JPS62196878A - Illumination system - Google Patents

Illumination system

Info

Publication number
JPS62196878A
JPS62196878A JP61038177A JP3817786A JPS62196878A JP S62196878 A JPS62196878 A JP S62196878A JP 61038177 A JP61038177 A JP 61038177A JP 3817786 A JP3817786 A JP 3817786A JP S62196878 A JPS62196878 A JP S62196878A
Authority
JP
Japan
Prior art keywords
recess
substrate
conductive layer
element
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61038177A
Other versions
JPH0447468B2 (en
Inventor
Tsutomu Machida
Masaru Sasaki
Hiroyuki Serizawa
Original Assignee
Koito Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Mfg Co Ltd filed Critical Koito Mfg Co Ltd
Priority to JP61038177A priority Critical patent/JPH0447468B2/ja
Publication of JPS62196878A publication Critical patent/JPS62196878A/en
Publication of JPH0447468B2 publication Critical patent/JPH0447468B2/ja
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PURPOSE: To readily manufacture an illuminator by directly arranging a light emitting element in an element containing recess to conduct it with a metal substrate, thereby eliminating the necessity of laminating an insulating layer and a conductive layer in the recess.
CONSTITUTION: A plurality of element containing recesses 3 are formed at a suitable interval longitudinally on a metal substrate 1 made of a conductive material, and the surface except the recesses 3 is covered with an insulating layer 4. A common conductive layer 5 is so formed on the layer 4 as to extend longitudinally of the substrate 1. A light emitting element 2 is made of a semiconductor chip, directly disposed fixedly at the center on the bottom of each recess 3 to conduct with the substrate 1, and electrically connected via gold wirings 7 as leads with the conductive layer 10 of the element.
COPYRIGHT: (C)1987,JPO&Japio
JP61038177A 1986-02-25 1986-02-25 Expired - Lifetime JPH0447468B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61038177A JPH0447468B2 (en) 1986-02-25 1986-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61038177A JPH0447468B2 (en) 1986-02-25 1986-02-25

Publications (2)

Publication Number Publication Date
JPS62196878A true JPS62196878A (en) 1987-08-31
JPH0447468B2 JPH0447468B2 (en) 1992-08-04

Family

ID=12518105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61038177A Expired - Lifetime JPH0447468B2 (en) 1986-02-25 1986-02-25

Country Status (1)

Country Link
JP (1) JPH0447468B2 (en)

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH036850U (en) * 1989-06-05 1991-01-23
JPH03119769A (en) * 1989-09-30 1991-05-22 Mitsubishi Cable Ind Ltd Light-emitting module
JPH04111767U (en) * 1991-03-14 1992-09-29
GB2361581A (en) * 2000-04-20 2001-10-24 Lite On Electronics Inc A light emitting diode device
WO2003001253A2 (en) * 2001-06-20 2003-01-03 Osram Opto Semiconductors Gmbh Optoelectronic component and method for the production thereof
WO2003002909A1 (en) * 2001-06-27 2003-01-09 Showers International Pty Ltd Lamp mounting assembly for solid state light devices
US6746295B2 (en) 1999-04-22 2004-06-08 Osram-Opto Semiconductors Gmbh & Co. Ohg Method of producing an LED light source with lens
JP2006019598A (en) * 2004-07-05 2006-01-19 Citizen Electronics Co Ltd Light emitting diode
WO2006019085A1 (en) * 2004-08-18 2006-02-23 Sony Corporation Heat-dissipating device and display
JP2006148127A (en) * 2004-11-22 2006-06-08 Valeo Vision Manufacturing method of support of light emitting diode interconnected in three-dimensional environment
JP2006525679A (en) * 2003-05-05 2006-11-09 ラミナ セラミックス インコーポレーテッド Light emitting diode packaged for high temperature operation
JP2006332052A (en) * 2005-05-23 2006-12-07 Valeo Vision Lighting system or signaling system for automobiles equipped with led
JP2007196872A (en) * 2006-01-27 2007-08-09 Kojima Press Co Ltd Vehicular map light
JP2007329450A (en) * 2006-06-09 2007-12-20 Lg Electronics Inc Apparatus and method for manufacturing light emitting unit, apparatus for molding lens of light emitting unit, and light emitting device package
JP2008131027A (en) * 2006-11-22 2008-06-05 Lighthouse Technology Co Ltd Combination of high power diode holder structure and high power diode package
JP2008519419A (en) * 2004-11-05 2008-06-05 スリーエム イノベイティブ プロパティズ カンパニー Lighting assembly using strip with circuit
JP2009123820A (en) * 2007-11-13 2009-06-04 Fujikura Ltd Sub-mount for mounting semiconductor element, and optical transmission and reception module
JP2010010298A (en) * 2008-06-25 2010-01-14 Mitsui Mining & Smelting Co Ltd Flexible printed wiring base material and semiconductor apparatus
US7737462B2 (en) 2003-02-28 2010-06-15 Citizen Electronics Co., Ltd Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode
JP2010206231A (en) * 2005-10-04 2010-09-16 Samsung Electro-Mechanics Co Ltd High power light-emitting diode package
JP2012009622A (en) * 2010-06-24 2012-01-12 Citizen Electronics Co Ltd Semiconductor light-emitting device
JP2012089816A (en) * 2010-10-19 2012-05-10 Unistars Corp Package substrate and method of manufacturing the same
EP2707646A2 (en) * 2011-05-09 2014-03-19 Microsoft Corporation Low inductance light source module
JP2015149515A (en) * 2015-05-28 2015-08-20 シャープ株式会社 Light-emitting device and illumination apparatus
JP2016195177A (en) * 2015-03-31 2016-11-17 Hoya Candeo Optronics株式会社 Light irradiation module

