JPS62247041A - Copper alloy having superior migration resistance - Google Patents
Copper alloy having superior migration resistanceInfo
- Publication number
- JPS62247041A JPS62247041A JP8968886A JP8968886A JPS62247041A JP S62247041 A JPS62247041 A JP S62247041A JP 8968886 A JP8968886 A JP 8968886A JP 8968886 A JP8968886 A JP 8968886A JP S62247041 A JPS62247041 A JP S62247041A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- migration resistance
- copper alloy
- migration
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005012 migration Effects 0.000 title claims abstract description 28
- 238000013508 migration Methods 0.000 title claims abstract description 28
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 12
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract 3
- 239000010949 copper Substances 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 20
- 239000000956 alloy Substances 0.000 abstract description 20
- 229910052718 tin Inorganic materials 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 150000002500 ions Chemical class 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- 229910001369 Brass Inorganic materials 0.000 description 6
- 239000010951 brass Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229910018100 Ni-Sn Inorganic materials 0.000 description 5
- 229910018532 Ni—Sn Inorganic materials 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は耐マイグレーション性に優れた銅合金に係り、
特に 高密度実装化が要求される個別半導体（ダイオー
ド、トランジスタ、ＦＥＴ等）用リードフレーム、集積
回路用リードフレーム、抵抗器リード、コンデンサーリ
ード及び機構部品（端子、コネクター）材料に関するも
のである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a copper alloy with excellent migration resistance.
In particular, it relates to lead frames for individual semiconductors (diodes, transistors, FETs, etc.) that require high-density packaging, lead frames for integrated circuits, resistor leads, capacitor leads, and materials for mechanical parts (terminals, connectors).
［従来の技術］ ゛
近年、電気・電子部品は軽薄短小化のニーズに伴ない、
急速に小型化、高密度実装化が進み、！ｊ８積回路、抵
抗器、端子及びコネクター等は電極数が増加し、しかも
その電極間ピッチも１／ｌＯインチ（，２、５４ｍｍ）
から１７２０インチ（１，２７ｍｍ）、１／３０インチ
（０，８４７ｍｍ）へと小さくなりつつある。[Conventional technology] In recent years, electric and electronic components have become lighter, thinner, and smaller.
Rapid miniaturization and high-density packaging are progressing! The number of electrodes has increased for j8 product circuits, resistors, terminals, connectors, etc., and the pitch between the electrodes has also increased to 1/10 inch (2, 54 mm).
It is becoming smaller from 1,720 inches (1,27 mm) to 1/30 inch (0,847 mm).
電気・電子部品の電極間ピッチが小さくなると、湿気の
結露や水分の侵入によって電極間に水分が付着すること
があり、マイグレーシコンを生じることが少なくない。When the pitch between the electrodes of electrical/electronic components becomes smaller, moisture may adhere between the electrodes due to condensation or intrusion of moisture, often resulting in migration migration.
この「マイグレーション」とは、水分の付着した部分に
銅イオンが溶出し、この溶出した銅イオンが電極間電位
で還元されて金Ｅｍとして析出することになり、更にか
かる溶出・還元・析出という現象が綴り返えして生じる
ことによって結果的に析出銅全屈の部品が陰極から成長
して陽極まで達する現象をいう。This "migration" is a phenomenon in which copper ions are eluted into areas where moisture has adhered, and the eluted copper ions are reduced at the potential between the electrodes and precipitated as gold Em, and further elution, reduction, and precipitation occur. This refers to a phenomenon in which a precipitated copper component grows from the cathode and reaches the anode as a result of the reversal of the precipitated copper.
そして、マイグレーションが生じると陰極と陽極が短絡
して、′ｉ！気・電子回路が正常に作動しないこととな
り、更に部品を破損することもある。When migration occurs, the cathode and anode are short-circuited, and 'i! The air/electronic circuits will not work properly and may even damage parts.
従って、個別半導体用リードフレーム等の素材として耐
マイグレーション性の優れた銅合金が要望されている。Therefore, a copper alloy with excellent migration resistance is desired as a material for lead frames for individual semiconductors and the like.
［発明が解決しようとする問題点］
ところで、前記の個別半導体用リードフレーム等にはＣ
ｕ−９％Ｎ ｉ −２、３％ Ｓ ｎを代表とするＣｕ
−Ｎｉ−Ｓｎ合金が使用されることが多いが、結露する
環境下ではマイグレーションを生じる恐れがある。[Problems to be solved by the invention] By the way, the above-mentioned lead frames for individual semiconductors, etc.
Cu represented by u-9%Ni-2, 3%Sn
-Ni-Sn alloy is often used, but there is a risk of migration occurring in an environment with dew condensation.
一方、黄銅はマイグレーションを生じ難いことが判明し
ているが、応力腐食割れを生じるという致命的な欠陥を
有しているためその用途には不適当である。On the other hand, although it has been found that brass is less likely to cause migration, it is unsuitable for this use because it has a fatal defect of causing stress corrosion cracking.
そこで、本発明はＣｕ−Ｎｉ−Ｓｎ合金の特性を劣化さ
せることなく、黄銅と同等の耐マイグレーション性を備
えた合金を得ることを目的として創作された。Therefore, the present invention was created with the aim of obtaining an alloy having migration resistance equivalent to that of brass without deteriorating the properties of the Cu-Ni-Sn alloy.
［問題点を解決するための手段］
本発明は、ｆｆｉ量％で、Ｓｎ：０．５〜６．０％、Ｎ
ｉ：３．Ｏ〜１５．０％、Ｚｎ：１．５〜５．０％を含
有し、残部が実質的にＣｕ及び不純物からなることを特
徴とする耐マイグレーション性に優れた銅合金に係る。[Means for solving the problems] The present invention provides ffi amount% of Sn: 0.5 to 6.0%, N
i:3. The present invention relates to a copper alloy having excellent migration resistance, which is characterized by containing O~15.0%, Zn: 1.5~5.0%, and the remainder consisting essentially of Cu and impurities.
［作用］
本発明の銅合金の含有成分及びその成分割合を限定した
理由について説明する。[Function] The components contained in the copper alloy of the present invention and the reason for limiting the component ratio will be explained.
Ｓｎ：
この元素は強度、ばね特性及び伸び等を同時に向上させ
るために必須であり、０．５％未満ではその効果が少な
く、一方、６．０％を越えると効果的ではあるが、従来
の連鋳技術では造塊が困難になり、更に熱間割れを生じ
やすくなる。電磁攪拌装置を備えた連ｎ装置を適用する
と熱間加工性も向上するが、この場合のＳｎ含有料の上
限も６．０％である。従って、Ｓｎの含有割合は０．５
〜６．０％とした。Sn: This element is essential for simultaneously improving strength, spring properties, elongation, etc. If it is less than 0.5%, the effect is small, while if it exceeds 6.0%, it is effective, but Continuous casting technology makes it difficult to form ingots and also makes hot cracking more likely. Hot workability is also improved when a continuous device equipped with an electromagnetic stirring device is used, but the upper limit of the Sn content in this case is also 6.0%. Therefore, the content ratio of Sn is 0.5
~6.0%.
Ｎｌ： この元素はＣｕに固溶し、Ｓｎと共に強度。Nl: This element dissolves in Cu and provides strength along with Sn.
伸び及び耐熱性を向上させる効果を有する。It has the effect of improving elongation and heat resistance.
３．０％未満ではこれらの特性の向上効果が少なぐ、一
方、１５．０％を越えるとこれらの特性の向上効果はあ
るが、Ｓｎと同様に熱間加工性を低下させることになる
。従って、Ｎｉの含有割合は３．０〜１５．０％とした
。If it is less than 3.0%, the effect of improving these properties will be small, while if it exceeds 15.0%, there will be an effect of improving these properties, but like Sn, it will reduce hot workability. Therefore, the Ni content was set to 3.0 to 15.0%.
Ｚｎ：
この元素は電圧が印加されたＣｕ−ＭＬ−Ｓｎ合金の電
極間に水が侵入した場合のＣｕのマイグレーションの形
成を抑え、漏洩電流を抑制するために必須であり、Ｚｎ
が１．５％未満では効果が少なく、一方、５．０％を越
えると耐マイグレーション性は向上するが、はんだ付は
性が劣化する。応力腐食割れを生じやすくなる等の性質
が現われ、Ｃｕ−Ｎｉ−Ｓｎ合金の本来的長所が失われ
ることになる。従って、Ｚｎの含＊側合は１．５〜５．
０％とした。Zn: This element is essential for suppressing the formation of Cu migration and suppressing leakage current when water enters between the electrodes of the Cu-ML-Sn alloy to which a voltage is applied.
