JPS6225496A - プリント配線基板導通孔の連続化学めつき方法とその装置 - Google Patents

プリント配線基板導通孔の連続化学めつき方法とその装置

Info

Publication number
JPS6225496A
JPS6225496A JP16397385A JP16397385A JPS6225496A JP S6225496 A JPS6225496 A JP S6225496A JP 16397385 A JP16397385 A JP 16397385A JP 16397385 A JP16397385 A JP 16397385A JP S6225496 A JPS6225496 A JP S6225496A
Authority
JP
Japan
Prior art keywords
chemical plating
wiring board
treatment tank
processing
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16397385A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0224396B2 (fr
Inventor
松下　哲夫
茂 斉藤
勝 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azuma KK
Original Assignee
Azuma KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Azuma KK filed Critical Azuma KK
Priority to JP16397385A priority Critical patent/JPS6225496A/ja
Publication of JPS6225496A publication Critical patent/JPS6225496A/ja
Publication of JPH0224396B2 publication Critical patent/JPH0224396B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP16397385A 1985-07-26 1985-07-26 プリント配線基板導通孔の連続化学めつき方法とその装置 Granted JPS6225496A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16397385A JPS6225496A (ja) 1985-07-26 1985-07-26 プリント配線基板導通孔の連続化学めつき方法とその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16397385A JPS6225496A (ja) 1985-07-26 1985-07-26 プリント配線基板導通孔の連続化学めつき方法とその装置

Publications (2)

Publication Number Publication Date
JPS6225496A true JPS6225496A (ja) 1987-02-03
JPH0224396B2 JPH0224396B2 (fr) 1990-05-29

Family

ID=15784333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16397385A Granted JPS6225496A (ja) 1985-07-26 1985-07-26 プリント配線基板導通孔の連続化学めつき方法とその装置

Country Status (1)

Country Link
JP (1) JPS6225496A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012182284A (ja) * 2011-03-01 2012-09-20 Hitachi Chem Co Ltd めっき前処理装置及びめっき前処理方法
JP2012246069A (ja) * 2011-05-25 2012-12-13 Shinko Electric Ind Co Ltd ワークの搬送装置および搬送方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0538595U (ja) * 1991-10-28 1993-05-25 立山アルミニウム工業株式会社 目覚し装置
JPH0678895U (ja) * 1992-04-30 1994-11-04 ミサワホーム株式会社 快適起床環境装置
JP4884816B2 (ja) * 2006-02-02 2012-02-29 上村工業株式会社 浸漬処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012182284A (ja) * 2011-03-01 2012-09-20 Hitachi Chem Co Ltd めっき前処理装置及びめっき前処理方法
JP2012246069A (ja) * 2011-05-25 2012-12-13 Shinko Electric Ind Co Ltd ワークの搬送装置および搬送方法

Also Published As

Publication number Publication date
JPH0224396B2 (fr) 1990-05-29

Similar Documents

Publication Publication Date Title
US4401522A (en) Plating method and apparatus
JP3412820B2 (ja) 車体表面処理装置
US3905827A (en) Etchant rinse method
US5753096A (en) Method for the surface treatment of parts
JPH02197599A (ja) 金属表面の化学処理装置
JP3165435B2 (ja) 洗浄装置
JPS6225496A (ja) プリント配線基板導通孔の連続化学めつき方法とその装置
US4828878A (en) Device for and method of treating objects, particularly printed circuit boards
GB1572756A (en) Electrolytic method and device for the treatment of effluent
US4783244A (en) Method of and device for guiding plate-shaped objects
JP2535278B2 (ja) プリント配線基板のメッキ方法及びその装置
JP2003218497A (ja) 基板処理装置
CN218880115U (zh) 一种电化学镀铜浸泡装置
JPH0241873Y2 (fr)
JPH0696796B2 (ja) 化学処理装置
JPH0413439B2 (fr)
JPH02222194A (ja) プリント基板の処理方法
JPH09104997A (ja) プリント配線基板の電気メッキ装置
JPH01172598A (ja) 全面メッキ装置
JPH027494A (ja) プリント基板のメッキ装置
JPH03119792A (ja) プリント配線板のメッキ装置
JPS594877B2 (ja) プリント配線基板の液体浸漬装置
JPH0138395B2 (fr)
JPH06196859A (ja) 化学処理装置および電着装置
JPS5896759A (ja) 半導体装置用リ−ドフレ−ムのメツキ処理装置