JPS62196878A - Illumination system - Google Patents

Illumination system

Info

Publication number
JPS62196878A
JPS62196878A JP61038177A JP3817786A JPS62196878A JP S62196878 A JPS62196878 A JP S62196878A JP 61038177 A JP61038177 A JP 61038177A JP 3817786 A JP3817786 A JP 3817786A JP S62196878 A JPS62196878 A JP S62196878A
Authority
JP
Japan
Prior art keywords
conductive layer
light emitting
metal substrate
insulating layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61038177A
Other languages
Japanese (ja)
Other versions
JPH0447468B2 (en
Inventor
Masaru Sasaki
勝 佐々木
Hiroyuki Serizawa
芹沢　啓之
Tsutomu Machida
勉 町田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Priority to JP61038177A priority Critical patent/JPS62196878A/en
Publication of JPS62196878A publication Critical patent/JPS62196878A/en
Publication of JPH0447468B2 publication Critical patent/JPH0447468B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

PURPOSE:To readily manufacture an illuminator by directly arranging a light emitting element in an element containing recess to conduct it with a metal substrate, thereby eliminating the necessity of laminating an insulating layer and a conductive layer in the recess. CONSTITUTION:A plurality of element containing recesses 3 are formed at a suitable interval longitudinally on a metal substrate 1 made of a conductive material, and the surface except the recesses 3 is covered with an insulating layer 4. A common conductive layer 5 is so formed on the layer 4 as to extend longitudinally of the substrate 1. A light emitting element 2 is made of a semiconductor chip, directly disposed fixedly at the center on the bottom of each recess 3 to conduct with the substrate 1, and electrically connected via gold wirings 7 as leads with the conductive layer 10 of the element.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は多数の発光ダイオードを光源として使用する車
輌用灯具等に適用して好適な照明装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lighting device suitable for application to a vehicle lamp or the like that uses a large number of light emitting diodes as a light source.

〔従来の技術〕[Conventional technology]

近年、半導体技術の発達によシ輝度の高い発光ダイオー
ドが開発され、しかも安価に入手できるようになったこ
とから、車輌用灯具、特に尾灯。In recent years, with the development of semiconductor technology, high-brightness light-emitting diodes have been developed and are now available at low prices, making them suitable for vehicle lighting, especially taillights.

制動灯などの光源として電球の代シに使用することが検
討されるに至っておシ、その−例として第９図に示すも
のが知られている。すなわち、これは金属製の基板に発
光ダイオード等の発光素子２を配設した所謂オン・ホー
ドタイプと呼ばれるもので、基板１の傾面には反射面を
形成する多数の素子収納凹部３が各発光素子２に対応し
て形成され、また基板表面には前記凹部３を含めて全面
に亘って絶縁層４が印刷、蒸着等によって形成されさら
にその上に共通導電層５が、また各凹部３内には導電層
６がそれぞれ形成され、この導電層６上に前記発光素子
２が配設されている。そして、前記発光素子２は列（も
しくは行）毎に、金線７（ワイヤ）によって前記導電層
６を介して直列に接続され、また各列（もしくは行）の
発光素子は電源に対して並列に接続されている。なお、
端の発光素子２轟は前記共通導電層５に金線７＆によつ
て電気的に接続されている。The use of light bulbs as a light source for brake lights and the like in place of light bulbs has come under consideration, and the one shown in FIG. 9 is known as an example. That is, this is a so-called on-hold type in which light emitting elements 2 such as light emitting diodes are arranged on a metal substrate, and a large number of element housing recesses 3 forming reflective surfaces are formed on the inclined surface of the substrate 1. An insulating layer 4 is formed corresponding to the light emitting element 2, and an insulating layer 4 is formed on the entire surface of the substrate including the recesses 3 by printing, vapor deposition, etc. Further, a common conductive layer 5 is formed on the insulating layer 4 over the entire surface of the substrate including the recesses 3. A conductive layer 6 is formed therein, and the light emitting element 2 is disposed on the conductive layer 6. The light emitting elements 2 are connected in series via the conductive layer 6 by gold wires 7 (wires) in each column (or row), and the light emitting elements in each column (or row) are connected in parallel to the power supply. It is connected to the. In addition,
The light emitting element 2 at the end is electrically connected to the common conductive layer 5 by a gold wire 7&.

