JPS62296710A - 積層ブスバ−配線板の防水シ−ル方法 - Google Patents
積層ブスバ−配線板の防水シ−ル方法Info
- Publication number
- JPS62296710A JPS62296710A JP61136315A JP13631586A JPS62296710A JP S62296710 A JPS62296710 A JP S62296710A JP 61136315 A JP61136315 A JP 61136315A JP 13631586 A JP13631586 A JP 13631586A JP S62296710 A JPS62296710 A JP S62296710A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- busbar
- laminated
- organic solvent
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Connection Or Junction Boxes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61136315A JPS62296710A (ja) | 1986-06-13 | 1986-06-13 | 積層ブスバ−配線板の防水シ−ル方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61136315A JPS62296710A (ja) | 1986-06-13 | 1986-06-13 | 積層ブスバ−配線板の防水シ−ル方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62296710A true JPS62296710A (ja) | 1987-12-24 |
| JPH0357687B2 JPH0357687B2 (enExample) | 1991-09-03 |
Family
ID=15172334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61136315A Granted JPS62296710A (ja) | 1986-06-13 | 1986-06-13 | 積層ブスバ−配線板の防水シ−ル方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62296710A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01116515U (enExample) * | 1988-01-28 | 1989-08-07 | ||
| JPH0274114A (ja) * | 1988-09-08 | 1990-03-14 | Yazaki Corp | ブスバー回路板およびその製造方法 |
-
1986
- 1986-06-13 JP JP61136315A patent/JPS62296710A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01116515U (enExample) * | 1988-01-28 | 1989-08-07 | ||
| JPH0274114A (ja) * | 1988-09-08 | 1990-03-14 | Yazaki Corp | ブスバー回路板およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0357687B2 (enExample) | 1991-09-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |