JPS62232475A - Heat-curable bonding film - Google Patents
Heat-curable bonding filmInfo
- Publication number
- JPS62232475A JPS62232475A JP7610686A JP7610686A JPS62232475A JP S62232475 A JPS62232475 A JP S62232475A JP 7610686 A JP7610686 A JP 7610686A JP 7610686 A JP7610686 A JP 7610686A JP S62232475 A JPS62232475 A JP S62232475A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- formula
- polymaleimide
- adhesive film
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001721 polyimide Polymers 0.000 claims abstract description 21
- 239000004642 Polyimide Substances 0.000 claims abstract description 19
- 238000005266 casting Methods 0.000 claims abstract description 3
- 239000002313 adhesive film Substances 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 4
- 239000013557 residual solvent Substances 0.000 abstract description 3
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 239000002966 varnish Substances 0.000 abstract 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 12
- 229920003192 poly(bis maleimide) Polymers 0.000 description 12
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229920005575 poly(amic acid) Polymers 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- LNAIBNHJQKDBNR-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)-2-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=C(N2C(C=CC2=O)=O)C=CC=C1N1C(=O)C=CC1=O LNAIBNHJQKDBNR-UHFFFAOYSA-N 0.000 description 1
- FJKKJQRXSPFNPM-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)-4-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=CC=C(N2C(C=CC2=O)=O)C=C1N1C(=O)C=CC1=O FJKKJQRXSPFNPM-UHFFFAOYSA-N 0.000 description 1
- PYVHLZLQVWXBDZ-UHFFFAOYSA-N 1-[6-(2,5-dioxopyrrol-1-yl)hexyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCCCCCN1C(=O)C=CC1=O PYVHLZLQVWXBDZ-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- BLAKAEFIFWAFGH-UHFFFAOYSA-N acetyl acetate;pyridine Chemical compound C1=CC=NC=C1.CC(=O)OC(C)=O BLAKAEFIFWAFGH-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012772 electrical insulation material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は可撓性、耐熱性に潰れた熱硬化性接着フィルム
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermosetting adhesive film that is flexible and heat resistant.
従来、電気絶縁材料、構造材料等に用いられているポリ
イミド接着剤としては、Ｎ、Ｎ’ −（４゜４−ジフェ
ニルメタン）ビスマレイミドト４．４’−ジアミノジフ
ェニルメタンからなる予備縮合物が知られている。Conventionally, as a polyimide adhesive used for electrical insulation materials, structural materials, etc., a precondensate consisting of N,N'-(4°4-diphenylmethane)bismaleimide and 4,4'-diaminodiphenylmethane is known. ing.
しかしながら上記の予備縮合物自体は、固（て脆いため
流延してフィルムとすることができなかった。また積層
材等の接着シートとして用いる場合にはその溶液をカジ
ス布などの基伺に含浸した後溶剤を除去しプリプレグと
しなければならないため基羽の厚さに限定さゎ、したが
って薄いものを得ることができなかった。However, the precondensate itself cannot be cast into a film because it is hard and brittle.Also, when used as an adhesive sheet for laminated materials, the solution is impregnated into a substrate such as Kazi cloth. After that, the solvent had to be removed to form a prepreg, so the thickness of the base layer was limited, and it was therefore impossible to obtain a thin one.
本発明はか〜る状況に鑑みなさｎたものであって、可撓
性、耐熱性に優れた熱硬化性接着フィルムを提供せんと
するものである。The present invention was conceived in view of the above circumstances, and it is an object of the present invention to provide a thermosetting adhesive film having excellent flexibility and heat resistance.
か〜る目的は本発明によれば５次の一般式で表わされる
ポリイミド（５）に、
一般式
で表わさするポリマレイミド（ＢＪ ’ｆ混合したａ脂
組成物を流延成形することによって得られる接着性フィ
ルムにより達成される。According to the present invention, this object can be obtained by casting a fat composition in which polyimide (5) represented by the 5-order general formula is mixed with polymaleimide (BJ'f) represented by the general formula. Achieved by adhesive film.