If it is less than 1.5%, the effect will be small, while if it exceeds 5.0%, the migration resistance will improve, but the soldering properties will deteriorate. Properties such as stress corrosion cracking are likely to occur, and the original advantages of the Cu-Ni-Sn alloy are lost. Therefore, the * side combination of Zn is 1.5 to 5.
It was set to 0%.
その他： 上記の必須成分元素の他にＢｅ、Ｂ、Ｍｇ。others: In addition to the above essential elements, Be, B, and Mg.
ＡＩ 、Ｐ、Ｓｔ 、Ｔｉ 、Ｃｒ、Ｍｎ、Ｇｏ
、Ｚｒ、Ａｇ、Ｉｎ及びｓｂの内の一種または二種以上
を総量で０．１％以下で添加しても耐マイグレーション
性を劣化することがないため、これを許容することがで
きる。AI, P, St, Ti, Cr, Mn, Go
, Zr, Ag, In, and sb in a total amount of 0.1% or less, the migration resistance is not deteriorated, so this can be tolerated.
［実施例］
次に本発明の耐マイグレーション性に優れた銅合金の実
施例について図面及び表を用いて説明する。[Example] Next, an example of the copper alloy having excellent migration resistance of the present invention will be described using drawings and tables.
第１表に示す含有成分及び成分割合の銅合金をクリプト
ル炉において大気中で木炭被覆下に溶解し、傾注式の鋳
鉄製ブックモールドに鋳込み、厚さ８０ｍｍ、幅６０
ｍ ｍ 、長さ１８０ｍｍの鋳塊を製造した。A copper alloy having the components and proportions shown in Table 1 was melted in the air in a Kryptor furnace under charcoal coating, and cast into a tilting cast iron book mold to a thickness of 80 mm and a width of 60 mm.
An ingot with a length of 180 mm and a length of 180 mm was produced.
そして、これらの鋳塊の表面及び裏面を各々２−５ｍｍ
面削し、黄銅は７５０℃１本発明合金及び比較合金は８
８０℃の温度で熱間圧延を行ない、厚さ１０ｍｍの板材
とした。Then, the front and back sides of these ingots were each 2-5 mm thick.
Face milled at 750°C for brass and 8°C for alloys of the present invention and comparative alloys.
Hot rolling was performed at a temperature of 80° C. to obtain a plate material with a thickness of 10 mm.
これら熱間圧延材の表面の酸化スケールを除去した後、
冷間にて厚さ１．１１ｍｍまで圧延し、黄銅は４３０″
０Ｘ２Ｈｒ、本発明合金及び比較合金は６００℃Ｘ２Ｈ
ｒの焼鈍を行ない。After removing the oxide scale on the surface of these hot rolled materials,
Cold rolled to a thickness of 1.11mm, brass is 430"
0X2Hr, the invention alloy and comparative alloy are 600℃X2H
Perform r annealing.
スケールを酸洗により除去後、１．０ｍｍまで冷間で圧
延した。After removing scale by pickling, it was cold rolled to a thickness of 1.0 mm.
そして、これらの板材を用いて以下の試験を行なった。Then, the following tests were conducted using these plate materials.
尚、第１表においてＮｏ、１−Ｎｏ、３は本発明の実施
例に係る合金であり。In Table 1, No., 1-No., and 3 are alloys according to Examples of the present invention.
Ｎｏ、４〜Ｎ００６は比較例に係る合金である。No. 4 to No. 006 are alloys according to comparative examples.
（耐マイグレーシヨン試験）
耐マイグレーシヨン試験については％ １４Ｖの直流電
圧を印加した時の最大漏洩電流値をもって判断基準とし
た。(Migration Resistance Test) For the migration resistance test, the maximum leakage current value when a DC voltage of 14 V was applied was used as the criterion.
以下にその詳細を述べる。The details are described below.
第１図及び第２図に示すように、二枚の板状の試験片１
ａ、ｌｂ （平行部ｔｖ＠ ５ ｍ ｍ） ｔｌ）間に
１ｍｍ厚のＡＢＳ樹脂板２を介装し、試験片ｌａ、ｌｂ
の両端をそれぞれ二枚の押え板３で挟装し、更に６押え
板３をクリップ４で押圧して積層状懲を固定した。但し
、ＡＢＳ樹脂板２の中央部には孔２ａが設けられており
、ａ層状態において孔２ａを介して二枚の試験片１ａ。As shown in Figures 1 and 2, two plate-shaped test pieces 1
a, lb (parallel part tv @ 5 mm) tl) A 1 mm thick ABS resin plate 2 was inserted between the specimens la, lb.