第１０図はこのような構成からなる照明装置の電気回路
を示し、Ｒは点灯用抵抗体である。FIG. 10 shows an electric circuit of a lighting device having such a configuration, where R is a lighting resistor.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかるに、かかる従来の照明装置においては、基板１の
表面全体に絶縁層４を蒸着等によって形成する際、素子
収納凹部３の内部に対しては絶縁層４を均一に形成する
ことが難しく、基板１と導電層８との絶縁性に問題があ
った。また、導電層６は凹部３内に形成されるものであ
るため、絶縁層４と同様均一な膜厚で形成することが難
しく製造コストが嵩むという不都合があった。However, in such a conventional lighting device, when forming the insulating layer 4 over the entire surface of the substrate 1 by vapor deposition or the like, it is difficult to uniformly form the insulating layer 4 inside the element housing recess 3, and the substrate There was a problem with the insulation between the conductive layer 1 and the conductive layer 8. Furthermore, since the conductive layer 6 is formed within the recess 3, it is difficult to form it with a uniform thickness like the insulating layer 4, which increases the manufacturing cost.

〔問題点を解決するだめの手段〕[Failure to solve the problem]

本発明に係る照明装置は上述したような問題を解決すべ
くなされたもので、多数の発光素子を光源とする照明装
置において、良導体からなる金属基板の表面に多数の素
子収納凹部を形成し、それ以外の表面を絶縁層にて被覆
し、各素子収納凹部に前記発光ダイオードをそれぞれ収
納配置して前記金属基板と電気的に導通させ、前記絶縁
層の表面に帯状の共通導電層を形成し、この共通導電層
と前記各発光素子をリード線によって電気的に接続し、
かつ前記金属基板と前記共通導ｔＮとを電源に接続する
ようにしたものである。The lighting device according to the present invention has been made to solve the above-mentioned problems, and in a lighting device using a large number of light emitting elements as a light source, a large number of element storage recesses are formed on the surface of a metal substrate made of a good conductor. The other surfaces are covered with an insulating layer, the light emitting diodes are housed in each element housing recess, and electrically conductive with the metal substrate, and a band-shaped common conductive layer is formed on the surface of the insulating layer. , electrically connecting the common conductive layer and each of the light emitting elements with lead wires;
Further, the metal substrate and the common conductor tN are connected to a power source.

〔作用〕[Effect]

本発明においては素子収納凹部内に発光素子を直接配設
し、金属基板との導通を計っているので、凹部内に絶縁
層と導電層を積層形成する必要がなく、製作が容易であ
る。In the present invention, since the light emitting element is directly disposed within the element housing recess and electrical conduction with the metal substrate is achieved, there is no need to laminate an insulating layer and a conductive layer within the recess, and manufacturing is easy.

〔実施例〕〔Example〕

以下、本発明を図面に示す実施例に基づいて詳細に説明
する。Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.

第１図は本発明に係る照明装置の基本的構成を示す断面
図、第２図は同装置の要部斜視図でろる〇なお、図中第
９図および第１Ｏ図と同一構成部材のものに対しては同
一符号を以って示し、その説明を省略する。これらの図
において、Ａｊ専の良導体からなる金属基板１０表面に
は複数個の素子収納凹部３がその長手方向に適宜な間隔
をおいて形成され、また凹部３を除く表面全体が絶縁層
４によって被覆されている。共通導電層５は金属基板１
の長手方向に延在する如く前記絶縁層４上に形成され、
さらにこの絶縁層４上には複数個のチップ状の導電層１
０が前記各素子収納凹部３に対応して形成されている。Fig. 1 is a sectional view showing the basic configuration of the lighting device according to the present invention, and Fig. 2 is a perspective view of the main parts of the device. The same reference numerals are used for the same reference numerals, and the explanation thereof will be omitted. In these figures, a plurality of element housing recesses 3 are formed at appropriate intervals in the longitudinal direction on the surface of a metal substrate 10 made of a good conductor made by AJ, and the entire surface except for the recesses 3 is covered with an insulating layer 4. Covered. Common conductive layer 5 is metal substrate 1
formed on the insulating layer 4 so as to extend in the longitudinal direction,
Further, on this insulating layer 4, a plurality of chip-shaped conductive layers 1 are provided.
0 is formed corresponding to each of the element housing recesses 3.

