JPS62247078A - 無電解銅めつきのＰｄ／Ｓｎ種の活性化促進方法 - Google Patents
無電解銅めつきのＰｄ／Ｓｎ種の活性化促進方法Info
- Publication number
- JPS62247078A JPS62247078A JP61219909A JP21990986A JPS62247078A JP S62247078 A JPS62247078 A JP S62247078A JP 61219909 A JP61219909 A JP 61219909A JP 21990986 A JP21990986 A JP 21990986A JP S62247078 A JPS62247078 A JP S62247078A
- Authority
- JP
- Japan
- Prior art keywords
- species
- plating
- activation
- electrolesscopper
- seed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 16
- 238000007747 plating Methods 0.000 title claims description 10
- 230000004913 activation Effects 0.000 title claims description 7
- 230000001737 promoting effect Effects 0.000 title claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical group [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012777 commercial manufacturing Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/792,425 US4640718A (en) | 1985-10-29 | 1985-10-29 | Process for accelerating Pd/Sn seeds for electroless copper plating |
| US792425 | 1985-10-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62247078A true JPS62247078A (ja) | 1987-10-28 |
| JPH0160549B2 JPH0160549B2 (enExample) | 1989-12-22 |
Family
ID=25156853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61219909A Granted JPS62247078A (ja) | 1985-10-29 | 1986-09-19 | 無電解銅めつきのＰｄ／Ｓｎ種の活性化促進方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4640718A (enExample) |
| EP (1) | EP0221359B1 (enExample) |
| JP (1) | JPS62247078A (enExample) |
| DE (1) | DE3664646D1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4948707A (en) * | 1988-02-16 | 1990-08-14 | International Business Machines Corporation | Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon |
| US4818286A (en) * | 1988-03-08 | 1989-04-04 | International Business Machines Corporation | Electroless copper plating bath |
| FR2726205B1 (fr) * | 1994-10-28 | 1997-09-26 | Motorola Inc | Procede destine a reduire le temps de demarrage dans un bain autocatalytique |
| US6207351B1 (en) | 1995-06-07 | 2001-03-27 | International Business Machines Corporation | Method for pattern seeding and plating of high density printed circuit boards |
| US5997997A (en) * | 1997-06-13 | 1999-12-07 | International Business Machines Corp. | Method for reducing seed deposition in electroless plating |
| US6265075B1 (en) | 1999-07-20 | 2001-07-24 | International Business Machines Corporation | Circuitized semiconductor structure and method for producing such |
| SG107593A1 (en) * | 2002-06-04 | 2004-12-29 | Agency Science Tech & Res | Method for electroless metalisation of polymer substrate |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
| GB1304387A (enExample) * | 1970-08-10 | 1973-01-24 | ||
| US3798050A (en) * | 1971-05-28 | 1974-03-19 | Ppg Industries Inc | Catalytic sensitization of substrates for metallization |
| US4187198A (en) * | 1972-08-07 | 1980-02-05 | Kollmorgen Technologies Corp. | Novel precious metal sensitizing solutions |
| US4020009A (en) * | 1975-09-30 | 1977-04-26 | Shipley Company, Inc. | Catalyst composition and method of preparation |
| DE2743768C3 (de) * | 1977-09-29 | 1980-11-13 | Bayer Ag, 5090 Leverkusen | Metallisiertes Textilmaterial |
| US4600699A (en) * | 1983-02-14 | 1986-07-15 | Enthone, Incorporated | Reclamation of a palladium-tin based electroless plating catalyst from the exhausted catalyst solution and accompanying rinse waters |
| JPS59155602A (ja) * | 1983-02-25 | 1984-09-04 | Sumitomo Heavy Ind Ltd | エヤシリンダの速度調整装置 |
-
1985
- 1985-10-29 US US06/792,425 patent/US4640718A/en not_active Expired - Fee Related
-
1986
- 1986-09-19 JP JP61219909A patent/JPS62247078A/ja active Granted
- 1986-10-03 EP EP86113667A patent/EP0221359B1/en not_active Expired
- 1986-10-03 DE DE8686113667T patent/DE3664646D1/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US4640718A (en) | 1987-02-03 |
| EP0221359A1 (en) | 1987-05-13 |
| EP0221359B1 (en) | 1989-07-26 |
| DE3664646D1 (en) | 1989-08-31 |
| JPH0160549B2 (enExample) | 1989-12-22 |
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