JPS62259302A - 導電ペ−スト組成物 - Google Patents
導電ペ−スト組成物Info
- Publication number
- JPS62259302A JPS62259302A JP10267786A JP10267786A JPS62259302A JP S62259302 A JPS62259302 A JP S62259302A JP 10267786 A JP10267786 A JP 10267786A JP 10267786 A JP10267786 A JP 10267786A JP S62259302 A JPS62259302 A JP S62259302A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- conductive paste
- silver
- powder
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 20
- 229910052709 silver Inorganic materials 0.000 claims description 16
- 239000004332 silver Substances 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 12
- 239000005388 borosilicate glass Substances 0.000 claims description 9
- 239000002612 dispersion medium Substances 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 239000011521 glass Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 229910052763 palladium Inorganic materials 0.000 description 7
- 230000032683 aging Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 229910000510 noble metal Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267786A JPS62259302A (ja) | 1986-05-02 | 1986-05-02 | 導電ペ−スト組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267786A JPS62259302A (ja) | 1986-05-02 | 1986-05-02 | 導電ペ−スト組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62259302A true JPS62259302A (ja) | 1987-11-11 |
| JPH0514363B2 JPH0514363B2 (enrdf_load_stackoverflow) | 1993-02-24 |
Family
ID=14333862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10267786A Granted JPS62259302A (ja) | 1986-05-02 | 1986-05-02 | 導電ペ−スト組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62259302A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05222546A (ja) * | 1992-02-07 | 1993-08-31 | Narumi China Corp | 銀ペースト |
| KR20010067050A (ko) * | 1999-08-06 | 2001-07-12 | 사토 히로시 | 적층인덕터와 그 제조방법 |
| JP2006302891A (ja) * | 2005-04-14 | 2006-11-02 | E I Du Pont De Nemours & Co | 半導体デバイスの製造方法、およびそこで使用される導電性組成物 |
| CN101964219A (zh) * | 2010-08-10 | 2011-02-02 | 上海九晶电子材料股份有限公司 | 晶体硅太阳能电池正面用银浆及其制备方法 |
| JP2012221765A (ja) * | 2011-04-11 | 2012-11-12 | Tdk Corp | 導体用ペースト、ガラスセラミックス基板および電子部品モジュール |
| KR20160135123A (ko) * | 2014-03-20 | 2016-11-24 | 나믹스 가부시끼가이샤 | 도전성 페이스트, 적층 세라믹 부품, 프린트 배선판 및 전자 장치 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6166305A (ja) * | 1984-09-07 | 1986-04-05 | 田中マツセイ株式会社 | 導体組成物 |
-
1986
- 1986-05-02 JP JP10267786A patent/JPS62259302A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6166305A (ja) * | 1984-09-07 | 1986-04-05 | 田中マツセイ株式会社 | 導体組成物 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05222546A (ja) * | 1992-02-07 | 1993-08-31 | Narumi China Corp | 銀ペースト |
| KR20010067050A (ko) * | 1999-08-06 | 2001-07-12 | 사토 히로시 | 적층인덕터와 그 제조방법 |
| JP2006302891A (ja) * | 2005-04-14 | 2006-11-02 | E I Du Pont De Nemours & Co | 半導体デバイスの製造方法、およびそこで使用される導電性組成物 |
| CN101964219A (zh) * | 2010-08-10 | 2011-02-02 | 上海九晶电子材料股份有限公司 | 晶体硅太阳能电池正面用银浆及其制备方法 |
| JP2012221765A (ja) * | 2011-04-11 | 2012-11-12 | Tdk Corp | 導体用ペースト、ガラスセラミックス基板および電子部品モジュール |
| KR20160135123A (ko) * | 2014-03-20 | 2016-11-24 | 나믹스 가부시끼가이샤 | 도전성 페이스트, 적층 세라믹 부품, 프린트 배선판 및 전자 장치 |
| EP3121819A4 (en) * | 2014-03-20 | 2017-11-01 | Namics Corporation | Conductive paste, laminated ceramic component, printed circuit board, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514363B2 (enrdf_load_stackoverflow) | 1993-02-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |