JPS6230502B2 - - Google Patents

Info

Publication number
JPS6230502B2
JPS6230502B2 JP54145655A JP14565579A JPS6230502B2 JP S6230502 B2 JPS6230502 B2 JP S6230502B2 JP 54145655 A JP54145655 A JP 54145655A JP 14565579 A JP14565579 A JP 14565579A JP S6230502 B2 JPS6230502 B2 JP S6230502B2
Authority
JP
Japan
Prior art keywords
substrate
integrated circuit
pattern
signal line
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54145655A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5669897A (en
Inventor
Katsuhiko Yabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP14565579A priority Critical patent/JPS5669897A/ja
Publication of JPS5669897A publication Critical patent/JPS5669897A/ja
Publication of JPS6230502B2 publication Critical patent/JPS6230502B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/63
    • H10W70/682
    • H10W90/734
    • H10W90/754

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP14565579A 1979-11-09 1979-11-09 High density package structure Granted JPS5669897A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14565579A JPS5669897A (en) 1979-11-09 1979-11-09 High density package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14565579A JPS5669897A (en) 1979-11-09 1979-11-09 High density package structure

Publications (2)

Publication Number Publication Date
JPS5669897A JPS5669897A (en) 1981-06-11
JPS6230502B2 true JPS6230502B2 (enExample) 1987-07-02

Family

ID=15390028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14565579A Granted JPS5669897A (en) 1979-11-09 1979-11-09 High density package structure

Country Status (1)

Country Link
JP (1) JPS5669897A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5835952A (ja) * 1981-08-28 1983-03-02 Nec Corp 半導体集積回路装置
JP4144436B2 (ja) * 2003-06-02 2008-09-03 セイコーエプソン株式会社 電気光学モジュール及び電子機器

Also Published As

Publication number Publication date
JPS5669897A (en) 1981-06-11

Similar Documents

Publication Publication Date Title
US5586007A (en) Circuit board having improved thermal radiation
KR100281813B1 (ko) 열및전기적으로개선된볼그리드패키지
US6396136B2 (en) Ball grid package with multiple power/ground planes
US4941033A (en) Semiconductor integrated circuit device
JP3410969B2 (ja) 半導体装置
US5625166A (en) Structure of a thermally and electrically enhanced plastic pin grid array (PPGA) package for high performance devices with wire bond interconnect
JPS6249989B2 (enExample)
WO1996013854A9 (en) Thermally and electrically enhanced plastic pin grid array (ppga) package
US4731700A (en) Semiconductor connection and crossover apparatus
KR102578797B1 (ko) 반도체 패키지
JPS6158297A (ja) 多層印刷配線板
JP2845227B2 (ja) マルチチップモジュールの実装構造
US6303877B2 (en) Multilayer thin-film wiring board
JP2664485B2 (ja) セラミック多層配線板
JPS6230502B2 (enExample)
JP2841945B2 (ja) 半導体装置
WO1999013509A1 (fr) Dispositif a semi-conducteur
JPS6230501B2 (enExample)
JP2817715B2 (ja) ボールグリッドアレイ型回路基板
JP3381449B2 (ja) 半導体パッケージとその実装構造
JP2000315747A (ja) 半導体パッケージ
JPH0555719A (ja) 回路基板装置
JP2792493B2 (ja) 半導体装置
JP2633889B2 (ja) 両面メモリーボード
JPS6219072B2 (enExample)