本発明においてポリイミド（Ａ）はクレゾール、フェノ
ール等の溶媒中で３．．５；４，４’−ベンゾフェノン
テトラカルボン酸二無水物（以下ＢＴＤＡと略す）と６
，３′−ジアミノジフェニルスルホン（以下３．３’−
ＤＤＳと略す）および２，４−ジアミノトルエン（以下
２．４− Ｄ Ａ Ｔと略す）とを加熱攪拌することに
よって得られるが、ジメチルアセトアミド、ジメチルホ
ルムアミド等の非プロトン性極性溶媒中で室温以下の温
度で反応させ、対応するポリアミド酸を合成し、無水酢
酸−ビリジン等の脱水剤を用いて脱水閉環させることに
よって得ることもできる。In the present invention, polyimide (A) is prepared in 3. in a solvent such as cresol or phenol. ．． 5; 4,4'-benzophenonetetracarboxylic dianhydride (hereinafter abbreviated as BTDA) and 6
, 3'-diaminodiphenylsulfone (hereinafter referred to as 3.3'-
DDS) and 2,4-diaminotoluene (hereinafter abbreviated as 2.4-DAT) are heated and stirred, but in an aprotic polar solvent such as dimethylacetamide or dimethylformamide at room temperature or below. It can also be obtained by reacting the polyamic acid at a temperature of 100 to 100 ml, synthesizing the corresponding polyamic acid, and dehydrating and ring-closing the polyamic acid using a dehydrating agent such as acetic anhydride-pyridine.
ポリイミド（８）中の３．３’−ＤＤＳと２．４− Ｄ
ＡＴのモル比をま１０：９０〜５０：５０が好ましく
５．５’−ＤＤＳが９０モル％を越えるとポリイミド（
５）が向くなり成形性が悪くなる。また３、３′−ＤＤ
Ｓが５０モル％を越えると製膜性が悪化する。3.3'-DDS and 2.4-D in polyimide (8)
The molar ratio of AT is preferably 10:90 to 50:50, and if 5.5'-DDS exceeds 90 mol%, polyimide (
5), resulting in poor moldability. Also 3,3'-DD
If S exceeds 50 mol%, film forming properties will deteriorate.
本発明に用いることのできるポリマレイミド（Ｂ）の具
体例としてはＮ、Ｎ’−（４，４’−ジフェニルメタン
）ビスマレイミド、 Ｎ、Ｎ’−（４，４’−ジフェニ
ルオキシ）ビスマレイミＦ’、Ｎ、Ｎ’−ｐ−７エニレ
ンビスマレイミト、 Ｎ、Ｎ’−ｍ−２二二レンビスマ
レイミド、Ｎ、Ｎ’−２，４−トリレンビスマレイミド
、Ｎ、Ｎ′−２，６−トリレンビスマレイミド、 Ｎ、
Ｎ’−エチレンビスマレイミド、Ｎ、Ｎ’−ヘキサメチ
レンビスマレイミド、あるいはといった構造式で表わさ
れるポリマレイミドがあり、これらを単独あるいは二種
以上混合して用いることができる。Specific examples of the polymaleimide (B) that can be used in the present invention include N,N'-(4,4'-diphenylmethane)bismaleimide, N,N'-(4,4'-diphenyloxy)bismaleimide F' , N, N'-p-7 enylene bismaleimide, N, N'-m-2 22lene bismaleimide, N, N'-2,4-tolylene bismaleimide, N, N'-2, 6-tolylene bismaleimide, N,
There are polymaleimides represented by structural formulas such as N'-ethylene bismaleimide, N,N'-hexamethylene bismaleimide, or the like, and these can be used alone or in combination of two or more.
ポリイミド（Ａ）とポリマレイミド（Ｂ）の混合割合は
、ポリマレイミド（ＢＪ Ｙポリイミド（８）に対して
１０〜５０重量％で用いるのが好ましく、さらに好まし
くは１５〜３０重量％である。ポリマレイミド（Ｂ）が
１０１量％未溝では硬化が十分でなく５０重量％ケ越え
ると仙脂組成物がもろく成形性がなくなる。The mixing ratio of polyimide (A) and polymaleimide (B) is preferably 10 to 50% by weight, more preferably 15 to 30% by weight based on the polymaleimide (BJ Y polyimide (8). If the amount of maleimide (B) is 101% by weight, the curing is insufficient, and if it exceeds 50% by weight, the resin composition becomes brittle and loses its moldability.