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH036850U (en) * 1989-06-05 1991-01-23
JPH03119769A (en) * 1989-09-30 1991-05-22 Mitsubishi Cable Ind Ltd Light-emitting module
JPH04111767U (en) * 1991-03-14 1992-09-29
US6746295B2 (en) 1999-04-22 2004-06-08 Osram-Opto Semiconductors Gmbh & Co. Ohg Method of producing an LED light source with lens
US7126273B2 (en) 1999-04-22 2006-10-24 Osram Gmbh LED light source with lens
US7594840B2 (en) 1999-04-22 2009-09-29 Osram Gmbh Method of encapsulating LED light source with embedded lens component
US6759803B2 (en) 1999-04-22 2004-07-06 Osram Opto Semiconductors Gmbh & Co. Ohg LED light source with lens and corresponding production method
GB2361581A (en) * 2000-04-20 2001-10-24 Lite On Electronics Inc A light emitting diode device
US7256428B2 (en) 2001-06-20 2007-08-14 Osram Opto Semicondutors Gmbh Optoelectronic component and method for the production thereof
WO2003001253A2 (en) * 2001-06-20 2003-01-03 Osram Opto Semiconductors Gmbh Optoelectronic component and method for the production thereof
WO2003001253A3 (en) * 2001-06-20 2003-03-13 Osram Opto Semiconductors Gmbh Optoelectronic component and method for the production thereof
WO2003002909A1 (en) * 2001-06-27 2003-01-09 Showers International Pty Ltd Lamp mounting assembly for solid state light devices
US7737462B2 (en) 2003-02-28 2010-06-15 Citizen Electronics Co., Ltd Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode
US7745835B2 (en) 2003-02-28 2010-06-29 Citizen Electronics Co., Ltd. Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode
JP4912876B2 (en) * 2003-05-05 2012-04-11 ラミナ ライティング インコーポレーテッド Light emitting diode packaged for high temperature operation
JP2006525679A (en) * 2003-05-05 2006-11-09 ラミナ セラミックス インコーポレーテッド Light emitting diode packaged for high temperature operation
JP2006019598A (en) * 2004-07-05 2006-01-19 Citizen Electronics Co Ltd Light emitting diode
JP2006058487A (en) * 2004-08-18 2006-03-02 Sony Corp Heat radiating device and display device
JP4706206B2 (en) * 2004-08-18 2011-06-22 ソニー株式会社 Heat dissipation device and display device
WO2006019085A1 (en) * 2004-08-18 2006-02-23 Sony Corporation Heat-dissipating device and display
US7663730B2 (en) 2004-08-18 2010-02-16 Sony Corporation Heat radiator and display unit
JP4763709B2 (en) * 2004-11-05 2011-08-31 スリーエム イノベイティブ プロパティズ カンパニー Lighting assembly using strip with circuit
KR101206209B1 (en) * 2004-11-05 2012-11-28 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Illumination assembly with circuitized strips
JP2008519419A (en) * 2004-11-05 2008-06-05 スリーエム イノベイティブ プロパティズ カンパニー Lighting assembly using strip with circuit
JP2006148127A (en) * 2004-11-22 2006-06-08 Valeo Vision Manufacturing method of support of light emitting diode interconnected in three-dimensional environment
JP2006332052A (en) * 2005-05-23 2006-12-07 Valeo Vision Lighting system or signaling system for automobiles equipped with led
JP2010206231A (en) * 2005-10-04 2010-09-16 Samsung Electro-Mechanics Co Ltd High power light-emitting diode package
JP4551336B2 (en) * 2006-01-27 2010-09-29 小島プレス工業株式会社 Vehicle map light
JP2007196872A (en) * 2006-01-27 2007-08-09 Kojima Press Co Ltd Vehicular map light
JP2007329450A (en) * 2006-06-09 2007-12-20 Lg Electronics Inc Apparatus and method for manufacturing light emitting unit, apparatus for molding lens of light emitting unit, and light emitting device package
JP2008131027A (en) * 2006-11-22 2008-06-05 Lighthouse Technology Co Ltd Combination of high power diode holder structure and high power diode package
JP2009123820A (en) * 2007-11-13 2009-06-04 Fujikura Ltd Sub-mount for mounting semiconductor element, and optical transmission and reception module
JP2010010298A (en) * 2008-06-25 2010-01-14 Mitsui Mining & Smelting Co Ltd Flexible printed wiring base material and semiconductor apparatus
US9748208B2 (en) 2010-06-24 2017-08-29 Citizen Electronics Co., Ltd. Light-emitting device
JP2012009622A (en) * 2010-06-24 2012-01-12 Citizen Electronics Co Ltd Semiconductor light-emitting device
JP2012089816A (en) * 2010-10-19 2012-05-10 Unistars Corp Package substrate and method of manufacturing the same
EP2707646A2 (en) * 2011-05-09 2014-03-19 Microsoft Corporation Low inductance light source module
EP2707646A4 (en) * 2011-05-09 2014-10-29 Microsoft Corp Low inductance light source module
JP2016195177A (en) * 2015-03-31 2016-11-17 Hoya Candeo Optronics株式会社 Light irradiation module
JP2015149515A (en) * 2015-05-28 2015-08-20 シャープ株式会社 Light-emitting device and illumination apparatus

Also Published As

Publication number Publication date
JPH0447468B2 (en) 1992-08-04

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