JPS62228440A - 半導体素子ボンデイング用金線 - Google Patents

半導体素子ボンデイング用金線

Info

Publication number
JPS62228440A
JPS62228440A JP61070087A JP7008786A JPS62228440A JP S62228440 A JPS62228440 A JP S62228440A JP 61070087 A JP61070087 A JP 61070087A JP 7008786 A JP7008786 A JP 7008786A JP S62228440 A JPS62228440 A JP S62228440A
Authority
JP
Japan
Prior art keywords
gold
bonding
gold wire
wire
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61070087A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6360105B2 (enrdf_load_stackoverflow
Inventor
Hideo Taneda
種田　秀雄
Kazuaki Koike
小池　和昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MATSUDA KIKINZOKU KOGYO KK
Original Assignee
MATSUDA KIKINZOKU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MATSUDA KIKINZOKU KOGYO KK filed Critical MATSUDA KIKINZOKU KOGYO KK
Priority to JP61070087A priority Critical patent/JPS62228440A/ja
Publication of JPS62228440A publication Critical patent/JPS62228440A/ja
Publication of JPS6360105B2 publication Critical patent/JPS6360105B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/432—Mechanical processes
    • H01L2224/4321—Pulling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45644—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01204—4N purity grades, i.e. 99.99%

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP61070087A 1986-03-28 1986-03-28 半導体素子ボンデイング用金線 Granted JPS62228440A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61070087A JPS62228440A (ja) 1986-03-28 1986-03-28 半導体素子ボンデイング用金線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61070087A JPS62228440A (ja) 1986-03-28 1986-03-28 半導体素子ボンデイング用金線

Publications (2)

Publication Number Publication Date
JPS62228440A true JPS62228440A (ja) 1987-10-07
JPS6360105B2 JPS6360105B2 (enrdf_load_stackoverflow) 1988-11-22

Family

ID=13421404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61070087A Granted JPS62228440A (ja) 1986-03-28 1986-03-28 半導体素子ボンデイング用金線

Country Status (1)

Country Link
JP (1) JPS62228440A (enrdf_load_stackoverflow)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6487734A (en) * 1987-09-29 1989-03-31 Tanaka Precious Metal Ind Material for gold extra fine wire
JPH01127635A (ja) * 1987-11-09 1989-05-19 Mitsubishi Metal Corp ループ成形性の優れた半導体素子ボンディング用Ａｕ合金細線
JPH01146336A (ja) * 1987-12-03 1989-06-08 Mitsubishi Metal Corp 半導体素子ボンディング用Ａｕ合金極細線
JPH02170931A (ja) * 1988-09-29 1990-07-02 Mitsubishi Metal Corp 金バンプ用金合金細線
US4938923A (en) * 1989-04-28 1990-07-03 Takeshi Kujiraoka Gold wire for the bonding of a semiconductor device
JPH02205641A (ja) * 1989-01-31 1990-08-15 Tatsuta Electric Wire & Cable Co Ltd ボンディング用金合金細線
JPH03257129A (ja) * 1990-03-06 1991-11-15 Mitsubishi Materials Corp 半導体装置のボンディング用金合金線
JPH04304335A (ja) * 1991-03-30 1992-10-27 Mitsubishi Materials Corp 貴金属カード用純金箔材
JPH05179375A (ja) * 1991-12-26 1993-07-20 Nippon Steel Corp ボンディング用金合金細線
SG87207A1 (en) * 2000-06-19 2002-03-19 Tanaka Electronics Ind Gold wire for semiconductor element bonding
WO2006057230A1 (ja) * 2004-11-26 2006-06-01 Tanaka Denshi Kogyo K.K. 半導体素子用Auボンディングワイヤ
JP2006190719A (ja) * 2004-12-28 2006-07-20 Tanaka Electronics Ind Co Ltd 半導体装置
EP1811556A4 (en) * 2004-09-30 2009-08-05 Tanaka Electronics Ind MATERIAL FOR BOSS OF WIRE

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0515002U (ja) * 1991-08-05 1993-02-26 日本電信電話株式会社 光固定減衰器用端末部材

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58154242A (ja) * 1982-03-10 1983-09-13 Mitsubishi Metal Corp 半導体素子ボンデイング用金合金細線
JPS59119752A (ja) * 1982-12-24 1984-07-11 Tanaka Denshi Kogyo Kk 半導体素子用ボンデイング金線

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58154242A (ja) * 1982-03-10 1983-09-13 Mitsubishi Metal Corp 半導体素子ボンデイング用金合金細線
JPS59119752A (ja) * 1982-12-24 1984-07-11 Tanaka Denshi Kogyo Kk 半導体素子用ボンデイング金線

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6487734A (en) * 1987-09-29 1989-03-31 Tanaka Precious Metal Ind Material for gold extra fine wire
JPH01127635A (ja) * 1987-11-09 1989-05-19 Mitsubishi Metal Corp ループ成形性の優れた半導体素子ボンディング用Ａｕ合金細線
JPH01146336A (ja) * 1987-12-03 1989-06-08 Mitsubishi Metal Corp 半導体素子ボンディング用Ａｕ合金極細線
JPH02170931A (ja) * 1988-09-29 1990-07-02 Mitsubishi Metal Corp 金バンプ用金合金細線
JPH02205641A (ja) * 1989-01-31 1990-08-15 Tatsuta Electric Wire & Cable Co Ltd ボンディング用金合金細線
DE3936281A1 (de) * 1989-04-28 1990-10-31 Tanaka Electronics Ind Golddraht fuer das verbinden einer halbleiter-vorrichtung
US4938923A (en) * 1989-04-28 1990-07-03 Takeshi Kujiraoka Gold wire for the bonding of a semiconductor device
JPH03257129A (ja) * 1990-03-06 1991-11-15 Mitsubishi Materials Corp 半導体装置のボンディング用金合金線
JPH04304335A (ja) * 1991-03-30 1992-10-27 Mitsubishi Materials Corp 貴金属カード用純金箔材
JPH05179375A (ja) * 1991-12-26 1993-07-20 Nippon Steel Corp ボンディング用金合金細線
SG87207A1 (en) * 2000-06-19 2002-03-19 Tanaka Electronics Ind Gold wire for semiconductor element bonding
EP1811556A4 (en) * 2004-09-30 2009-08-05 Tanaka Electronics Ind MATERIAL FOR BOSS OF WIRE
WO2006057230A1 (ja) * 2004-11-26 2006-06-01 Tanaka Denshi Kogyo K.K. 半導体素子用Auボンディングワイヤ
JP2006190719A (ja) * 2004-12-28 2006-07-20 Tanaka Electronics Ind Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPS6360105B2 (enrdf_load_stackoverflow) 1988-11-22

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