発光素子２は半導体チップからなり、各素子収納凹部３
の底面中央にそれぞれ直接配役固定されることにより金
属基板１と導通し、またリード線としての金線Ｔによっ
て当該素子に対応する前記導電層１０にそれぞれ電気的
に接続されている。The light emitting element 2 is made of a semiconductor chip, and each element storage recess 3
The elements are directly fixed to the center of the bottom surface of the element to be electrically connected to the metal substrate 1, and are electrically connected to the conductive layer 10 corresponding to the element by a gold wire T as a lead wire.

各導電層１０は前記共通導電層５に点灯用抵抗体Ｒを介
してそれぞれ接続されている。そして、金属基板１と共
通導電層５とはリード線１２．１３を介して電源（図示
せず）に接続されている。したがって、発光素子２は電
源に対して並列接続される。なお、前記点灯用抵抗体Ｒ
は印刷抵抗の方が小さく形成できる点で有効であシ、ま
たチップ抵抗でもよい。Each conductive layer 10 is connected to the common conductive layer 5 via a lighting resistor R, respectively. The metal substrate 1 and the common conductive layer 5 are connected to a power source (not shown) via lead wires 12.13. Therefore, the light emitting element 2 is connected in parallel to the power source. In addition, the lighting resistor R
A printed resistor is more effective in that it can be formed smaller, and a chip resistor may also be used.

前記素子収納凹部３は略逆梯形に形成されることにより
、その内壁面３ｍがアルミニウムの蒸着。The element storage recess 3 is formed in a substantially inverted trapezoidal shape, so that its inner wall surface 3m is coated with aluminum vapor deposition.

反射特性に優れた塗料の塗布等によって反射面を形成し
ている。この反射面は金属基板１の全体をメッキするこ
とによっても形成し得る。前記素子収納凹部３には透明
な樹脂１４が充填されて前記発光素子２をモールドして
いる。樹脂１４としてはエポキシ樹脂等が使用され、そ
の表面は略半球状に膨出形成されることによシ凸レンズ
を形成している。なお、第２図においては樹脂１４を省
略している。The reflective surface is formed by applying paint with excellent reflective properties. This reflective surface can also be formed by plating the entire metal substrate 1. The element housing recess 3 is filled with a transparent resin 14 to mold the light emitting element 2. Epoxy resin or the like is used as the resin 14, and its surface is bulged into a substantially hemispherical shape to form a convex lens. Note that the resin 14 is omitted in FIG. 2.

第３図は上記構成からなる照明装置の電気回路図で、１
５は電源を示す。FIG. 3 is an electrical circuit diagram of a lighting device having the above configuration.
5 indicates a power source.

第４図は上記照明装置を車輌用灯具として使用した場合
の例を示す断面図である。同図において、２１はバック
カバー、２２は前面レンズ、２３はインナーレンズ、２
４は放熱用孔である。インナーレンズ２３の表面には多
数の魚眼集光レンズ２５が各発光素子（図示せず）に対
応して形成されている。金属基板１自体の構造は第１図
および第２図に示したと全く同様である。FIG. 4 is a sectional view showing an example of the lighting device used as a vehicular lamp. In the figure, 21 is a back cover, 22 is a front lens, 23 is an inner lens, 2
4 is a hole for heat radiation. A large number of fisheye condensing lenses 25 are formed on the surface of the inner lens 23, corresponding to each light emitting element (not shown). The structure of the metal substrate 1 itself is exactly the same as shown in FIGS. 1 and 2.

