP14387683A 1983-08-08 1983-08-08 ボンディング装置 Granted JPS6035530A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14387683A JPS6035530A (ja) 1983-08-08 1983-08-08 ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14387683A JPS6035530A (ja) 1983-08-08 1983-08-08 ボンディング装置

Publications (2)

Publication Number Publication Date
JPS6035530A JPS6035530A (ja) 1985-02-23
JPH0357621B2 true JPH0357621B2 (de) 1991-09-02

Family

ID=15349058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14387683A Granted JPS6035530A (ja) 1983-08-08 1983-08-08 ボンディング装置

Country Status (1)

Country Link
JP (1) JPS6035530A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146531U (ja) * 1983-12-28 1984-09-29 ダイキン工業株式会社 過給機付エンジンの吸入空気冷却装置
JPH021427U (de) * 1988-06-13 1990-01-08

Also Published As

Publication number Publication date
JPS6035530A (ja) 1985-02-23

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