JPH0250438A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH0250438A
JPH0250438A JP63199857A JP19985788A JPH0250438A JP H0250438 A JPH0250438 A JP H0250438A JP 63199857 A JP63199857 A JP 63199857A JP 19985788 A JP19985788 A JP 19985788A JP H0250438 A JPH0250438 A JP H0250438A
Authority
JP
Japan
Prior art keywords
leads
semiconductor
semiconductor chip
bonding
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63199857A
Other languages
Japanese (ja)
Other versions
JP2585738B2 (en
Inventor
Toshiyuki Sakuta
Kazuyuki Miyazawa
Satoshi Oguchi
Aizo Kaneda
Masao Mitani
Shozo Nakamura
Kunihiko Nishi
Hajime Murakami
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP63199857A priority Critical patent/JP2585738B2/en
Publication of JPH0250438A publication Critical patent/JPH0250438A/en
Application granted granted Critical
Publication of JP2585738B2 publication Critical patent/JP2585738B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10122Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/10125Reinforcing structures
    • H01L2224/10126Bump collar
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826Connecting between the body and an opposite side of the item with respect to the body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/07802Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PURPOSE:To reduce the size of a semiconductor device by a method wherein a rectangular semiconductor chip or the like having a plurality of bonding pads on its center part is employed. CONSTITUTION:Bonding pads P7-P14 are provided on the part near the center of a semiconductor chip 1. After the surface of the semiconductor chip 1 on which the pads are formed is bonded and fixed to the rear of the leads of a lead frame by insulating adhesive 4 with an organic insulating film between, tip surfaces of inner leads provided on the surface side of the chip and the bonding pad parts are connected to each other by wire bonding and sealed with molding resin. Therefore, the leads do not protrude from the semiconductor chip. With this constitution, the size of a semiconductor device can be reduced corresponding to the extent of the protruding leads.
JP63199857A 1988-08-12 1988-08-12 Semiconductor storage device Expired - Lifetime JP2585738B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63199857A JP2585738B2 (en) 1988-08-12 1988-08-12 Semiconductor storage device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63199857A JP2585738B2 (en) 1988-08-12 1988-08-12 Semiconductor storage device

Publications (2)

Publication Number Publication Date
JPH0250438A true JPH0250438A (en) 1990-02-20
JP2585738B2 JP2585738B2 (en) 1997-02-26

Family

ID=16414807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63199857A Expired - Lifetime JP2585738B2 (en) 1988-08-12 1988-08-12 Semiconductor storage device

Country Status (1)

Country Link
JP (1) JP2585738B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04164353A (en) * 1990-10-29 1992-06-10 Nec Corp Resin-sealed semiconductor device
EP2371910A1 (en) 2010-03-30 2011-10-05 Fujifilm Corporation Ink composition, inkjet recording method and process for producing molded printed material
JP2012094909A (en) * 2012-02-01 2012-05-17 Rohm Co Ltd Semiconductor integrated circuit device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609152A (en) * 1983-06-29 1985-01-18 Fujitsu Ltd Semiconductor device
JPS61241959A (en) * 1985-04-18 1986-10-28 Ibm Semiconductor module
JPS62296528A (en) * 1986-06-17 1987-12-23 Matsushita Electronics Corp Resin-sealed semiconductor device
JPS63117439A (en) * 1986-11-05 1988-05-21 Nec Corp Semiconductor memory device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609152A (en) * 1983-06-29 1985-01-18 Fujitsu Ltd Semiconductor device
JPS61241959A (en) * 1985-04-18 1986-10-28 Ibm Semiconductor module
JPS62296528A (en) * 1986-06-17 1987-12-23 Matsushita Electronics Corp Resin-sealed semiconductor device
JPS63117439A (en) * 1986-11-05 1988-05-21 Nec Corp Semiconductor memory device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04164353A (en) * 1990-10-29 1992-06-10 Nec Corp Resin-sealed semiconductor device
EP2371910A1 (en) 2010-03-30 2011-10-05 Fujifilm Corporation Ink composition, inkjet recording method and process for producing molded printed material
JP2012094909A (en) * 2012-02-01 2012-05-17 Rohm Co Ltd Semiconductor integrated circuit device

Also Published As

Publication number Publication date
JP2585738B2 (en) 1997-02-26

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