かくして、このような構成からなる照明装置によれば、
金属基板１の良導体としての材質的特性をそのまま利用
し、発光素子２と該基板１とを導通さぜ、この基板１に
電流を流すようにしているので、第９図に示した従来装
置と異なシ累子収納凹部３内に絶縁層４と導電層とをｍ
ｔ＊形成する必要がなく、照明装置の製作が簡単かつ容
易である。Thus, according to the lighting device having such a configuration,
Since the material properties of the metal substrate 1 as a good conductor are utilized as they are, the light emitting element 2 and the substrate 1 are electrically connected, and a current is caused to flow through the substrate 1. Therefore, it is different from the conventional device shown in FIG. An insulating layer 4 and a conductive layer are placed in different shield housing recesses 3.
There is no need to form T*, and the manufacturing of the lighting device is simple and easy.

また、発光素子５と金属基板１との導通も確実である〇 第５図は本発明の他の実施例を示す要部斜視図、第６図
はその電気回路を示す図である。この実施例は第１図お
よび第２図に示した金属基板１を放熱器３０の表面に絶
縁層３１を介して複数個並列配置し、これらの金属基板
１をリード線３２によって直列に、また一部を並列に接
続したものである。この場合、各金属基板１はあらかじ
め発光素子２が実装されることによシュニット化されて
いる。放熱器３０はアルミニウム等からなシ、その裏面
には放熱効果を増大させる丸め複数の溝３４が形成され
ている。Furthermore, the electrical conduction between the light emitting element 5 and the metal substrate 1 is also ensured. FIG. 5 is a perspective view of a main part showing another embodiment of the present invention, and FIG. 6 is a diagram showing its electric circuit. In this embodiment, a plurality of metal substrates 1 shown in FIG. 1 and FIG. Some parts are connected in parallel. In this case, each metal substrate 1 is made into a schnitted structure by mounting the light emitting element 2 in advance. The heat sink 30 is made of aluminum or the like, and has a plurality of rounded grooves 34 formed on its back surface to increase the heat radiation effect.

このような構成においてはある１つの発光素子２が故障
した時、そのユニットだけ交換すればよいので、メイン
テナンスが簡単である。In such a configuration, when one light emitting element 2 breaks down, maintenance is easy because only that unit needs to be replaced.

第７図は本発明を車輌用灯具に適用した場合の他の実施
例を示す断面図である。なお、図中第４図および第５図
と同一構成部品に対しては同一符号を以って示す。放熱
器３０の光面にはユニット化された３つの金属基板１Ａ
、ＩＢ、１Ｃが配設されている。放熱器３０の表面は段
状に形成されることにより、上２つの金属基板１Ｂ、Ｉ
Ｃがその板厚分だけ前後にずれた状態で載置される２つ
の棚部４１．４２を有している。最下段の金属基板１Ａ
は灯具ボディ２１の内底面上に前記放熱器３０の下端部
表面に沿って立てられ、その上端部が２段目の金属基板
１Ｂの下端部と重なシ合い、かつコネクタ４４によって
互いに電気的に接続されている。コネクタ４４は金属基
板１人の背面に形成された嵌合凹部４４＆と、金属基板
１Ｂの表面に突設され前記嵌合凹部４４ｈに嵌合する金
属製のピン４４ｂ　とで構成されている。なお、２段目
の金祝基板１Ｂと三段目の金属基板１Ｃも同様のコネク
タによって電気的に接続されている。また、金属基板Ｉ
Ａ、１Ｂ、ＩＣをその板淳方向にずらして配役した理由
は、前面レンズ２２から各発光素子までの距離をほぼ等
しくシ、前面レンズ２２の表面全体を均一に照明するた
めである。FIG. 7 is a sectional view showing another embodiment in which the present invention is applied to a vehicle lamp. Components that are the same as those in FIGS. 4 and 5 are designated by the same reference numerals. Three unitized metal substrates 1A are provided on the light surface of the heat sink 30.
, IB, and 1C are arranged. The surface of the heatsink 30 is formed in a step shape, so that the upper two metal substrates 1B and I
It has two shelf parts 41 and 42 on which the board C is placed in a state shifted back and forth by the thickness of the board. Bottom metal board 1A
is erected on the inner bottom surface of the lamp body 21 along the lower end surface of the radiator 30, and its upper end overlaps the lower end of the second stage metal substrate 1B, and is electrically connected to each other by the connector 44. It is connected to the. The connector 44 includes a fitting recess 44& formed on the back side of one metal substrate, and a metal pin 44b protruding from the surface of the metal substrate 1B and fitting into the fitting recess 44h. It should be noted that the second-stage metal board 1B and the third-stage metal board 1C are also electrically connected by similar connectors. In addition, metal substrate I
The reason why A, 1B, and IC are shifted in the board direction is to make the distances from the front lens 22 to each light emitting element approximately equal and to uniformly illuminate the entire surface of the front lens 22.

