JPS6225436A - 混成集積回路装置 - Google Patents
混成集積回路装置Info
- Publication number
- JPS6225436A JPS6225436A JP16517985A JP16517985A JPS6225436A JP S6225436 A JPS6225436 A JP S6225436A JP 16517985 A JP16517985 A JP 16517985A JP 16517985 A JP16517985 A JP 16517985A JP S6225436 A JPS6225436 A JP S6225436A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- integrated circuit
- circuit device
- hybrid integrated
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 abstract description 8
- 230000001070 adhesive effect Effects 0.000 abstract description 8
- 238000012856 packing Methods 0.000 abstract 3
- 238000005476 soldering Methods 0.000 abstract 1
- 230000035939 shock Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16517985A JPS6225436A (ja) | 1985-07-25 | 1985-07-25 | 混成集積回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16517985A JPS6225436A (ja) | 1985-07-25 | 1985-07-25 | 混成集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6225436A true JPS6225436A (ja) | 1987-02-03 |
JPH0511423B2 JPH0511423B2 (enrdf_load_stackoverflow) | 1993-02-15 |
Family
ID=15807349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16517985A Granted JPS6225436A (ja) | 1985-07-25 | 1985-07-25 | 混成集積回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6225436A (enrdf_load_stackoverflow) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58135962U (ja) * | 1982-03-09 | 1983-09-13 | 松下電器産業株式会社 | 混成集積回路ユニツト |
-
1985
- 1985-07-25 JP JP16517985A patent/JPS6225436A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58135962U (ja) * | 1982-03-09 | 1983-09-13 | 松下電器産業株式会社 | 混成集積回路ユニツト |
Also Published As
Publication number | Publication date |
---|---|
JPH0511423B2 (enrdf_load_stackoverflow) | 1993-02-15 |
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