ポリイミドとポリマレイミドの混合は粉状で行なっても
よいが、通常はＤＭＦのような溶剤に溶解したポリアミ
ドフエスにポリマレイミドケ添加溶解することによって
行なわれる。Although the polyimide and the polymaleimide may be mixed in powder form, it is usually carried out by adding and dissolving the polymaleimide in a polyamide foam dissolved in a solvent such as DMF.
このようにして得たポリイミドとポリマレイミドとの混
＠フェスをガラス板、ステンレス板等に流延、乾燥する
ことにより接層フィルム？得る。乾燥温度と時間は用い
る溶剤、ポリマレイミドの種類によって異なるが、温度
はポリマレイミドの反応が顕著になる温度よりも低く保
Ａ−
つ必要があり、時間は残存浴坤ｊ謔が１％以下になるよ
うにしなければならない。The mixture of polyimide and polymaleimide thus obtained is cast onto a glass plate, stainless steel plate, etc., and dried to form an adhesive film. obtain. The drying temperature and time vary depending on the solvent used and the type of polymerimide, but the temperature must be kept below the temperature at which the reaction of the polymaleimide becomes noticeable, and the drying time must be set so that the remaining drying time is 1% or less. You have to make it happen.
得られた接着フィルムは被着体と重ねた後、軟化点以上
の温度で加熱加圧することによって耐熱性に優れ、良好
な接着カケ有する成形品を得ることができる。The obtained adhesive film is laminated with an adherend and then heated and pressed at a temperature above the softening point, thereby making it possible to obtain a molded article with excellent heat resistance and good adhesive chipping.
本発明に係る接着フィルムは可撓性に冨んでいるため、
フレキシブル配線板の銅箔と耐熱フィルムの接着剤とし
て適している。Since the adhesive film according to the present invention is highly flexible,
Suitable as an adhesive for copper foil and heat-resistant film on flexible wiring boards.
以下実施例によって本発明の詳細な説明するが２本発明
はこれらの実施例に限定されるものではない。The present invention will be described in detail below with reference to Examples, but the present invention is not limited to these Examples.
実施例１
ＢＴＤＡ ３２．２ ｇ、 ５．５’−ＤＤ ５９．
９ ｇ、 ２゜４−ＤＡＴ７．３ｇを攪拌機、温度計、
窒素ガス導入管、冷却管を備えた四つロフラスコに入れ
、ｍ−フレジーｙ４５０ｇ、）ルエン１０８ｇ）Ｊｔ’
添加し、窒素ガスを流しながら加熱攪拌した。Example 1 BTDA 32.2 g, 5.5'-DD 59.
9 g, 7.3 g of 2゜4-DAT in a stirrer, thermometer,
Place in a four-bottle flask equipped with a nitrogen gas inlet tube and a cooling tube, and add 450 g of m-Frezy Y, 108 g of toluene) Jt'
The mixture was heated and stirred while flowing nitrogen gas.
１５０〜１６０℃で１６時間反応させて、樹脂分１ａ２
％、粘度１８Ｐのポリイミドフェスを得た。このポリイ
ミドフェスをアセトン中に注いで再沈し粉砕、洗浄、乾
燥することによってポリイミド粉末を得た。ポリイミド
粉末の還元粘度（＃度ａ １ｇ／ｄ’ｓ 溶媒Ｎ、Ｎ−
シメテｙｂホルムアミド（ＤＭＦ）、温度３０．０℃）
はα４６ｄｌ／ｇであった。得られたポリイミド粉末１
００ｇとＮ、Ｎ’−（４，４’−ジフェニルメタン）ビ
スマレイミド（ＢＭＩ）１０ｇをＤＭＦ ４００ｇに溶
解してフェスを得た。このフェスをカラス板上に流延し
、１３０℃１０分乾燥した後。React at 150-160°C for 16 hours to reduce the resin content to 1a2.
% and a viscosity of 18P was obtained. This polyimide face was poured into acetone, reprecipitated, crushed, washed, and dried to obtain polyimide powder. Reduced viscosity of polyimide powder (#degree a 1g/d's solvent N, N-
Cymetyb formamide (DMF), temperature 30.0℃)
was α46 dl/g. Obtained polyimide powder 1
00g and N,N'-(4,4'-diphenylmethane)bismaleimide (BMI) 10g were dissolved in 400g of DMF to obtain a festival. This face was cast on a glass plate and dried at 130°C for 10 minutes.