このような構成からなる灯具においてもユニット化され
た金属基板ＩＡ、ＩＢ、ＩＣの交換が容易であることは
明らかであろう。It is obvious that even in a lamp having such a configuration, the unitized metal substrates IA, IB, and IC can be easily replaced.

第８図は本発明の更に他の実施例を示す要部断面図であ
る。本実施例は各金属基板１Ａ、ＩＢの表裏面に絶縁層
としてのフレキシブルプリント基板４を接着し、両基板
ＩＡ、ＩＢを導電層１０′によって電気的に接続し九も
のである。導電層１０’は右側の金属基板１Ｂの表面お
よび一側面にかけてフレキシブルプリント基板４上に形
成されている。一方、金属基板１人の金属基板１Ｂと対
向する側面はフレキシブルプリント基板４が接着されて
おらずむき出しで、前記導電／ｌ　１０’に接触してい
る。各基板ＩＡ、１Ｂの導電層１０′と発光素子２とは
リード線Ｔによって電気的に接続されている。したがっ
て、金属基板ＩＡ、１Ｂと発光素子２Ａ、２Ｂは、導電
層１０′およびリード線７を介して直列接続されている
。FIG. 8 is a sectional view of a main part showing still another embodiment of the present invention. In this embodiment, a flexible printed circuit board 4 as an insulating layer is adhered to the front and back surfaces of each metal substrate 1A, IB, and both substrates IA, IB are electrically connected by a conductive layer 10'. The conductive layer 10' is formed on the flexible printed circuit board 4 over the surface and one side of the right metal substrate 1B. On the other hand, the flexible printed circuit board 4 is not bonded to the side surface of the metal substrate facing the metal substrate 1B, and is exposed and in contact with the conductive layer 10'. The conductive layer 10' of each substrate IA, 1B and the light emitting element 2 are electrically connected by lead wires T. Therefore, the metal substrates IA, 1B and the light emitting elements 2A, 2B are connected in series via the conductive layer 10' and the lead wire 7.

