JPS62199661A - 半導体インナ−コ−ト用樹脂組成物 - Google Patents

半導体インナ−コ−ト用樹脂組成物

Info

Publication number
JPS62199661A
JPS62199661A JP61040379A JP4037986A JPS62199661A JP S62199661 A JPS62199661 A JP S62199661A JP 61040379 A JP61040379 A JP 61040379A JP 4037986 A JP4037986 A JP 4037986A JP S62199661 A JPS62199661 A JP S62199661A
Authority
JP
Japan
Prior art keywords
polysiloxane
group
formula
weight
viscosity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61040379A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0588752B2 (enExample
Inventor
Kazuhiro Takayanagi
高柳　一博
Yukinori Sakumoto
作本　征則
Atsushi Koshimura
淳 越村
Nobumasa Otake
伸昌 大竹
Tamio Kimura
木村　民夫
Yoshinori Sawada
沢田　佼宣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JNC Corp
Tomoegawa Co Ltd
Original Assignee
Tomoegawa Paper Co Ltd
Chisso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd, Chisso Corp filed Critical Tomoegawa Paper Co Ltd
Priority to JP61040379A priority Critical patent/JPS62199661A/ja
Publication of JPS62199661A publication Critical patent/JPS62199661A/ja
Publication of JPH0588752B2 publication Critical patent/JPH0588752B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP61040379A 1986-02-27 1986-02-27 半導体インナ−コ−ト用樹脂組成物 Granted JPS62199661A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61040379A JPS62199661A (ja) 1986-02-27 1986-02-27 半導体インナ−コ−ト用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61040379A JPS62199661A (ja) 1986-02-27 1986-02-27 半導体インナ−コ−ト用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS62199661A true JPS62199661A (ja) 1987-09-03
JPH0588752B2 JPH0588752B2 (enExample) 1993-12-24

Family

ID=12579017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61040379A Granted JPS62199661A (ja) 1986-02-27 1986-02-27 半導体インナ−コ−ト用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS62199661A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04370151A (ja) * 1991-06-18 1992-12-22 Shin Etsu Chem Co Ltd 電子部品含浸用シリコーン組成物及びその硬化物
JP2011513579A (ja) * 2008-03-12 2011-04-28 ダウ・コーニング・コーポレイション シリコーンポリマー分散物およびその形成方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5239751A (en) * 1975-09-26 1977-03-28 Shin Etsu Chem Co Ltd Curable organopolysiloxane compositions
JPS5434362A (en) * 1977-08-24 1979-03-13 Shin Etsu Chem Co Ltd Curable organopolysiloxane composition
JPS59122558A (ja) * 1982-12-29 1984-07-16 Toray Silicone Co Ltd 半導体素子被覆用オルガノポリシロキサン組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5239751A (en) * 1975-09-26 1977-03-28 Shin Etsu Chem Co Ltd Curable organopolysiloxane compositions
JPS5434362A (en) * 1977-08-24 1979-03-13 Shin Etsu Chem Co Ltd Curable organopolysiloxane composition
JPS59122558A (ja) * 1982-12-29 1984-07-16 Toray Silicone Co Ltd 半導体素子被覆用オルガノポリシロキサン組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04370151A (ja) * 1991-06-18 1992-12-22 Shin Etsu Chem Co Ltd 電子部品含浸用シリコーン組成物及びその硬化物
JP2011513579A (ja) * 2008-03-12 2011-04-28 ダウ・コーニング・コーポレイション シリコーンポリマー分散物およびその形成方法

Also Published As

Publication number Publication date
JPH0588752B2 (enExample) 1993-12-24

Similar Documents

Publication Publication Date Title
JP5705396B2 (ja) 発光素子封止用シリコーン組成物及び発光装置
KR101275046B1 (ko) 핫 멜트형 실리콘 접착제
EP0757080A2 (en) Curable organosiloxane compositions and semiconductor devices
TWI762649B (zh) 黏晶用固化性矽組合物
KR20140064931A (ko) 경화성 오가노폴리실록산 조성물 및 반도체 장치
CN102159647A (zh) 液体小片粘合剂
KR102769563B1 (ko) 다이 본딩용 실리콘 조성물, 그의 경화물 및 광반도체 장치
JP2002322364A (ja) シリコーンゲル組成物
EP3587498B1 (en) Curable organopolysiloxane composition and semiconductor device
CN103571209A (zh) 加成固化型硅酮组合物、及半导体装置
JP3519779B2 (ja) 接着剤および半導体装置
US5096990A (en) Resin composition for inner coat of semiconductor chip
JP2021512974A (ja) 硬化性シリコーン組成物、その硬化物、および光半導体デバイス
KR102829126B1 (ko) 부가 경화형 실리콘 수지 조성물, 그의 경화물, 및 광반도체 장치
TWI798500B (zh) 加成硬化型聚矽氧樹脂組成物、其硬化物及光半導體裝置
EP0769528A2 (en) Organopolysiloxane composition for impregnating electronic components and electronic components impregnated therewith
JPS62199661A (ja) 半導体インナ−コ−ト用樹脂組成物
US7211638B2 (en) Silicone-based cyanate-ester cross-linkable die attach adhesive
JPS6335654A (ja) 電子部品保護用シリコ−ンゲル組成物
CN113493677B (zh) 固晶用有机硅组合物、其固化物及光半导体装置
JP2005294437A (ja) 半導体素子封止剤、半導体装置および半導体装置の実装方法
KR20200024719A (ko) 부가 경화형 실리콘 조성물 및 반도체 장치
JPH02196861A (ja) 半導体インナーコート用樹脂組成物