剥離し、鉄枠に止めて２００℃１時間乾燥して接着フィ
ルムを得た。得られた接着フィルムは厚さ２５μｍ、残
存溶媒量１％、軟化点２６０℃であり、１８０°に折曲
げ℃も割わず可撓性に優れたものであった。It was peeled off, fixed on an iron frame, and dried at 200°C for 1 hour to obtain an adhesive film. The obtained adhesive film had a thickness of 25 μm, a residual solvent amount of 1%, a softening point of 260° C., and had excellent flexibility without breaking when bent at 180°.
実施例２
Ｎ、Ｎ’−（４，４’−シフェニルメタンンビスマレイ
ミドのかわりにＢＭ Ｉ −Ｍ （三井東圧化学時製ポ
リマレイミド） ２０ ｇ”ａ−添加する以外は実施例
１と同様にして接着フィルムを得た。得られた接着フィ
ルムは厚さ２５μｍ１残存溶媒量１．１％、軟化点２２
０℃であり、１８０°に折曲げても割れず可撓性に優れ
たものであった。Example 2 Same as Example 1 except that 20 g of BM I-M (polymaleimide manufactured by Mitsui Toatsu Kagaku Co., Ltd.) was added instead of N,N'-(4,4'-cyphenylmethane bismaleimide). An adhesive film was obtained in the same manner.The obtained adhesive film had a thickness of 25 μm, a residual solvent amount of 1.1%, and a softening point of 22
0° C., and did not crack even when bent at 180° and had excellent flexibility.
比較例１
ケルイミド６０１（日本ポリイミド■製ポリアミノビス
マレイミド樹脂）１００ｇ￥ＤＭＦ１００ｇに溶解した
フェスをガラス板上に流延後、１３０℃１０分、ついで
１７０℃２０分乾燥したが、もろくてフィルｌｘとなら
なかった。Comparative Example 1 Kelimide 601 (polyamino bismaleimide resin manufactured by Nippon Polyimide ■) 100 g ￥ Fes dissolved in 100 g of DMF was cast on a glass plate and dried at 130°C for 10 minutes and then at 170°C for 20 minutes, but it was brittle and could not be used as film lx. did not become.
実施例３〜５、比較例２〜３
実施例１のＢ ＭＩ量を表１のように変更する以外は実
施例１と同様にして得た接着フィルム’？： １ ｍｍ
厚のアルミ板と３５μｍ厚の片面粗化銅箔の間にはさん
で５０ ｋｇ ｆ ／ ｃｎＦ ｂ ２７５℃、３０分
の条件で積層して銅張基板を得た。基板の特性を表１に
示す。Examples 3 to 5, Comparative Examples 2 to 3 Adhesive films obtained in the same manner as in Example 1 except that the BMI amount in Example 1 was changed as shown in Table 1. : 1mm
A copper-clad board was obtained by sandwiching a thick aluminum plate and a 35 μm thick single-sided roughened copper foil and laminating them at 50 kg f/cnF b at 275° C. for 30 minutes. Table 1 shows the characteristics of the substrate.
表１
軟化点は荷重２５ｋｇ／ｃｎＩＩ、昇温速度１０℃／馴
でペネトレーション法で測定した。Table 1 The softening point was measured by the penetration method at a load of 25 kg/cnII and a heating rate of 10° C./acid.
銅箔引剥し強さは引張速度５０ｍｍ７／ａｍで９０゜引
剥し強さ音測定した。The copper foil peel strength was measured at a 90° peel strength sound at a tensile speed of 50 mm7/am.
はんだ耐熱性は２０１ｎｍ角の試験片ンはんだ浴上に鋼
箔を下側にして浮べた恢、ふくれの有無を観察した。Soldering heat resistance was determined by floating a 201 nm square test piece on a solder bath with the steel foil facing down and observing the presence or absence of blisters.
