JPS62296528A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS62296528A
JPS62296528A JP14082186A JP14082186A JPS62296528A JP S62296528 A JPS62296528 A JP S62296528A JP 14082186 A JP14082186 A JP 14082186A JP 14082186 A JP14082186 A JP 14082186A JP S62296528 A JPS62296528 A JP S62296528A
Authority
JP
Japan
Prior art keywords
chip
resin
lead frame
layer
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14082186A
Other languages
Japanese (ja)
Inventor
Itaru Maeda
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP14082186A priority Critical patent/JPS62296528A/en
Publication of JPS62296528A publication Critical patent/JPS62296528A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE: To improve the bondability of a lead frame to a resin by extending inner leads onto a semiconductor chip, and interposing a thin insulating layer between the chips.
CONSTITUTION: Electrodes 3 collected to the center of a chip 3 placed on a chip placing tab 1 are so sealed with resin 6 as to be electrically connected with inner leads 8 and fine metal wirings 5 arrived at the top of the chip through the chip 2 and an insulating thin layer 7. The layer 7 is bonded in advance to a lead frame, and bonded to the chip 2 by a bonding resin before electrically connected with the electrodes 3 on the chip on the tab lead 1. The layer 7 is so formed in space at the center as to connect the electrodes 3 with the lead frame. Thus, the bonding strength of the lead frame with the resin can be enhanced.
COPYRIGHT: (C)1987,JPO&Japio
JP14082186A 1986-06-17 1986-06-17 Resin-sealed semiconductor device Pending JPS62296528A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14082186A JPS62296528A (en) 1986-06-17 1986-06-17 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14082186A JPS62296528A (en) 1986-06-17 1986-06-17 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS62296528A true JPS62296528A (en) 1987-12-23

Family

ID=15277503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14082186A Pending JPS62296528A (en) 1986-06-17 1986-06-17 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS62296528A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS647628A (en) * 1987-06-30 1989-01-11 Hitachi Ltd Semiconductor device and manufacture thereof
JPH0250438A (en) * 1988-08-12 1990-02-20 Hitachi Ltd Semiconductor device
JPH08241953A (en) * 1996-03-21 1996-09-17 Hitachi Ltd Semiconductor device
JPH08241905A (en) * 1996-03-21 1996-09-17 Hitachi Ltd Semiconductor device
JPH08274243A (en) * 1996-03-21 1996-10-18 Hitachi Ltd Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS647628A (en) * 1987-06-30 1989-01-11 Hitachi Ltd Semiconductor device and manufacture thereof
JPH0250438A (en) * 1988-08-12 1990-02-20 Hitachi Ltd Semiconductor device
JPH08241953A (en) * 1996-03-21 1996-09-17 Hitachi Ltd Semiconductor device
JPH08241905A (en) * 1996-03-21 1996-09-17 Hitachi Ltd Semiconductor device
JPH08274243A (en) * 1996-03-21 1996-10-18 Hitachi Ltd Semiconductor device

Similar Documents

Publication Publication Date Title
JPS62296528A (en) Resin-sealed semiconductor device
JPS60120543A (en) Semiconductor device and lead frame used therefor
JPH0357236A (en) Manufacture of resin-sealed semiconductor device
JPH01261850A (en) Resin-sealed semiconductor device
JPH0451582A (en) Hybrid integrated circuit device
JPH02271561A (en) Resin-sealed semiconductor device
JPH01220837A (en) Semiconductor integrated circuit device
JPH03105950A (en) Package of semiconductor integrated circuit
JPH02153557A (en) Resin sealed type semiconductor device
JPH01257361A (en) Resin-sealed semiconductor device
JPH01124227A (en) Semiconductor device
JPS6242441A (en) Integrated circuit device
JPH03201545A (en) Semiconductor device
JPH0286157A (en) Semiconductor device
JPS6240750A (en) Resin-sealed semiconductor device
JPH0493051A (en) Thin module
JPS63107126A (en) Semiconductor device
JPH02308557A (en) Resin sealed semiconductor device
JPH04196450A (en) Semiconductor package
JPH0378235A (en) Lead frame
JPH02106061A (en) Taping method of semiconductor lead frame
JPS6329529A (en) Semiconductor device
JPS63283044A (en) Semiconductor integrated circuit device
JPH01173747A (en) Resin-sealed semiconductor device
JPH01295454A (en) Semiconductor device