JPS62296528A - Resin-sealed semiconductor device - Google Patents
Resin-sealed semiconductor deviceInfo
- Publication number
- JPS62296528A JPS62296528A JP14082186A JP14082186A JPS62296528A JP S62296528 A JPS62296528 A JP S62296528A JP 14082186 A JP14082186 A JP 14082186A JP 14082186 A JP14082186 A JP 14082186A JP S62296528 A JPS62296528 A JP S62296528A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- resin
- lead frame
- layer
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000011347 resin Substances 0.000 abstract 4
- 229920005989 resin Polymers 0.000 abstract 4
- 229910001111 Fine metal Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
PURPOSE: To improve the bondability of a lead frame to a resin by extending inner leads onto a semiconductor chip, and interposing a thin insulating layer between the chips.
CONSTITUTION: Electrodes 3 collected to the center of a chip 3 placed on a chip placing tab 1 are so sealed with resin 6 as to be electrically connected with inner leads 8 and fine metal wirings 5 arrived at the top of the chip through the chip 2 and an insulating thin layer 7. The layer 7 is bonded in advance to a lead frame, and bonded to the chip 2 by a bonding resin before electrically connected with the electrodes 3 on the chip on the tab lead 1. The layer 7 is so formed in space at the center as to connect the electrodes 3 with the lead frame. Thus, the bonding strength of the lead frame with the resin can be enhanced.
COPYRIGHT: (C)1987,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14082186A JPS62296528A (en) | 1986-06-17 | 1986-06-17 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14082186A JPS62296528A (en) | 1986-06-17 | 1986-06-17 | Resin-sealed semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62296528A true JPS62296528A (en) | 1987-12-23 |
Family
ID=15277503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14082186A Pending JPS62296528A (en) | 1986-06-17 | 1986-06-17 | Resin-sealed semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62296528A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS647628A (en) * | 1987-06-30 | 1989-01-11 | Hitachi Ltd | Semiconductor device and manufacture thereof |
JPH0250438A (en) * | 1988-08-12 | 1990-02-20 | Hitachi Ltd | Semiconductor device |
JPH08241953A (en) * | 1996-03-21 | 1996-09-17 | Hitachi Ltd | Semiconductor device |
JPH08241905A (en) * | 1996-03-21 | 1996-09-17 | Hitachi Ltd | Semiconductor device |
JPH08274243A (en) * | 1996-03-21 | 1996-10-18 | Hitachi Ltd | Semiconductor device |
-
1986
- 1986-06-17 JP JP14082186A patent/JPS62296528A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS647628A (en) * | 1987-06-30 | 1989-01-11 | Hitachi Ltd | Semiconductor device and manufacture thereof |
JPH0250438A (en) * | 1988-08-12 | 1990-02-20 | Hitachi Ltd | Semiconductor device |
JPH08241953A (en) * | 1996-03-21 | 1996-09-17 | Hitachi Ltd | Semiconductor device |
JPH08241905A (en) * | 1996-03-21 | 1996-09-17 | Hitachi Ltd | Semiconductor device |
JPH08274243A (en) * | 1996-03-21 | 1996-10-18 | Hitachi Ltd | Semiconductor device |
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