JPS62244637A - 積層板の連続製造方法 - Google Patents

積層板の連続製造方法

Info

Publication number
JPS62244637A
JPS62244637A JP61088679A JP8867986A JPS62244637A JP S62244637 A JPS62244637 A JP S62244637A JP 61088679 A JP61088679 A JP 61088679A JP 8867986 A JP8867986 A JP 8867986A JP S62244637 A JPS62244637 A JP S62244637A
Authority
JP
Japan
Prior art keywords
laminate
carrier sheet
sheet
base materials
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61088679A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0557893B2 (enExample
Inventor
博康 古川
誠一 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP61088679A priority Critical patent/JPS62244637A/ja
Publication of JPS62244637A publication Critical patent/JPS62244637A/ja
Publication of JPH0557893B2 publication Critical patent/JPH0557893B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
JP61088679A 1986-04-16 1986-04-16 積層板の連続製造方法 Granted JPS62244637A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61088679A JPS62244637A (ja) 1986-04-16 1986-04-16 積層板の連続製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61088679A JPS62244637A (ja) 1986-04-16 1986-04-16 積層板の連続製造方法

Publications (2)

Publication Number Publication Date
JPS62244637A true JPS62244637A (ja) 1987-10-26
JPH0557893B2 JPH0557893B2 (enExample) 1993-08-25

Family

ID=13949515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61088679A Granted JPS62244637A (ja) 1986-04-16 1986-04-16 積層板の連続製造方法

Country Status (1)

Country Link
JP (1) JPS62244637A (enExample)

Also Published As

Publication number Publication date
JPH0557893B2 (enExample) 1993-08-25

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