JPS6230685B2 - - Google Patents
Info
- Publication number
- JPS6230685B2 JPS6230685B2 JP57218085A JP21808582A JPS6230685B2 JP S6230685 B2 JPS6230685 B2 JP S6230685B2 JP 57218085 A JP57218085 A JP 57218085A JP 21808582 A JP21808582 A JP 21808582A JP S6230685 B2 JPS6230685 B2 JP S6230685B2
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- mold
- pin
- capacitor
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012212 insulator Substances 0.000 claims description 27
- 239000003990 capacitor Substances 0.000 claims description 14
- 238000000465 moulding Methods 0.000 claims description 11
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000470 constituent Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57218085A JPS59107508A (ja) | 1982-12-13 | 1982-12-13 | コンデンサ−用絶縁体の成形金型 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57218085A JPS59107508A (ja) | 1982-12-13 | 1982-12-13 | コンデンサ−用絶縁体の成形金型 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59107508A JPS59107508A (ja) | 1984-06-21 |
JPS6230685B2 true JPS6230685B2 (ko) | 1987-07-03 |
Family
ID=16714399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57218085A Granted JPS59107508A (ja) | 1982-12-13 | 1982-12-13 | コンデンサ−用絶縁体の成形金型 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59107508A (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60218824A (ja) * | 1984-04-13 | 1985-11-01 | 川崎 裕司 | コンデンサ−用絶縁体の成形金型 |
JPH01135013A (ja) * | 1987-11-20 | 1989-05-26 | Masuoka Seisakusho:Kk | コンデンサー用ゴムパッキングの成型装置 |
JP5760555B2 (ja) * | 2011-03-18 | 2015-08-12 | セイコーエプソン株式会社 | アパーチャアレイの製造装置及び製造方法 |
JP2013163352A (ja) | 2012-02-13 | 2013-08-22 | Nec Infrontia Corp | 樹脂成形用金型、樹脂成形方法および樹脂成形品 |
JP5414009B2 (ja) * | 2013-09-20 | 2014-02-12 | Necインフロンティア株式会社 | 樹脂成形用金型、樹脂成形方法および樹脂成形品 |
-
1982
- 1982-12-13 JP JP57218085A patent/JPS59107508A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59107508A (ja) | 1984-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6371807B1 (en) | Rear cover and process for forming resilient seal member therein | |
US6045739A (en) | Method of manufacturing a molded product internally having inserts in a layered state | |
JPS6230685B2 (ko) | ||
US5879178A (en) | Waterproof connector housing | |
US7070460B1 (en) | Power cord and its manufacturing method | |
JPS6034448B2 (ja) | 眼鏡の縁面を成形するための金型の製造方法 | |
JPH0310015Y2 (ko) | ||
JPH05134142A (ja) | 光フアイバコネクタ | |
JP3182097B2 (ja) | ケース一体コネクターの成形方法 | |
JP3266556B2 (ja) | コネクタ用金型及びコネクタの製造方法 | |
KR100404418B1 (ko) | 전기접속용 단자 제조방법 및 그 구조 | |
JPS6256650B2 (ko) | ||
JP4197388B2 (ja) | インサート成形部品の生産方法 | |
JPH0554250B2 (ko) | ||
JPS6317326B2 (ko) | ||
CN222201443U (zh) | 模芯组件及定子注塑模具 | |
JPS59121790A (ja) | コネクタの製作方法 | |
JP3265868B2 (ja) | 電子部品の製造方法 | |
JPH053647A (ja) | 整流子の製造方法 | |
KR200183952Y1 (ko) | 전기접속용 단자구조 | |
JPH08238627A (ja) | 樹脂−ゴム一体成形用金型及びこれを用いた成形方法 | |
JPS5841661B2 (ja) | 樹脂封止形半導体装置の製造方法 | |
JPH0619157Y2 (ja) | コネクタ | |
JPH049142Y2 (ko) | ||
JP3315939B2 (ja) | モータ |