JPS62238026A - Manufacture of heat sink - Google Patents
Manufacture of heat sinkInfo
- Publication number
- JPS62238026A JPS62238026A JP8077686A JP8077686A JPS62238026A JP S62238026 A JPS62238026 A JP S62238026A JP 8077686 A JP8077686 A JP 8077686A JP 8077686 A JP8077686 A JP 8077686A JP S62238026 A JPS62238026 A JP S62238026A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- copper plate
- die
- press
- bottom face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- 238000004080 punching Methods 0.000 claims abstract description 4
- 238000009423 ventilation Methods 0.000 claims description 9
- 239000004570 mortar (masonry) Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Punching Or Piercing (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明はヒートシンクの製造方法、特に混成集積回路に
組み込むパワートランジスタの固着に用いるヒートシン
クの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a method of manufacturing a heat sink, and more particularly to a method of manufacturing a heat sink used for fixing a power transistor incorporated in a hybrid integrated circuit.
（ロ）従来の技術
従来のヒートシンクの製造方法は、第３図Ａに示す如く
、長手状の銅板（１１）を下金型（１２）上へ所定ピッ
チづつ送り出してプレス金型（１３）でプレスを行ない
ヒートシンクを製造していた。しかしながら斯上した方
法では銅板（１１）表面に付着する油（１４）がプレス
時にプレス金型（１３）と銅板（１１）との間に介在す
るために上記した製造方法では第３図Ｂに示す様なヒー
トシンク（１５）の表面が凹部（１６〉に形成される。(B) Prior art As shown in FIG. 3A, the conventional method for manufacturing a heat sink involves feeding a longitudinal copper plate (11) onto a lower mold (12) at a predetermined pitch and placing it in a press mold (13). They used presses to manufacture heat sinks. However, in the above method, oil (14) adhering to the surface of the copper plate (11) is interposed between the press die (13) and the copper plate (11) during pressing, so the above manufacturing method does not produce the same results as shown in Fig. 3B. The surface of the heat sink (15) as shown is formed in the recess (16>).
ヒートシンク（１５）の表面が四部（１６）に形成きれ
ると、そのヒートシンク（１５〉上にチブトランジスタ
を半田固着する工程において、ヒートシンク（１５）が
高温に加熱され、ヒートシンク（１５）上に付着された
ハンダが溶けた際に表面が凹部状に形成されているとハ
ンダが表面張力の関係でヒートシンク（１５）の周辺に
移動して中央部にハンダが付着しない問題があった。When the surface of the heat sink (15) has been formed into four parts (16), the heat sink (15) is heated to a high temperature in the process of soldering the chip transistor onto the heat sink (15), and the heat sink (15) is adhered onto the heat sink (15). When the solder melts, if the surface is formed in a concave shape, there is a problem that the solder moves to the periphery of the heat sink (15) due to surface tension, and the solder does not adhere to the center part.
斯上した欠点を除去するために第４図Ａに示す如く、プ
レス金型（１３）に通気孔（１７〉を設けることを発明
した。これによれば銅板（１１）上に付着する油はプレ
ス時に通気孔（１７）から外に出るため、第４図Ｂの様
な表面がフラットなヒートシンク（１８）が製造でき、
斯上した欠点を解決できる。In order to eliminate the above-mentioned drawbacks, we invented a method of providing a vent hole (17) in the press mold (13) as shown in Figure 4A. According to this, the oil adhering to the copper plate (11) can be removed. Since the heat sink (18) comes out through the ventilation hole (17) during pressing, it is possible to manufacture a heat sink (18) with a flat surface as shown in Figure 4B.
The above drawbacks can be resolved.
上述した同様の技術は特開昭６０−２１６５７２号公報
に記載されている。A technique similar to that described above is described in Japanese Patent Application Laid-Open No. 60-216572.
くハ）発明が解決しようとする問題点
しかしながら、斯上した通気孔（１７）を有するブレス
金型（１３）を用いてヒートシンクを製造する場合、銅
板（１１）がリール等に巻かれ、そこから供給きれるの
で必らずしも反りの無い銅板（１１）が供給されず、第
５図Ａに示す如く、反った銅板（１１）が供給される。C) Problems to be Solved by the Invention However, when manufacturing a heat sink using the above-mentioned breath mold (13) having the ventilation holes (17), the copper plate (11) is wound around a reel or the like. Since the copper plate (11) is not necessarily supplied without warping, a warped copper plate (11) is supplied as shown in FIG. 5A.
すると通気孔（１７）の先端部（２１）が先に銅板（１
１）と接触し、第５図Ｂに示す如く、通気孔（１７）の
径口内に銅板（１１）が圧入され、完成されたヒートシ
ンク（１９）は第５図Ｃに示す如く、表面に突起部（２
０〉が形成され、チップトランジスタを固着する際、そ
の突起部（２０）が妨げとなりチップトランジスタが固
着できない欠点を有していた。Then, the tip (21) of the ventilation hole (17) first touches the copper plate (1).
