JPS62196878A - 照明装置 - Google Patents

照明装置

Info

Publication number
JPS62196878A
JPS62196878A JP61038177A JP3817786A JPS62196878A JP S62196878 A JPS62196878 A JP S62196878A JP 61038177 A JP61038177 A JP 61038177A JP 3817786 A JP3817786 A JP 3817786A JP S62196878 A JPS62196878 A JP S62196878A
Authority
JP
Japan
Prior art keywords
conductive layer
light emitting
metal substrate
insulating layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61038177A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0447468B2 (enrdf_load_stackoverflow
Inventor
Masaru Sasaki
勝 佐々木
Hiroyuki Serizawa
芹沢　啓之
Tsutomu Machida
勉 町田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Priority to JP61038177A priority Critical patent/JPS62196878A/ja
Publication of JPS62196878A publication Critical patent/JPS62196878A/ja
Publication of JPH0447468B2 publication Critical patent/JPH0447468B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP61038177A 1986-02-25 1986-02-25 照明装置 Granted JPS62196878A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61038177A JPS62196878A (ja) 1986-02-25 1986-02-25 照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61038177A JPS62196878A (ja) 1986-02-25 1986-02-25 照明装置

Publications (2)

Publication Number Publication Date
JPS62196878A true JPS62196878A (ja) 1987-08-31
JPH0447468B2 JPH0447468B2 (enrdf_load_stackoverflow) 1992-08-04

Family

ID=12518105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61038177A Granted JPS62196878A (ja) 1986-02-25 1986-02-25 照明装置

Country Status (1)

Country Link
JP (1) JPS62196878A (enrdf_load_stackoverflow)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH036850U (enrdf_load_stackoverflow) * 1989-06-05 1991-01-23
JPH03119769A (ja) * 1989-09-30 1991-05-22 Mitsubishi Cable Ind Ltd 発光モジュール
JPH04111767U (ja) * 1991-03-14 1992-09-29 株式会社小糸製作所 チツプ型発光ダイオードの取付構造
JP2000349348A (ja) * 1999-03-31 2000-12-15 Toyoda Gosei Co Ltd 短波長ｌｅｄランプユニット
GB2361581A (en) * 2000-04-20 2001-10-24 Lite On Electronics Inc A light emitting diode device
WO2003002909A1 (en) * 2001-06-27 2003-01-09 Showers International Pty Ltd Lamp mounting assembly for solid state light devices
WO2003001253A3 (de) * 2001-06-20 2003-03-13 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement und verfahren zu seiner herstellung
US6746295B2 (en) 1999-04-22 2004-06-08 Osram-Opto Semiconductors Gmbh & Co. Ohg Method of producing an LED light source with lens
JP2006019598A (ja) * 2004-07-05 2006-01-19 Citizen Electronics Co Ltd 発光ダイオード
WO2006019085A1 (ja) * 2004-08-18 2006-02-23 Sony Corporation 放熱装置及び表示装置
JP2006148127A (ja) * 2004-11-22 2006-06-08 Valeo Vision 三次元環境で相互接続された発光ダイオードの支持体の製造方法
JP2006525679A (ja) * 2003-05-05 2006-11-09 ラミナ セラミックス インコーポレーテッド 高温動作用にパッケージ化された発光ダイオード
JP2006332052A (ja) * 2005-05-23 2006-12-07 Valeo Vision Ｌｅｄを備える自動車用の照明装置または信号装置
JP2007196872A (ja) * 2006-01-27 2007-08-09 Kojima Press Co Ltd 車両用マップライト
JP2007329450A (ja) * 2006-06-09 2007-12-20 Lg Electronics Inc 発光ユニット製作装置、発光ユニットのレンズ成形装置、発光素子パッケージ及び発光ユニット製造方法
JP2008519419A (ja) * 2004-11-05 2008-06-05 スリーエム イノベイティブ プロパティズ カンパニー 回路付きストリップを使用した照明組立品
JP2008131027A (ja) * 2006-11-22 2008-06-05 Lighthouse Technology Co Ltd ハイパワーダイオードホルダー構造とパッケージ組合わせ
JP2009123820A (ja) * 2007-11-13 2009-06-04 Fujikura Ltd 半導体素子実装用サブマウント及び光送受信モジュール
JP2010010298A (ja) * 2008-06-25 2010-01-14 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線基材及び半導体装置
US7737462B2 (en) 2003-02-28 2010-06-15 Citizen Electronics Co., Ltd Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode
JP2010206231A (ja) * 2005-10-04 2010-09-16 Samsung Electro-Mechanics Co Ltd 高出力発光ダイオードパッケージ
JP2012009622A (ja) * 2010-06-24 2012-01-12 Citizen Electronics Co Ltd 半導体発光装置
JP2012089816A (ja) * 2010-10-19 2012-05-10 Unistars Corp パッケージ基板及びその製造方法
EP2707646A4 (en) * 2011-05-09 2014-10-29 Microsoft Corp LOW-INDUSTRIAL LIGHT SOURCE MODULE
JP2015149515A (ja) * 2015-05-28 2015-08-20 シャープ株式会社 発光装置および照明機器
CN106024803A (zh) * 2015-03-31 2016-10-12 豪雅冠得股份有限公司 光照射模块