実施例６
５０μｍ厚のポリイミドフィルムと３５μｍ厚の片面粗
化銅箔の間に実施例１で得た接着フィルムを１枚はさん
で、２８０℃、５０ｋｇｆ／ゲ、３０分の条件で積層し
、印刷配？ＩｐＡ機用基板を得た。この基板の９０°銅
箔引剥し強さン引張速度５Ｑｍ＋ｎ／＋＋＋ｓで測定し
たところ室温でＺ、２ｋｇｆ／ｃｍ、１５０℃で１．８
ｋｇ ｆ ／ ｃｒｎであツタ。Example 6 One adhesive film obtained in Example 1 was sandwiched between a 50 μm thick polyimide film and a 35 μm thick single-sided roughened copper foil, and laminated at 280° C., 50 kgf/ge, and 30 minutes. Printing arrangement? A substrate for an IpA machine was obtained. The 90° copper foil peel strength of this board was measured at a tensile rate of 5Qm+n/+++s, and it was Z at room temperature, 2 kgf/cm, and 1.8 at 150°C.
Ivy in kg f/crn.
またこの基板を３００℃のはんだ浴に１分間浸漬したが
ふくれは生じなかった。Further, this board was immersed in a 300° C. solder bath for 1 minute, but no blistering occurred.
実施例７
ＢＭＩ蓋を３０ ｐｈｒとする以外は実施例１と同様に
して接着フィルムを作製した。５０８℃厚のポリイミド
フィルムの両側にこの接着フィルムと３５μｍ片而粗化
銅箔を重ねて２８０℃、５０ｋｇｆ／ａｆｂ３０分の条
件で積層しフレキシブル印刷配想鈑用基板乞曲た。Example 7 An adhesive film was produced in the same manner as in Example 1 except that the BMI lid was 30 phr. This adhesive film and 35 μm coarsely roughened copper foil were laminated on both sides of a 508° C. thick polyimide film and laminated at 280° C. and 50 kgf/afb for 30 minutes to form a flexible printed board.
この基板の９０°銅箭引濶ｊし強さは室温で２゜１ｋｇ
ｆ／（Ｊ、 １５０℃で１．７ Ｄ ｆ ／ｃｒｎで
あり、３００℃のはんだ浴に１分間浸漬してもふくれは
生じなかった。The strength of this board when stretched at 90° is 2°1 kg at room temperature.
f/(J, 1.7 D f /crn at 150°C, and no blistering occurred even when immersed in a 300°C solder bath for 1 minute.
実施例８
ＢＭＩのかわりにＢＭＩ−Ｍ（三井東圧化学袈ポリマレ
イミド）１５ｇＹ用いる以外は実施例１と同様にして作
製したフィルム状接層剤を用い実施例７と同様にしてン
レキシブル印刷配緋板用基板を得た。この基板の９００
＠陥引剥し強さは室温で２．１ ｋｇ ｆ ／ｃｔｎ、
１５０℃で１．７ｋｇ ｆ／ ｃｍであり、３００℃の
はんだ浴に１分間浸漬してもふくれは生じなかった。Example 8 Flexible printing was carried out in the same manner as in Example 7 using a film adhesive prepared in the same manner as in Example 1, except that 15 gY of BMI-M (Mitsui Toatsu Chemical Polymaleimide) was used instead of BMI. A board substrate was obtained. 900 of this board
@Falling peel strength is 2.1 kgf/ctn at room temperature,
It was 1.7 kg f/cm at 150°C, and no blistering occurred even when immersed in a 300°C solder bath for 1 minute.
比較例４
本発明に係る接着フィルムのかわりにバイララックス（
デュポン社製アクリル系フィルム状接着剤）を用い実施
例６と同様の構成で１８０’Ｃ，３０ｋｇｆ／ば、６０
分の条件で積層し、フレキシブル印刷配線板用基８２を
得た。この基板の９０°銅箔引剥し強さは室温で２．２
ｋｇ ｆ ／ｃｒｎ。Comparative Example 4 Viralax (
180'C, 30kgf/ba, 60
The substrates were laminated under the following conditions to obtain a substrate 82 for a flexible printed wiring board. The 90° copper foil peel strength of this board is 2.2 at room temperature.
kgf/crn.
１５０℃でＱ、６ｋｇｆ／ＣＩｌ＋であッｒ、−０”ｆ
ｒ、、： コ１７） 基板を３００℃のはんだ浴に１
分間浸漬したところふくれが生じた。Q at 150℃, 6kgf/CIl+, -0”f
r,,: ko17) Place the board in a 300℃ solder bath.
