JPS542374U - - Google Patents
Info
- Publication number
- JPS542374U JPS542374U JP7450177U JP7450177U JPS542374U JP S542374 U JPS542374 U JP S542374U JP 7450177 U JP7450177 U JP 7450177U JP 7450177 U JP7450177 U JP 7450177U JP S542374 U JPS542374 U JP S542374U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7450177U JPS542374U (enExample) | 1977-06-08 | 1977-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7450177U JPS542374U (enExample) | 1977-06-08 | 1977-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS542374U true JPS542374U (enExample) | 1979-01-09 |
Family
ID=28988086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7450177U Pending JPS542374U (enExample) | 1977-06-08 | 1977-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS542374U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5764996A (en) * | 1980-10-07 | 1982-04-20 | Mitsubishi Electric Corp | Method of assembling hybrid integrated circuit device |
| JPS57106283U (enExample) * | 1980-12-22 | 1982-06-30 | ||
| JPS62130544A (ja) * | 1985-11-30 | 1987-06-12 | Ibiden Co Ltd | 半導体搭載用基板 |
-
1977
- 1977-06-08 JP JP7450177U patent/JPS542374U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5764996A (en) * | 1980-10-07 | 1982-04-20 | Mitsubishi Electric Corp | Method of assembling hybrid integrated circuit device |
| JPS57106283U (enExample) * | 1980-12-22 | 1982-06-30 | ||
| JPS62130544A (ja) * | 1985-11-30 | 1987-06-12 | Ibiden Co Ltd | 半導体搭載用基板 |