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH036850U (enrdf_load_stackoverflow) * 1989-06-05 1991-01-23
JPH03119769A (ja) * 1989-09-30 1991-05-22 Mitsubishi Cable Ind Ltd 発光モジュール
JPH04111767U (ja) * 1991-03-14 1992-09-29 株式会社小糸製作所 チツプ型発光ダイオードの取付構造
JP2000349348A (ja) * 1999-03-31 2000-12-15 Toyoda Gosei Co Ltd 短波長ｌｅｄランプユニット
US7594840B2 (en) 1999-04-22 2009-09-29 Osram Gmbh Method of encapsulating LED light source with embedded lens component
US7126273B2 (en) 1999-04-22 2006-10-24 Osram Gmbh LED light source with lens
US6746295B2 (en) 1999-04-22 2004-06-08 Osram-Opto Semiconductors Gmbh & Co. Ohg Method of producing an LED light source with lens
US6759803B2 (en) 1999-04-22 2004-07-06 Osram Opto Semiconductors Gmbh & Co. Ohg LED light source with lens and corresponding production method
GB2361581A (en) * 2000-04-20 2001-10-24 Lite On Electronics Inc A light emitting diode device
WO2003001253A3 (de) * 2001-06-20 2003-03-13 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement und verfahren zu seiner herstellung
US7256428B2 (en) 2001-06-20 2007-08-14 Osram Opto Semicondutors Gmbh Optoelectronic component and method for the production thereof
WO2003002909A1 (en) * 2001-06-27 2003-01-09 Showers International Pty Ltd Lamp mounting assembly for solid state light devices
US7745835B2 (en) 2003-02-28 2010-06-29 Citizen Electronics Co., Ltd. Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode
US7737462B2 (en) 2003-02-28 2010-06-15 Citizen Electronics Co., Ltd Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode
JP4912876B2 (ja) * 2003-05-05 2012-04-11 ラミナ ライティング インコーポレーテッド 高温動作用にパッケージ化された発光ダイオード
JP2006525679A (ja) * 2003-05-05 2006-11-09 ラミナ セラミックス インコーポレーテッド 高温動作用にパッケージ化された発光ダイオード
JP2006019598A (ja) * 2004-07-05 2006-01-19 Citizen Electronics Co Ltd 発光ダイオード
JP2006058487A (ja) * 2004-08-18 2006-03-02 Sony Corp 放熱装置及び表示装置
WO2006019085A1 (ja) * 2004-08-18 2006-02-23 Sony Corporation 放熱装置及び表示装置
US7663730B2 (en) 2004-08-18 2010-02-16 Sony Corporation Heat radiator and display unit
KR101206209B1 (ko) * 2004-11-05 2012-11-28 쓰리엠 이노베이티브 프로퍼티즈 컴파니 회로 스트립을 구비한 조명 조립체
JP2008519419A (ja) * 2004-11-05 2008-06-05 スリーエム イノベイティブ プロパティズ カンパニー 回路付きストリップを使用した照明組立品
JP4763709B2 (ja) * 2004-11-05 2011-08-31 スリーエム イノベイティブ プロパティズ カンパニー 回路付きストリップを使用した照明組立品
JP2006148127A (ja) * 2004-11-22 2006-06-08 Valeo Vision 三次元環境で相互接続された発光ダイオードの支持体の製造方法
JP2006332052A (ja) * 2005-05-23 2006-12-07 Valeo Vision Ｌｅｄを備える自動車用の照明装置または信号装置
JP2010206231A (ja) * 2005-10-04 2010-09-16 Samsung Electro-Mechanics Co Ltd 高出力発光ダイオードパッケージ
JP2007196872A (ja) * 2006-01-27 2007-08-09 Kojima Press Co Ltd 車両用マップライト
JP2007329450A (ja) * 2006-06-09 2007-12-20 Lg Electronics Inc 発光ユニット製作装置、発光ユニットのレンズ成形装置、発光素子パッケージ及び発光ユニット製造方法
JP2008131027A (ja) * 2006-11-22 2008-06-05 Lighthouse Technology Co Ltd ハイパワーダイオードホルダー構造とパッケージ組合わせ
JP2009123820A (ja) * 2007-11-13 2009-06-04 Fujikura Ltd 半導体素子実装用サブマウント及び光送受信モジュール
JP2010010298A (ja) * 2008-06-25 2010-01-14 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線基材及び半導体装置
JP2012009622A (ja) * 2010-06-24 2012-01-12 Citizen Electronics Co Ltd 半導体発光装置
US9748208B2 (en) 2010-06-24 2017-08-29 Citizen Electronics Co., Ltd. Light-emitting device
JP2012089816A (ja) * 2010-10-19 2012-05-10 Unistars Corp パッケージ基板及びその製造方法
EP2707646A4 (en) * 2011-05-09 2014-10-29 Microsoft Corp LOW-INDUSTRIAL LIGHT SOURCE MODULE
CN106024803A (zh) * 2015-03-31 2016-10-12 豪雅冠得股份有限公司 光照射模块
JP2016195177A (ja) * 2015-03-31 2016-11-17 Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 光照射モジュール
JP2015149515A (ja) * 2015-05-28 2015-08-20 シャープ株式会社 発光装置および照明機器

Also Published As

Publication number Publication date
JPH0447468B2 (enrdf_load_stackoverflow) 1992-08-04

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