なお、金属基板ＩＡ、ＩＢの接続において本実施は導電
層１０′を使用したが、適宜なソケットで接続してもよ
いことは勿論である。Although the conductive layer 10' was used in this embodiment to connect the metal substrates IA and IB, it goes without saying that they may be connected using an appropriate socket.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明に係る照明装置によれば、金
属基板と発光素子との電気的接続が確実にして、素子収
納凹部に絶縁層と導電箔を積層形成する必要がなく、製
作が容易で安価に提供することができる。As explained above, according to the lighting device according to the present invention, the electrical connection between the metal substrate and the light emitting element is ensured, there is no need to laminate an insulating layer and conductive foil in the element housing recess, and manufacturing is easy. can be provided at low cost.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明に係る照明装置の基本的構成を示す断面
図、第２図は同装置の要部斜視図、第３図は電気回路図
、第４図は本発明を車輌用灯具に適用した場合の実施例
を示す断面図、第５図は本発明の他の実施例を示す要部
斜視図、第６図はその電気回路図、第７図は本発明を車
輌用灯具に適用した場合の他の実施例を示す断面図、第
８図は不発明の他の実施例を示す断面図、第９図紘従来
の照明装置を示す要部断面図、第１０図は従来装置の電
気回路図である。 １・・・・金属基板、２．２ｍ・・・・　発光素子、３
・φ・・素子収納凹部、４・Φ・・絶縁層、５・・・・
共通導電層、６・・拳・導電層、７・・・・金線（ワイ
ヤ）、１０・・・・導電層、１５・・・・電源、Ｒ・・
・・点灯用抵抗体０特許出願人　　株式会社小糸製作所 代理人　山川政樹Ｃｌ’ｔか２名） 第８図 第９図 第１０図Fig. 1 is a cross-sectional view showing the basic configuration of the lighting device according to the present invention, Fig. 2 is a perspective view of the main parts of the device, Fig. 3 is an electric circuit diagram, and Fig. 4 is a vehicular lamp using the present invention. 5 is a perspective view of essential parts showing another embodiment of the present invention, FIG. 6 is an electric circuit diagram thereof, and FIG. 7 is a sectional view showing an embodiment in which the present invention is applied to a vehicle lamp. FIG. 8 is a sectional view showing another embodiment of the present invention, FIG. 9 is a sectional view of main parts of a conventional lighting device, and FIG. 10 is a sectional view of a conventional lighting device. It is an electrical circuit diagram. 1... Metal substrate, 2.2m... Light emitting element, 3
・φ...Element housing recess, 4・Φ...Insulating layer, 5...
Common conductive layer, 6... fist/conductive layer, 7... gold wire (wire), 10... conductive layer, 15... power supply, R...
...Lighting resistor 0 Patent applicant Koito Seisakusho Co., Ltd. Agent Masaki Yamakawa Cl't or two persons) Figure 8 Figure 9 Figure 10

Claims (1)

【特許請求の範囲】[Claims] 多数の発光素子を光源とする照明装置において、良導体
からなる金属基板の表面に多数の素子収納凹部を形成し
、それ以外の表面を絶縁層にて被覆し、前記各素子収納
凹部に前記発光素子をそれぞれ配設して前記金属基板と
電気的に導通させ、前記絶縁層の表面に前記発光素子に
対応して帯状の共通導電層を形成し、各発光ダイオード
と共通導電層をリード線によつて電気的に接続し、かつ
前記金属基板と前記共通導電層とを電源に接続したこと
を特徴とする照明装置。In a lighting device that uses a large number of light emitting elements as a light source, a large number of element storage recesses are formed on the surface of a metal substrate made of a good conductor, the other surface is covered with an insulating layer, and the light emitting elements are placed in each of the element storage recesses. A band-shaped common conductive layer is formed on the surface of the insulating layer corresponding to the light emitting element, and each light emitting diode and the common conductive layer are connected to each other by a lead wire. A lighting device characterized in that the metal substrate and the common conductive layer are electrically connected to each other, and the metal substrate and the common conductive layer are connected to a power source.
JP61038177A 1986-02-25 1986-02-25 Illumination system Granted JPS62196878A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61038177A JPS62196878A (en) 1986-02-25 1986-02-25 Illumination system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61038177A JPS62196878A (en) 1986-02-25 1986-02-25 Illumination system

Publications (2)

Publication Number Publication Date
JPS62196878A true JPS62196878A (en) 1987-08-31
JPH0447468B2 JPH0447468B2 (en) 1992-08-04

Family

ID=12518105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61038177A Granted JPS62196878A (en) 1986-02-25 1986-02-25 Illumination system

Country Status (1)

Country Link
JP (1) JPS62196878A (en)

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