JPS6229230Y2 - - Google Patents
Info
- Publication number
- JPS6229230Y2 JPS6229230Y2 JP7177282U JP7177282U JPS6229230Y2 JP S6229230 Y2 JPS6229230 Y2 JP S6229230Y2 JP 7177282 U JP7177282 U JP 7177282U JP 7177282 U JP7177282 U JP 7177282U JP S6229230 Y2 JPS6229230 Y2 JP S6229230Y2
- Authority
- JP
- Japan
- Prior art keywords
- stress
- low
- bonding surface
- strength member
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 5
- 239000003733 fiber-reinforced composite Substances 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims 1
- 230000035882 stress Effects 0.000 description 16
- 230000008646 thermal stress Effects 0.000 description 12
- 238000005336 cracking Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000011208 reinforced composite material Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7177282U JPS58175034U (ja) | 1982-05-17 | 1982-05-17 | 応力緩和接着構造体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7177282U JPS58175034U (ja) | 1982-05-17 | 1982-05-17 | 応力緩和接着構造体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58175034U JPS58175034U (ja) | 1983-11-22 |
JPS6229230Y2 true JPS6229230Y2 (enrdf_load_html_response) | 1987-07-27 |
Family
ID=30081367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7177282U Granted JPS58175034U (ja) | 1982-05-17 | 1982-05-17 | 応力緩和接着構造体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58175034U (enrdf_load_html_response) |
-
1982
- 1982-05-17 JP JP7177282U patent/JPS58175034U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58175034U (ja) | 1983-11-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2019189329A1 (ja) | ヒートシンク付き絶縁回路基板 | |
CA2473346A1 (en) | Lightweight structure particularly for aircraft | |
CN104832507B (zh) | 一种复合材料板件接头 | |
WO2016129360A1 (ja) | 樹脂補強金属部品 | |
US3127304A (en) | Balanced-stressed composite structure panel and method for same | |
CN107901518B (zh) | 一种带金属柔性接头的l型复合材料夹芯板连接结构 | |
JPS6229230Y2 (enrdf_load_html_response) | ||
JP5574322B2 (ja) | 積層複合材料 | |
TW202141714A (zh) | 散熱片一體型絕緣電路基板 | |
US20170283318A1 (en) | Glass bonding material and multilayer glass | |
JP2015130431A (ja) | ヒートシンク付パワーモジュール用基板の製造方法 | |
TW202243156A (zh) | 散熱片一體型絕緣電路基板 | |
JPH01150524A (ja) | 繊維強化樹脂とアルミニウム又はアルミニウム合金との接着継手 | |
WO2019188884A1 (ja) | ヒートシンク付き絶縁回路基板 | |
JPS62204936A (ja) | 黒鉛と金属からなる複合材の製造方法 | |
JP6769169B2 (ja) | セラミックス基板とアルミニウム含浸炭化珪素多孔質体との接合体の製造方法 | |
JPH0419111A (ja) | コンクリート製成形型の表面補強方法 | |
JPS60187546A (ja) | 黒鉛−銅接合部材及びその製造方法 | |
JPH0234912B2 (ja) | Seramitsukusutokinzokutaitonosetsugohoho | |
JP7467936B2 (ja) | ヒートシンク付絶縁回路基板、電子部品及びヒートシンク付絶縁回路基板の製造方法 | |
JPS62202732A (ja) | 黒鉛と銅または銅合金からなる複合材 | |
JPS6168376A (ja) | フエライト磁石と金属材料の接着法 | |
JPS61101473A (ja) | セラミツクスと金属との接合方法 | |
JP2018046151A (ja) | 半導体装置 | |
JPH07100358B2 (ja) | 黒鉛と銅からなる複合材 |