JPS62202525A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS62202525A
JPS62202525A JP62012335A JP1233587A JPS62202525A JP S62202525 A JPS62202525 A JP S62202525A JP 62012335 A JP62012335 A JP 62012335A JP 1233587 A JP1233587 A JP 1233587A JP S62202525 A JPS62202525 A JP S62202525A
Authority
JP
Japan
Prior art keywords
guard ring
corner
film
slit
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62012335A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6348181B2 (cg-RX-API-DMAC7.html
Inventor
Yuji Hara
原　雄次
Tatsu Ito
達 伊藤
Tatsuro Totani
達郎 戸谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP62012335A priority Critical patent/JPS62202525A/ja
Publication of JPS62202525A publication Critical patent/JPS62202525A/ja
Publication of JPS6348181B2 publication Critical patent/JPS6348181B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP62012335A 1987-01-23 1987-01-23 樹脂封止型半導体装置 Granted JPS62202525A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62012335A JPS62202525A (ja) 1987-01-23 1987-01-23 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62012335A JPS62202525A (ja) 1987-01-23 1987-01-23 樹脂封止型半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP55119817A Division JPS5745259A (en) 1980-09-01 1980-09-01 Resin sealing type semiconductor device

Publications (2)

Publication Number Publication Date
JPS62202525A true JPS62202525A (ja) 1987-09-07
JPS6348181B2 JPS6348181B2 (cg-RX-API-DMAC7.html) 1988-09-28

Family

ID=11802429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62012335A Granted JPS62202525A (ja) 1987-01-23 1987-01-23 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS62202525A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991000616A1 (en) * 1989-06-26 1991-01-10 Oki Electric Industry Co., Ltd. Wiring structure of semiconductor chip
US5402005A (en) * 1989-01-20 1995-03-28 Kabushiki Kaisha Toshiba Semiconductor device having a multilayered wiring structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5389688A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5389688A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5402005A (en) * 1989-01-20 1995-03-28 Kabushiki Kaisha Toshiba Semiconductor device having a multilayered wiring structure
WO1991000616A1 (en) * 1989-06-26 1991-01-10 Oki Electric Industry Co., Ltd. Wiring structure of semiconductor chip
US5288948A (en) * 1989-06-26 1994-02-22 Oki Electric Industry Co., Ltd. Structure of a semiconductor chip having a conductive layer

Also Published As

Publication number Publication date
JPS6348181B2 (cg-RX-API-DMAC7.html) 1988-09-28

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