JPS62232475A - 熱硬化性接着フイルム - Google Patents

熱硬化性接着フイルム

Info

Publication number
JPS62232475A
JPS62232475A JP7610686A JP7610686A JPS62232475A JP S62232475 A JPS62232475 A JP S62232475A JP 7610686 A JP7610686 A JP 7610686A JP 7610686 A JP7610686 A JP 7610686A JP S62232475 A JPS62232475 A JP S62232475A
Authority
JP
Japan
Prior art keywords
polyimide
formula
polymaleimide
adhesive film
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7610686A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0346512B2 (enrdf_load_stackoverflow
Inventor
Shuichi Matsuura
秀一 松浦
Yasuo Miyadera
康夫 宮寺
Toshihiko Kato
利彦 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP7610686A priority Critical patent/JPS62232475A/ja
Publication of JPS62232475A publication Critical patent/JPS62232475A/ja
Publication of JPH0346512B2 publication Critical patent/JPH0346512B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP7610686A 1986-04-02 1986-04-02 熱硬化性接着フイルム Granted JPS62232475A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7610686A JPS62232475A (ja) 1986-04-02 1986-04-02 熱硬化性接着フイルム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7610686A JPS62232475A (ja) 1986-04-02 1986-04-02 熱硬化性接着フイルム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP7322489A Division JPH0671139B2 (ja) 1989-03-24 1989-03-24 印刷配線板用基板の製造法

Publications (2)

Publication Number Publication Date
JPS62232475A true JPS62232475A (ja) 1987-10-12
JPH0346512B2 JPH0346512B2 (enrdf_load_stackoverflow) 1991-07-16

Family

ID=13595639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7610686A Granted JPS62232475A (ja) 1986-04-02 1986-04-02 熱硬化性接着フイルム

Country Status (1)

Country Link
JP (1) JPS62232475A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4826927A (en) * 1986-01-13 1989-05-02 Ciba-Geigy Corporation Mixtures containing polymides alkenyphenols and either epoxide group-free adducts or another polyimide
US5608013A (en) * 1990-05-10 1997-03-04 Hitachi Chemical Company, Ltd. Polyimides and thermosetting resin compositions containing the same
JP2007197590A (ja) * 2006-01-27 2007-08-09 Fujifilm Corp フィルムの製造方法およびフィルム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS518976A (enrdf_load_stackoverflow) * 1974-06-10 1976-01-24 Arvin Ind Inc
JPS5211688A (en) * 1975-07-15 1977-01-28 Matsushita Electric Works Ltd Shoulder patting device
JPS5324640A (en) * 1976-08-19 1978-03-07 Heraeus Quarzschmelze Cooling infrared ray radiating element
JPS56161457A (en) * 1980-05-17 1981-12-11 Kanegafuchi Chem Ind Co Ltd Heat-resisting resin composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS518976A (enrdf_load_stackoverflow) * 1974-06-10 1976-01-24 Arvin Ind Inc
JPS5211688A (en) * 1975-07-15 1977-01-28 Matsushita Electric Works Ltd Shoulder patting device
JPS5324640A (en) * 1976-08-19 1978-03-07 Heraeus Quarzschmelze Cooling infrared ray radiating element
JPS56161457A (en) * 1980-05-17 1981-12-11 Kanegafuchi Chem Ind Co Ltd Heat-resisting resin composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4826927A (en) * 1986-01-13 1989-05-02 Ciba-Geigy Corporation Mixtures containing polymides alkenyphenols and either epoxide group-free adducts or another polyimide
US5608013A (en) * 1990-05-10 1997-03-04 Hitachi Chemical Company, Ltd. Polyimides and thermosetting resin compositions containing the same
JP2007197590A (ja) * 2006-01-27 2007-08-09 Fujifilm Corp フィルムの製造方法およびフィルム

Also Published As

Publication number Publication date
JPH0346512B2 (enrdf_load_stackoverflow) 1991-07-16

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