DE3664646D1 - A process for accelerating pd/sn seeds for electroless copper plating - Google Patents

A process for accelerating pd/sn seeds for electroless copper plating

Info

Publication number
DE3664646D1
DE3664646D1 DE8686113667T DE3664646T DE3664646D1 DE 3664646 D1 DE3664646 D1 DE 3664646D1 DE 8686113667 T DE8686113667 T DE 8686113667T DE 3664646 T DE3664646 T DE 3664646T DE 3664646 D1 DE3664646 D1 DE 3664646D1
Authority
DE
Germany
Prior art keywords
seeds
accelerating
copper plating
electroless copper
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8686113667T
Other languages
German (de)
English (en)
Inventor
Patrick Rene Alnot
Daniel Jonathan Auerbach
Christopher Richard Brundle
Dolores Carlotta Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3664646D1 publication Critical patent/DE3664646D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE8686113667T 1985-10-29 1986-10-03 A process for accelerating pd/sn seeds for electroless copper plating Expired DE3664646D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/792,425 US4640718A (en) 1985-10-29 1985-10-29 Process for accelerating Pd/Sn seeds for electroless copper plating

Publications (1)

Publication Number Publication Date
DE3664646D1 true DE3664646D1 (en) 1989-08-31

Family

ID=25156853

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686113667T Expired DE3664646D1 (en) 1985-10-29 1986-10-03 A process for accelerating pd/sn seeds for electroless copper plating

Country Status (4)

Country Link
US (1) US4640718A (enExample)
EP (1) EP0221359B1 (enExample)
JP (1) JPS62247078A (enExample)
DE (1) DE3664646D1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4948707A (en) * 1988-02-16 1990-08-14 International Business Machines Corporation Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon
US4818286A (en) * 1988-03-08 1989-04-04 International Business Machines Corporation Electroless copper plating bath
FR2726205B1 (fr) * 1994-10-28 1997-09-26 Motorola Inc Procede destine a reduire le temps de demarrage dans un bain autocatalytique
US6207351B1 (en) 1995-06-07 2001-03-27 International Business Machines Corporation Method for pattern seeding and plating of high density printed circuit boards
US5997997A (en) * 1997-06-13 1999-12-07 International Business Machines Corp. Method for reducing seed deposition in electroless plating
US6265075B1 (en) 1999-07-20 2001-07-24 International Business Machines Corporation Circuitized semiconductor structure and method for producing such
SG107593A1 (en) * 2002-06-04 2004-12-29 Agency Science Tech & Res Method for electroless metalisation of polymer substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
GB1304387A (enExample) * 1970-08-10 1973-01-24
US3798050A (en) * 1971-05-28 1974-03-19 Ppg Industries Inc Catalytic sensitization of substrates for metallization
US4187198A (en) * 1972-08-07 1980-02-05 Kollmorgen Technologies Corp. Novel precious metal sensitizing solutions
US4020009A (en) * 1975-09-30 1977-04-26 Shipley Company, Inc. Catalyst composition and method of preparation
DE2743768C3 (de) * 1977-09-29 1980-11-13 Bayer Ag, 5090 Leverkusen Metallisiertes Textilmaterial
US4600699A (en) * 1983-02-14 1986-07-15 Enthone, Incorporated Reclamation of a palladium-tin based electroless plating catalyst from the exhausted catalyst solution and accompanying rinse waters
JPS59155602A (ja) * 1983-02-25 1984-09-04 Sumitomo Heavy Ind Ltd エヤシリンダの速度調整装置

Also Published As

Publication number Publication date
JPS62247078A (ja) 1987-10-28
US4640718A (en) 1987-02-03
JPH0160549B2 (enExample) 1989-12-22
EP0221359A1 (en) 1987-05-13
EP0221359B1 (en) 1989-07-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee