JPS6229919B2 - - Google Patents

Info

Publication number
JPS6229919B2
JPS6229919B2 JP55140735A JP14073580A JPS6229919B2 JP S6229919 B2 JPS6229919 B2 JP S6229919B2 JP 55140735 A JP55140735 A JP 55140735A JP 14073580 A JP14073580 A JP 14073580A JP S6229919 B2 JPS6229919 B2 JP S6229919B2
Authority
JP
Japan
Prior art keywords
lead
integrated circuit
lead frame
hole
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55140735A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5764996A (en
Inventor
Masayuki Kataoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14073580A priority Critical patent/JPS5764996A/ja
Publication of JPS5764996A publication Critical patent/JPS5764996A/ja
Publication of JPS6229919B2 publication Critical patent/JPS6229919B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP14073580A 1980-10-07 1980-10-07 Method of assembling hybrid integrated circuit device Granted JPS5764996A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14073580A JPS5764996A (en) 1980-10-07 1980-10-07 Method of assembling hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14073580A JPS5764996A (en) 1980-10-07 1980-10-07 Method of assembling hybrid integrated circuit device

Publications (2)

Publication Number Publication Date
JPS5764996A JPS5764996A (en) 1982-04-20
JPS6229919B2 true JPS6229919B2 (enExample) 1987-06-29

Family

ID=15275484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14073580A Granted JPS5764996A (en) 1980-10-07 1980-10-07 Method of assembling hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS5764996A (enExample)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51137553U (enExample) * 1975-04-28 1976-11-06
JPS5718779Y2 (enExample) * 1977-01-25 1982-04-20
JPS53112769U (enExample) * 1977-02-15 1978-09-08
JPS542374U (enExample) * 1977-06-08 1979-01-09

Also Published As

Publication number Publication date
JPS5764996A (en) 1982-04-20

Similar Documents

Publication Publication Date Title
US6862190B2 (en) Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers
US5352851A (en) Edge-mounted, surface-mount integrated circuit device
US6280205B1 (en) Surface-mounted type connector and method for producing circuit device including the same
JP2797177B2 (ja) 電気コネクタ
JPS6229919B2 (enExample)
US6191369B1 (en) Printed circuit board having a marker trace for component alignment
JPH01143389A (ja) ハイブリッド集積回路装置
JPH03252192A (ja) 混成集積回路部品及び組立方法
JP3018758B2 (ja) プリント基板用電子部品の固定装置
JPH0735309Y2 (ja) 自動実装対応フレキシブルコネクタ
JPS5939417Y2 (ja) プリント配線板用端子構造
JP2002270985A (ja) 導電部材の取付構造および取付方法
JPH0427171Y2 (enExample)
JPH01120781A (ja) 多層配線基板モジュール
JPH0440283Y2 (enExample)
JPH0535582Y2 (enExample)
JPS5828371Y2 (ja) 回路接続素子
JP2566986Y2 (ja) プリント配線基板
JPH084696Y2 (ja) 混成集積回路
JPH051098Y2 (enExample)
JPH07162122A (ja) プリント回路基板の配線構造
JPS5844602Y2 (ja) プリント配線基板
JPH0745977Y2 (ja) 基板接続構造
JP2002270980A (ja) 導電部材の取付構造および取付方法
JPS6354238B2 (enExample)