JPS622775Y2 - - Google Patents

Info

Publication number
JPS622775Y2
JPS622775Y2 JP1981160053U JP16005381U JPS622775Y2 JP S622775 Y2 JPS622775 Y2 JP S622775Y2 JP 1981160053 U JP1981160053 U JP 1981160053U JP 16005381 U JP16005381 U JP 16005381U JP S622775 Y2 JPS622775 Y2 JP S622775Y2
Authority
JP
Japan
Prior art keywords
substrate
resin layer
integrated circuit
semiconductor element
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981160053U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5866646U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981160053U priority Critical patent/JPS5866646U/ja
Priority to KR2019820003095U priority patent/KR860000239Y1/ko
Publication of JPS5866646U publication Critical patent/JPS5866646U/ja
Application granted granted Critical
Publication of JPS622775Y2 publication Critical patent/JPS622775Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/298—Semiconductor material, e.g. amorphous silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
JP1981160053U 1981-10-26 1981-10-26 混成集積回路の封止構造 Granted JPS5866646U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1981160053U JPS5866646U (ja) 1981-10-26 1981-10-26 混成集積回路の封止構造
KR2019820003095U KR860000239Y1 (ko) 1981-10-26 1982-04-20 혼성집적회로의 봉지구조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981160053U JPS5866646U (ja) 1981-10-26 1981-10-26 混成集積回路の封止構造

Publications (2)

Publication Number Publication Date
JPS5866646U JPS5866646U (ja) 1983-05-06
JPS622775Y2 true JPS622775Y2 (ko) 1987-01-22

Family

ID=29952483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981160053U Granted JPS5866646U (ja) 1981-10-26 1981-10-26 混成集積回路の封止構造

Country Status (2)

Country Link
JP (1) JPS5866646U (ko)
KR (1) KR860000239Y1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3539467B2 (ja) * 1997-03-25 2004-07-07 ミツミ電機株式会社 電子部品モジュール

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139206U (ko) * 1977-04-07 1978-11-04

Also Published As

Publication number Publication date
KR860000239Y1 (ko) 1986-03-05
JPS5866646U (ja) 1983-05-06
KR830004331U (ko) 1983-12-30

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