Both ends of the laminate were sandwiched between two holding plates 3, and the six holding plates 3 were further pressed with clips 4 to fix the laminated structure. However, a hole 2a is provided in the center of the ABS resin plate 2, and two test pieces 1a are inserted through the hole 2a in the A-layer state.
１ｂの面が対向するようになっている。そして、バッテ
リー５から試験片１ａが陰極に、試験片１ｂが陽極にな
るように１４Ｖの直流電圧を印加するように結線した。The surfaces of 1b are arranged to face each other. Then, the battery 5 was connected to the battery 5 so that a DC voltage of 14 V was applied to the test piece 1a as a cathode and the test piece 1b as an anode.
この状態におかれたものを水道水に１０分間浸漬した後
、１０分間乾燥するという乾湿試験を行ない、５０サイ
クルに至るまでの０．２秒間当りの最大漏洩電流値をメ
モリーハイコーダー８８０２ （日量電機製）（図示せ
ず）で測定した。即ち、孔２ａにおけるマイグレーショ
ンの発生状況を前記電流値を比較検討することによって
調べることとした。A dry-wet test was carried out by immersing the device in this state in tap water for 10 minutes and then drying it for 10 minutes. (manufactured by Ryōdenki Co., Ltd.) (not shown). That is, it was decided to investigate the occurrence of migration in the hole 2a by comparing and examining the above-mentioned current values.
この結果は第２表に示される。The results are shown in Table 2.
同表から明らかなように、本発明の実施例である合金（
Ｎｏ 、１〜Ｎｏ −３）は、Ｚｎ含有量の少ない比較
合金（Ｎｏ、５及びＮｏ、６）に比較して漏洩電流が０
．１〜０．２Ａとなり、黄銅（比較合金Ｎｏ、７）なみ
であり、耐マイグレーション性に優れている。As is clear from the table, alloys (
No. 1 to No.-3) have a leakage current of 0 compared to comparative alloys with low Zn content (No. 5 and No. 6).
．． 1 to 0.2 A, which is comparable to that of brass (comparative alloy No. 7), and has excellent migration resistance.
尚、木実゛°施例では漏洩電流測定用の印加電圧を１４
Ｖとしたが、一般の１００Ｖの交流電圧を印加しても同
様の定性的結果を示し、交流回路に適用することも可能
である。In addition, in the Kinomi Example, the applied voltage for leakage current measurement was set to 14
Although the voltage is set to V, similar qualitative results are obtained even when a general AC voltage of 100 V is applied, and it is also possible to apply it to an AC circuit.
（はんだ濡れ性）
第１表に示す組成の合金により、厚さ１ｍｍ１幅２５
ｍｍ、長さ５０ｍｍの試験片を製造し、２３０℃の６０
Ｓｎ−４０Ｐｂの共晶はんだ中にＭＩＬ−５ＴＤ−２０
２Ｅの２０８Ｃに基づき１、弱活性のフラックスＭＩＬ
−Ｆ−１４２５６ＨＭＡタイプではんだの濡れ性を調べ
た。(Solder wettability) The alloy with the composition shown in Table 1 has a thickness of 1 mm and a width of 25 mm.
A test piece with a length of 50 mm and a length of 50 mm was manufactured and
MIL-5TD-20 in Sn-40Pb eutectic solder
1, weakly active flux MIL based on 2E's 208C
- Solder wettability was investigated using the F-14256HMA type.
その結果は前記の（耐マイグレーシヨン試験）と並列さ
せて第２表に示される。The results are shown in Table 2 in parallel with the above (migration resistance test).
同表から、本発明の実施例に係る合金は、Ｓｎ及びＮｌ
の含有量が同程度で、Ｚｎ含有量が異なる比較合金Ｎ０
０６に比較してはんだ濡れ性が優れていることが理解で
きる。From the same table, the alloys according to the examples of the present invention are Sn and Nl.
Comparative alloys N0 with similar Zn contents and different Zn contents
It can be seen that the solder wettability is superior to that of 06.
［発明の効果］
以上のように、従来ａ） Ｃ、ｕ −９％Ｎｉ−２゜３
％Ｓｎを代表組成とするＣｕ−Ｎｉ−Ｓｎ合金が結露し
た場合にマイグレーションによる不具合を生じる状況に
あるのに対し、本発明の銅合金は結露してもマイグレー
ションを生じ難い。[Effect of the invention] As described above, conventional a) C, u -9%Ni-2゜3
While a Cu-Ni-Sn alloy having a typical composition of %Sn is in a situation where problems due to migration occur when dew condenses, the copper alloy of the present invention hardly causes migration even when dew condenses.
従って、本発明は、ばね特性、はんだ濡れ性等のＣｕ−
Ｎｉ−Ｓｎ合金特有の特性を劣化させることなく、黄銅
と同等の耐マイグレーション性を具有したＣ ｕ −Ｎ
Ｉ −Ｓ ｎ合金を得ることを可能とした。Therefore, the present invention improves the spring properties, solder wettability, etc. of Cu-
Cu-N has migration resistance equivalent to brass without deteriorating the characteristics unique to Ni-Sn alloy.
This made it possible to obtain an I-S n alloy.
本発明の耐マイグレーション性に優れた銅合金は１個別
半導体用リードフレーム、集積回路用リードフレーム、
抵抗器リード、コンデンサーリード及び機構部品の材料
として最適であり、その他の民生用、産業用または自動
車等の電気・電子部品材料としても好適のものである。The copper alloy with excellent migration resistance of the present invention can be used for lead frames for individual semiconductors, lead frames for integrated circuits,
It is most suitable as a material for resistor leads, capacitor leads, and mechanical parts, and is also suitable as a material for other electrical and electronic parts for consumer use, industrial use, and automobiles.
第１表 ｍ２表 良好：９５〜１００％濡れ やや不良：５０〜９５％濡れ 不良＝５０％未満の濡れTable 1 m2 table Good: 95-100% wet Slightly poor: 50-95% wet Poor = less than 50% wet
第１図及び第２図は耐マイグレーシヨン試験における試
験片の積層状態及び電気的結線状態を示す平面図及び側
面図である。（但し、第２図は第１図におけるｘ−ｘ矢
視断面を含む、）ｌａ、ｌｂ・・・試験片 ２・・・Ａ
ＢＳ樹脂板 ２ａ孔 ３・・・押え板 ４・・・クリッ
プ ５・・・バッテリーFIGS. 1 and 2 are a plan view and a side view showing the laminated state and electrical connection state of test pieces in a migration resistance test. (However, FIG. 2 includes the cross section taken along the line xx in FIG. 1.) la, lb...Test piece 2...A
BS resin plate 2a hole 3... Holding plate 4... Clip 5... Battery
Claims (1)
を特徴とする耐マイグレーション性に優れた銅合金。[Claims] Contains Sn: 0.5 to 6.0%, Ni: 3.0 to 15.0%, Zn: 1.5 to 5.0%, and the balance is substantially Cu. A copper alloy with excellent migration resistance characterized by consisting of impurities and impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8968886A JPS62247041A (en) | 1986-04-18 | 1986-04-18 | Copper alloy having superior migration resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8968886A JPS62247041A (en) | 1986-04-18 | 1986-04-18 | Copper alloy having superior migration resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62247041A true JPS62247041A (en) | 1987-10-28 |
Family
ID=13977703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8968886A Pending JPS62247041A (en) | 1986-04-18 | 1986-04-18 | Copper alloy having superior migration resistance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62247041A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108796297A (en) * | 2017-07-28 | 2018-11-13 | 中南大学 | A kind of high-intensity and high-tenacity adonic raw material and its preparation method and application being directly used in 3D printing |
| CN111826547A (en) * | 2020-07-13 | 2020-10-27 | 苏州金江铜业有限公司 | Copper-nickel-tin-silver-boron alloy and preparation method thereof |
-
1986
- 1986-04-18 JP JP8968886A patent/JPS62247041A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108796297A (en) * | 2017-07-28 | 2018-11-13 | 中南大学 | A kind of high-intensity and high-tenacity adonic raw material and its preparation method and application being directly used in 3D printing |
| CN108796297B (en) * | 2017-07-28 | 2020-09-29 | 中南大学 | High-strength high-toughness copper-nickel-tin alloy raw material directly used for 3D printing and preparation method and application thereof |
| CN111826547A (en) * | 2020-07-13 | 2020-10-27 | 苏州金江铜业有限公司 | Copper-nickel-tin-silver-boron alloy and preparation method thereof |
| CN111826547B (en) * | 2020-07-13 | 2021-09-17 | 苏州金江铜业有限公司 | Copper-nickel-tin-silver-boron alloy and preparation method thereof |
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