1), the copper plate (11) is press-fitted into the diameter of the ventilation hole (17) as shown in Figure 5B, and the completed heat sink (19) has a protrusion on the surface as shown in Figure 5C. Part (2
0> is formed, and when the chip transistor is fixed, the protrusion (20) becomes an obstacle and has the disadvantage that the chip transistor cannot be fixed.
（ニ）問題点を解決するための手段
本発明は上述した点に鑑みてなされたものであり、第１
図Ａ乃至第１図Ｂに示す如く、プレス金型（４）の底面
を皿鉢状に形成して解決するものである。(d) Means for solving the problems The present invention has been made in view of the above-mentioned points.
This problem is solved by forming the bottom of the press mold (4) into a saucer shape, as shown in Figures A to 1B.
（＊）作用
この様にプレス金型（４）の底面を皿鉢状に形成してプ
レス打抜きすることにより、通気孔（３）の先端がプレ
ス金型（４）の底面側辺部（５〉より内側に窪んで形成
されるのでプレス時にプレス金型（４）の底面が先に接
触するので表面がふくれ上った形状のヒートシンク（６
〉が形成できる。(*) Function By forming the bottom of the press mold (4) into a saucer shape and press punching in this way, the tip of the ventilation hole (3) is located at the bottom side (5) of the press mold (4). Since the heat sink (6) is recessed inward, the bottom surface of the press mold (4) comes into contact with it first during pressing, resulting in a swollen surface.
> can be formed.
（へ）実施例
以下に本発明を第１図Ａ乃至第１図Ｃに示した実施例に
基づいて詳細に説明する。(f) Example The present invention will be explained in detail below based on the example shown in FIG. 1A to FIG. 1C.
第１図Ａに示す如く、長手状の銅板（１）を下金型（２
〉上に配置する。銅板（１）は例えば巾１３ｍ、厚さ３
ｎｎでリール等に所定の長さだけ巻かれており、そこか
ら所定ピッチづつ下金型（２〉上へ送り出される。従っ
て反った銅板（１）が供給される。As shown in Figure 1A, a longitudinal copper plate (1) is placed in the lower mold (2).
> Place it on top. For example, the copper plate (1) has a width of 13 m and a thickness of 3 m.
The copper plate (1) is wound on a reel or the like to a predetermined length, and is sent out onto the lower mold (2) at a predetermined pitch from there.Therefore, a warped copper plate (1) is supplied.
次に第１図Ｂに示す如く、通気孔（３）を有するプレス
金型（４）でプレスを行う。本工程は本発明の最も特徴
とする点であり、プレス金型（４）の底面を皿鉢状に形
成している。そうすると反った銅板（１）が供給されて
もプレス金型（４）の底面が皿鉢状となっているために
通気孔（４）が底面側辺部（５）より窪んで形成され、
プレス時に底面側辺部（５）の方が先に接触するので第
１図Ｃに示す様な表面かもり上ったヒートシンク（６）
が製造できる。皿鉢状の寸法は第２図に示す値からｄ０
≧ｔ、ｄ、≧％ｔ、α≦３０゛の夫々の条件が全て満足
していれば十分である。Next, as shown in FIG. 1B, pressing is performed using a press mold (4) having ventilation holes (3). This step is the most characteristic feature of the present invention, and the bottom surface of the press mold (4) is formed into a saucer shape. Then, even if a warped copper plate (1) is supplied, since the bottom of the press die (4) is shaped like a saucer, the ventilation hole (4) will be recessed from the bottom side (5).
During pressing, the bottom sides (5) come into contact first, so the heat sink (6) has a raised surface as shown in Figure 1C.
can be manufactured. The dimensions of the dish bowl shape are d0 from the values shown in Figure 2.
It is sufficient that the following conditions are all satisfied: ≧t, d, ≧%t, and α≦30゛.
斯る本発明に依ればプレス金型（４）の底面を皿鉢状と
することにより、反った銅板（１）が供給きれても従来
の様な突起部が形成されないヒートシンク（６）を形成
することができ、チップトランジスタを固着するのに最
適なヒートシンク（６）を量産できる。According to the present invention, by making the bottom surface of the press mold (4) into a saucer-like shape, the heat sink (6) is not formed with protrusions like the conventional one even if the warped copper plate (1) is completely supplied. It is possible to mass-produce a heat sink (6) that is optimal for fixing chip transistors.
（ト）発明の効果
上述の如く本発明によれば、プレス金型の底面を皿鉢状
にすることにより、従来通気孔によって発生してた突起
部を形成すること無く製造が行え、チップトランジスタ
の固着に最適なヒートシンクを量産できる。また銅板の
反りよりも皿鉢状を深く形成しておけばどんなに反った
銅板でも最適なヒートシンクを量産できる。(G) Effects of the Invention As described above, according to the present invention, by making the bottom of the press mold into a saucer shape, it is possible to manufacture chip transistors without forming protrusions that conventionally occur due to ventilation holes. We can mass-produce heat sinks that are ideal for fixing. Furthermore, if the bowl shape is formed deeper than the warpage of the copper plate, an optimal heat sink can be mass-produced no matter how warped the copper plate is.
