JPS62290616A - ウエハ搬送機構 - Google Patents
ウエハ搬送機構Info
- Publication number
- JPS62290616A JPS62290616A JP13151786A JP13151786A JPS62290616A JP S62290616 A JPS62290616 A JP S62290616A JP 13151786 A JP13151786 A JP 13151786A JP 13151786 A JP13151786 A JP 13151786A JP S62290616 A JPS62290616 A JP S62290616A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- arm
- carrier
- carriers
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 15
- 239000000969 carrier Substances 0.000 claims abstract description 17
- 235000012431 wafers Nutrition 0.000 claims description 89
- 230000007723 transport mechanism Effects 0.000 claims description 14
- 230000032258 transport Effects 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 6
- 238000007664 blowing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000009937 brining Methods 0.000 description 1
- 210000000080 chela (arthropods) Anatomy 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Warehouses Or Storage Devices (AREA)
- Specific Conveyance Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13151786A JPS62290616A (ja) | 1986-06-05 | 1986-06-05 | ウエハ搬送機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13151786A JPS62290616A (ja) | 1986-06-05 | 1986-06-05 | ウエハ搬送機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62290616A true JPS62290616A (ja) | 1987-12-17 |
| JPH0577565B2 JPH0577565B2 (cg-RX-API-DMAC7.html) | 1993-10-27 |
Family
ID=15059897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13151786A Granted JPS62290616A (ja) | 1986-06-05 | 1986-06-05 | ウエハ搬送機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62290616A (cg-RX-API-DMAC7.html) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01166534A (ja) * | 1987-12-23 | 1989-06-30 | Hitachi Ltd | 被処理物収納部支持機構 |
| JPH02263454A (ja) * | 1989-03-20 | 1990-10-26 | Tel Sagami Ltd | 熱処理装置 |
| JPH0348439A (ja) * | 1989-07-17 | 1991-03-01 | Tokyo Electron Sagami Ltd | 熱処理装置 |
| JPH05198659A (ja) * | 1992-01-22 | 1993-08-06 | Tokyo Ohka Kogyo Co Ltd | プラズマ処理装置 |
| JPH06196541A (ja) * | 1991-11-18 | 1994-07-15 | Fusion Syst Corp | ウエハ搬送装置 |
| JPH06268044A (ja) * | 1993-03-15 | 1994-09-22 | Tdk Corp | クリーン搬送方法及び装置 |
| JPH07235580A (ja) * | 1994-02-22 | 1995-09-05 | Tdk Corp | クリーン搬送方法及び装置 |
| EP0452939B1 (en) * | 1990-04-19 | 2000-11-02 | Applied Materials, Inc. | Apparatus and method for loading workpieces in a processing system |
| JP2007173285A (ja) * | 2005-12-19 | 2007-07-05 | Nec Electronics Corp | ウェーハプローバ装置およびウェーハ検査方法 |
| TWI452643B (zh) * | 2006-05-11 | 2014-09-11 | Tokyo Electron Ltd | Inspection device and inspection method |
-
1986
- 1986-06-05 JP JP13151786A patent/JPS62290616A/ja active Granted
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01166534A (ja) * | 1987-12-23 | 1989-06-30 | Hitachi Ltd | 被処理物収納部支持機構 |
| JPH02263454A (ja) * | 1989-03-20 | 1990-10-26 | Tel Sagami Ltd | 熱処理装置 |
| JPH0348439A (ja) * | 1989-07-17 | 1991-03-01 | Tokyo Electron Sagami Ltd | 熱処理装置 |
| US6454508B2 (en) | 1990-04-19 | 2002-09-24 | Applied Materials, Inc. | Dual cassette load lock |
| US6599076B2 (en) | 1990-04-19 | 2003-07-29 | Applied Materials, Inc. | Dual cassette load lock |
| US6454519B1 (en) | 1990-04-19 | 2002-09-24 | Applied Materials, Inc. | Dual cassette load lock |
| EP0452939B1 (en) * | 1990-04-19 | 2000-11-02 | Applied Materials, Inc. | Apparatus and method for loading workpieces in a processing system |
| JPH06196541A (ja) * | 1991-11-18 | 1994-07-15 | Fusion Syst Corp | ウエハ搬送装置 |
| JPH05198659A (ja) * | 1992-01-22 | 1993-08-06 | Tokyo Ohka Kogyo Co Ltd | プラズマ処理装置 |
| JPH06268044A (ja) * | 1993-03-15 | 1994-09-22 | Tdk Corp | クリーン搬送方法及び装置 |
| JPH07235580A (ja) * | 1994-02-22 | 1995-09-05 | Tdk Corp | クリーン搬送方法及び装置 |
| JP2007173285A (ja) * | 2005-12-19 | 2007-07-05 | Nec Electronics Corp | ウェーハプローバ装置およびウェーハ検査方法 |
| TWI452643B (zh) * | 2006-05-11 | 2014-09-11 | Tokyo Electron Ltd | Inspection device and inspection method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0577565B2 (cg-RX-API-DMAC7.html) | 1993-10-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4173309B2 (ja) | センタリング装置及び枚葉式検査装置 | |
| JPH04340248A (ja) | ウエハプローバ | |
| US6468022B1 (en) | Edge-gripping pre-aligner | |
| US5984610A (en) | Pod loader interface | |
| KR101539568B1 (ko) | 복수의 웨이퍼 핸들링 능력이 있는 이송 기구 | |
| CN101192556A (zh) | 晶片传送装置 | |
| GB2395841A (en) | Aligning thinned semiconductor wafers | |
| US20030122146A1 (en) | Wafer cassette | |
| JPS62290616A (ja) | ウエハ搬送機構 | |
| KR100252571B1 (ko) | 반도체장치운반및취급장치와함께사용하기위한제어시스템 | |
| US12228590B2 (en) | Wafer probe device | |
| JPH0669295A (ja) | プローブシステム | |
| JPH11288988A (ja) | アライメント高速処理機構 | |
| JPH03289152A (ja) | プローブ装置 | |
| JP3099235B2 (ja) | ウエハ検査装置 | |
| KR20220004522A (ko) | Ssd 테스터 자동화 시스템 | |
| JPH0582625A (ja) | ウエハ搬送装置 | |
| KR20230082037A (ko) | 산업용 로봇 | |
| KR101541538B1 (ko) | 웨이퍼 이송 유닛 및 이를 포함하는 프로브 스테이션 | |
| JP3217110B2 (ja) | 搬送装置 | |
| US20100321679A1 (en) | Measurement system and method | |
| JPH0630370B2 (ja) | プローブ装置 | |
| CN100497134C (zh) | 托盘输送装置 | |
| JPH05144924A (ja) | ウエハの心出し装置およびその方法 | |
| JPH06334026A (ja) | オリエンテーションフラット合わせ機内蔵型ウエハ収納装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |