JPS6225905Y2 - - Google Patents
Info
- Publication number
- JPS6225905Y2 JPS6225905Y2 JP1981064307U JP6430781U JPS6225905Y2 JP S6225905 Y2 JPS6225905 Y2 JP S6225905Y2 JP 1981064307 U JP1981064307 U JP 1981064307U JP 6430781 U JP6430781 U JP 6430781U JP S6225905 Y2 JPS6225905 Y2 JP S6225905Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- substrate support
- sealed semiconductor
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981064307U JPS6225905Y2 (US06566495-20030520-M00011.png) | 1981-04-30 | 1981-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981064307U JPS6225905Y2 (US06566495-20030520-M00011.png) | 1981-04-30 | 1981-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57175448U JPS57175448U (US06566495-20030520-M00011.png) | 1982-11-05 |
| JPS6225905Y2 true JPS6225905Y2 (US06566495-20030520-M00011.png) | 1987-07-02 |
Family
ID=29860379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981064307U Expired JPS6225905Y2 (US06566495-20030520-M00011.png) | 1981-04-30 | 1981-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6225905Y2 (US06566495-20030520-M00011.png) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59134570A (ja) * | 1983-01-24 | 1984-08-02 | Shin Kobe Electric Mach Co Ltd | 燃料電池構造 |
| JPS59117156U (ja) * | 1983-01-26 | 1984-08-07 | サンケン電気株式会社 | 絶縁物封止半導体装置 |
| JPS6164212A (ja) * | 1984-09-05 | 1986-04-02 | ユニチカ株式会社 | 布団用硬綿の製造方法 |
| JPH0334913Y2 (US06566495-20030520-M00011.png) * | 1984-12-10 | 1991-07-24 | ||
| JP2659540B2 (ja) * | 1987-06-19 | 1997-09-30 | オリンパス光学工業株式会社 | 内視鏡チャンネル插通型超音波プローブ |
| JPH0328510Y2 (US06566495-20030520-M00011.png) * | 1987-10-02 | 1991-06-19 | ||
| JP5308979B2 (ja) * | 2009-09-30 | 2013-10-09 | 新電元工業株式会社 | 半導体パッケージ |
| JP2015008309A (ja) * | 2014-08-08 | 2015-01-15 | 株式会社鷺宮製作所 | モールドコイルおよびモールドコイルを用いた電磁弁 |
| JP6818801B2 (ja) * | 2019-04-01 | 2021-01-20 | ローム株式会社 | パワーモジュールおよびその製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5036074A (US06566495-20030520-M00011.png) * | 1973-07-20 | 1975-04-04 | ||
| JPS5541022A (en) * | 1978-09-15 | 1980-03-22 | Matsushita Electric Works Ltd | Photo oscillation circuit |
| JPS55160449A (en) * | 1979-05-31 | 1980-12-13 | Toshiba Corp | Semiconductor device |
| JPS56104459A (en) * | 1980-01-25 | 1981-08-20 | Hitachi Ltd | Semiconductor device |
| JPS613100A (ja) * | 1984-06-18 | 1986-01-09 | 富士写真フイルム株式会社 | 放射線増感紙 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5149960U (US06566495-20030520-M00011.png) * | 1974-10-14 | 1976-04-15 |
-
1981
- 1981-04-30 JP JP1981064307U patent/JPS6225905Y2/ja not_active Expired
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5036074A (US06566495-20030520-M00011.png) * | 1973-07-20 | 1975-04-04 | ||
| JPS5541022A (en) * | 1978-09-15 | 1980-03-22 | Matsushita Electric Works Ltd | Photo oscillation circuit |
| JPS55160449A (en) * | 1979-05-31 | 1980-12-13 | Toshiba Corp | Semiconductor device |
| JPS56104459A (en) * | 1980-01-25 | 1981-08-20 | Hitachi Ltd | Semiconductor device |
| JPS613100A (ja) * | 1984-06-18 | 1986-01-09 | 富士写真フイルム株式会社 | 放射線増感紙 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57175448U (US06566495-20030520-M00011.png) | 1982-11-05 |
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