第１図Ａ乃至第１図Ｃは本発明の実施例を示す断面図、
第２図は本実施例の断面図、第３図Ａ乃至第３図Ｂ、第
４図Ａ乃至第４図Ｂおよび第５図Ａ乃至第５図Ｃは従来
例を示す断面図である。
（１）・・・銅板、 （２）・・・下金型、 （３）・
・・通気孔、（４）・・・プレス金型、 （５）・・・
底面側辺部、 （６）・・・ヒートシンク。
出願人 三洋電機株式会社外１名
代理人 弁理士 西野卓嗣 外１名
第１図Ａ
第１ 図 Ｂ
第１１ＺＣ
第２図
笥３図 Ａ
＠３図Ｂ
４１ＩＳ４図Ａ1A to 1C are cross-sectional views showing embodiments of the present invention,
FIG. 2 is a sectional view of this embodiment, and FIGS. 3A to 3B, 4A to 4B, and 5A to 5C are sectional views of the conventional example. (1)...Copper plate, (2)...Lower mold, (3)...
...Vent hole, (4)...Press mold, (5)...
Bottom side, (6)...Heat sink. Applicant Sanyo Electric Co., Ltd. and one other agent Patent attorney Takuji Nishino and one other person Figure 1 A Figure 1 B Figure 11ZC Figure 2 Shape 3 A @ Figure 3 B 41IS4 Figure A
Claims (1)
ス打抜きするヒートシンクの製造方法において、前記プ
レス金型の底面を擂鉢状に形成し、該プレス金型を用い
てプレス打抜きすることを特徴とするヒートシンクの製
造方法。(1) In a heat sink manufacturing method in which a longitudinal copper plate is press-punched using a press mold having ventilation holes, the bottom surface of the press mold is formed into a mortar shape, and press punching is performed using the press mold. Characteristic heat sink manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8077686A JPS62238026A (en) | 1986-04-08 | 1986-04-08 | Manufacture of heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8077686A JPS62238026A (en) | 1986-04-08 | 1986-04-08 | Manufacture of heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62238026A true JPS62238026A (en) | 1987-10-19 |
| JPH0454528B2 JPH0454528B2 (en) | 1992-08-31 |
Family
ID=13727836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8077686A Granted JPS62238026A (en) | 1986-04-08 | 1986-04-08 | Manufacture of heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62238026A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011508675A (en) * | 2008-01-02 | 2011-03-17 | ロバート ボッシュ ジーエムビーエイチ | Blanking assembly for punching transverse elements used in push belts for continuously variable transmissions |
| CN103506498A (en) * | 2013-10-25 | 2014-01-15 | 昆山精创模具有限公司 | Terrace die used for punching air conditioner radiating fin vent and machining method of same |
| US11224909B2 (en) * | 2015-07-07 | 2022-01-18 | Nippon Steel Corporation | Protrusion molding device, protrusion molding method, and molded article |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014681U (en) * | 1973-05-31 | 1975-02-15 | ||
| JPS51109589A (en) * | 1975-03-20 | 1976-09-28 | Sanyo Electric Co | HIKAATSUSHOMOMENOJUSURU BANTAINOCHINUKIKAKOHOHO |
| JPS596031U (en) * | 1982-06-30 | 1984-01-14 | ナショナル住宅産業株式会社 | punching press mold |
| JPS60216572A (en) * | 1984-04-11 | 1985-10-30 | Sanyo Electric Co Ltd | Manufacture of heat sink |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596031B2 (en) * | 1982-03-09 | 1984-02-08 | 東北大学長 | Vacuum pump |
-
1986
- 1986-04-08 JP JP8077686A patent/JPS62238026A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014681U (en) * | 1973-05-31 | 1975-02-15 | ||
| JPS51109589A (en) * | 1975-03-20 | 1976-09-28 | Sanyo Electric Co | HIKAATSUSHOMOMENOJUSURU BANTAINOCHINUKIKAKOHOHO |
| JPS596031U (en) * | 1982-06-30 | 1984-01-14 | ナショナル住宅産業株式会社 | punching press mold |
| JPS60216572A (en) * | 1984-04-11 | 1985-10-30 | Sanyo Electric Co Ltd | Manufacture of heat sink |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011508675A (en) * | 2008-01-02 | 2011-03-17 | ロバート ボッシュ ジーエムビーエイチ | Blanking assembly for punching transverse elements used in push belts for continuously variable transmissions |
| CN103506498A (en) * | 2013-10-25 | 2014-01-15 | 昆山精创模具有限公司 | Terrace die used for punching air conditioner radiating fin vent and machining method of same |
| CN103506498B (en) * | 2013-10-25 | 2016-06-01 | 昆山精创模具有限公司 | Punching press heat sink of air conditioner breather hole punch and working method thereof |
| US11224909B2 (en) * | 2015-07-07 | 2022-01-18 | Nippon Steel Corporation | Protrusion molding device, protrusion molding method, and molded article |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0454528B2 (en) | 1992-08-31 |
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