JPS6226175B2 - - Google Patents

Info

Publication number
JPS6226175B2
JPS6226175B2 JP19720782A JP19720782A JPS6226175B2 JP S6226175 B2 JPS6226175 B2 JP S6226175B2 JP 19720782 A JP19720782 A JP 19720782A JP 19720782 A JP19720782 A JP 19720782A JP S6226175 B2 JPS6226175 B2 JP S6226175B2
Authority
JP
Japan
Prior art keywords
thin plate
plate material
tubular shaft
guide body
cleaning device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19720782A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5986226A (ja
Inventor
Haruyuki Hoshika
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57197207A priority Critical patent/JPS5986226A/ja
Publication of JPS5986226A publication Critical patent/JPS5986226A/ja
Publication of JPS6226175B2 publication Critical patent/JPS6226175B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP57197207A 1982-11-08 1982-11-08 薄板状材の洗浄装置 Granted JPS5986226A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57197207A JPS5986226A (ja) 1982-11-08 1982-11-08 薄板状材の洗浄装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57197207A JPS5986226A (ja) 1982-11-08 1982-11-08 薄板状材の洗浄装置

Publications (2)

Publication Number Publication Date
JPS5986226A JPS5986226A (ja) 1984-05-18
JPS6226175B2 true JPS6226175B2 (fr) 1987-06-08

Family

ID=16370598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57197207A Granted JPS5986226A (ja) 1982-11-08 1982-11-08 薄板状材の洗浄装置

Country Status (1)

Country Link
JP (1) JPS5986226A (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69620037T2 (de) * 1995-10-13 2002-11-07 Lam Res Corp VORRICHTUNG ZUR aBGABE VON ZWEI CHEMISCHEN PRODUKTEN DURCH EINE BÜRSTE
US5875507A (en) * 1996-07-15 1999-03-02 Oliver Design, Inc. Wafer cleaning apparatus
US6230753B1 (en) 1996-07-15 2001-05-15 Lam Research Corporation Wafer cleaning apparatus
US6247197B1 (en) 1998-07-09 2001-06-19 Lam Research Corporation Brush interflow distributor
US6240588B1 (en) * 1999-12-03 2001-06-05 Lam Research Corporation Wafer scrubbing brush core
WO2005065849A1 (fr) * 2003-12-26 2005-07-21 Aion Co., Ltd. Mandrin pour rouleau éponge de lavage

Also Published As

Publication number Publication date
JPS5986226A (ja) 1984-05-18

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