JPS6223454B2 - - Google Patents

Info

Publication number
JPS6223454B2
JPS6223454B2 JP12494879A JP12494879A JPS6223454B2 JP S6223454 B2 JPS6223454 B2 JP S6223454B2 JP 12494879 A JP12494879 A JP 12494879A JP 12494879 A JP12494879 A JP 12494879A JP S6223454 B2 JPS6223454 B2 JP S6223454B2
Authority
JP
Japan
Prior art keywords
bonding
purity
bonding wire
strength
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12494879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5649534A (en
Inventor
Norimasa Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP12494879A priority Critical patent/JPS5649534A/ja
Publication of JPS5649534A publication Critical patent/JPS5649534A/ja
Publication of JPS6223454B2 publication Critical patent/JPS6223454B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/5522—

Landscapes

  • Wire Bonding (AREA)
JP12494879A 1979-09-28 1979-09-28 Bonding wire for semiconductor device Granted JPS5649534A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12494879A JPS5649534A (en) 1979-09-28 1979-09-28 Bonding wire for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12494879A JPS5649534A (en) 1979-09-28 1979-09-28 Bonding wire for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5649534A JPS5649534A (en) 1981-05-06
JPS6223454B2 true JPS6223454B2 (enExample) 1987-05-22

Family

ID=14898159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12494879A Granted JPS5649534A (en) 1979-09-28 1979-09-28 Bonding wire for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5649534A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2116208B (en) * 1981-12-04 1985-12-04 Mitsubishi Metal Corp Fine gold alloy wire for bonding of a semiconductor device
JP2745065B2 (ja) * 1988-05-02 1998-04-28 新日本製鐵株式会社 半導体素子用ボンディングワイヤ
JPH0677503B2 (ja) * 1990-03-06 1994-10-05 不二製油株式会社 大豆たん白膜の製造方法
AT407830B (de) * 1999-09-10 2001-06-25 Degussa Huels Cee Gmbh Hochgoldhaltige, gelbe dentallegierung
JP3323185B2 (ja) * 2000-06-19 2002-09-09 田中電子工業株式会社 半導体素子接続用金線
JP5582484B1 (ja) 2013-12-20 2014-09-03 田中貴金属工業株式会社 医療用合金及びその製造方法

Also Published As

Publication number Publication date
JPS5649534A (en) 1981-05-06

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