After soaking for a minute, blistering occurred.
Claims (1)
式、化学式、表等があります▼ のモル比が１０：９０〜５０：５０である ２価の基を表わす） で表わされるポリイミド（Ａ）に、 一般式 ▲数式、化学式、表等があります▼ （式中Ｒは炭素数２以上の整数価の基であ りｎは２以上の整数である） で表わされるポリマレイミド（Ｂ）を配合してなる組成
物を流延成形してなる熱硬化性接着フィルム。 ２、ポリイミド（Ａ）とポリマレイミド（Ｂ）の比率（
Ａ：Ｂ）が９０：１０〜５０：５０である特許請求の範
囲第１項記載の熱硬化性接着フィルム。[Claims] 1. General formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (In the formula, Ar is the molar ratio of ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ and ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ 10:90 to 50:50) Polyimide (A) represented by the general formula ▲ has a mathematical formula, a chemical formula, a table, etc. ▼ (in the formula, R is an integer valence having 2 or more carbon atoms) A thermosetting adhesive film obtained by casting a composition containing a polymaleimide (B) represented by the following formula (n is an integer of 2 or more). 2. Ratio of polyimide (A) and polymaleimide (B) (
The thermosetting adhesive film according to claim 1, wherein A:B) is 90:10 to 50:50.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7610686A JPS62232475A (en) | 1986-04-02 | 1986-04-02 | Heat-curable bonding film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7610686A JPS62232475A (en) | 1986-04-02 | 1986-04-02 | Heat-curable bonding film |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7322489A Division JPH0671139B2 (en) | 1989-03-24 | 1989-03-24 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62232475A true JPS62232475A (en) | 1987-10-12 |
| JPH0346512B2 JPH0346512B2 (en) | 1991-07-16 |
Family
ID=13595639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7610686A Granted JPS62232475A (en) | 1986-04-02 | 1986-04-02 | Heat-curable bonding film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62232475A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4826927A (en) * | 1986-01-13 | 1989-05-02 | Ciba-Geigy Corporation | Mixtures containing polymides alkenyphenols and either epoxide group-free adducts or another polyimide |
| US5608013A (en) * | 1990-05-10 | 1997-03-04 | Hitachi Chemical Company, Ltd. | Polyimides and thermosetting resin compositions containing the same |
| JP2007197590A (en) * | 2006-01-27 | 2007-08-09 | Fujifilm Corp | Method for producing film, and film |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS518976A (en) * | 1974-06-10 | 1976-01-24 | Arvin Ind Inc | |
| JPS5211688A (en) * | 1975-07-15 | 1977-01-28 | Matsushita Electric Works Ltd | Shoulder patting device |
| JPS5324640A (en) * | 1976-08-19 | 1978-03-07 | Heraeus Quarzschmelze | Cooling infrared ray radiating element |
| JPS56161457A (en) * | 1980-05-17 | 1981-12-11 | Kanegafuchi Chem Ind Co Ltd | Heat-resisting resin composition |
-
1986
- 1986-04-02 JP JP7610686A patent/JPS62232475A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS518976A (en) * | 1974-06-10 | 1976-01-24 | Arvin Ind Inc | |
| JPS5211688A (en) * | 1975-07-15 | 1977-01-28 | Matsushita Electric Works Ltd | Shoulder patting device |
| JPS5324640A (en) * | 1976-08-19 | 1978-03-07 | Heraeus Quarzschmelze | Cooling infrared ray radiating element |
| JPS56161457A (en) * | 1980-05-17 | 1981-12-11 | Kanegafuchi Chem Ind Co Ltd | Heat-resisting resin composition |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4826927A (en) * | 1986-01-13 | 1989-05-02 | Ciba-Geigy Corporation | Mixtures containing polymides alkenyphenols and either epoxide group-free adducts or another polyimide |
| US5608013A (en) * | 1990-05-10 | 1997-03-04 | Hitachi Chemical Company, Ltd. | Polyimides and thermosetting resin compositions containing the same |
| JP2007197590A (en) * | 2006-01-27 | 2007-08-09 | Fujifilm Corp | Method for producing film, and film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0346512B2 (en) | 1991-07-16 |
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