JP2015149515A - Light-emitting device and illumination apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device that effectively reduces optical loss, improves effective light-emitting efficiency (utilization efficiency) as a whole system, and achieves to decrease thickness.SOLUTION: A light-emitting device 1 includes: a substrate 10; a light-emitting element chip 11 mounted on the substrate 10; an encapsulation part 12 for encapsulating the light-emitting element chip 11; and light scattering parts 15 disposed on the substrate 10 separated from the encapsulation part 12. The light scattering parts 15 are formed in an annular shape surrounding the encapsulation part 12 in top view. The encapsulation part 12 and the light scattering parts 15 are disposed in mutually separated regions in top view.

Description

The present invention relates to a light emitting device and a lighting device including a light emitting element chip placed on a substrate and a sealing portion that seals the light emitting element chip.

  Recently, power saving has been promoted as an environmental measure, and the use of LEDs (Light Emitting Diodes) in a backlight light source device and a lighting device of a liquid crystal display device used for output display of a personal computer is rapidly progressing.

  In addition, liquid crystal television receivers are becoming LED-type backlight light source devices, and the direct light system in which LEDs are arranged facing the plane of the liquid crystal panel or the edge light system in which LEDs are arranged on the end face side of the liquid crystal panel The backlight light source device has been commercialized.

  In the edge light system, an LED is disposed as a light source device on the end face side of a light guide plate disposed to face the plane of a liquid crystal panel, and is suitable for thinning compared to a direct system. Patent Document 1 has been proposed as an example of a backlight light source device that emits white light in an edge light system.

  In addition, as a light emitting device that emits white light used in the edge light system, a lead frame mounted with an LED is fixed on the package body, and a light reflecting layer that reflects light from the LED is provided on the package body to be formed at low cost. Have been proposed (see, for example, Patent Document 2). A light emitting device to which a lead frame is applied has a problem in heat dissipation, etc. When a higher luminance and a larger number of LEDs are required like a liquid crystal television receiver, the heat dissipation, reliability, etc. May cause problems.

  As a structure for improving heat dissipation, a light emitting device using a package structure with a built-in heat dissipation slug or a ceramic substrate having high heat dissipation and covering an LED chip with a dome-shaped sealing portion is known. (For example, a product of Lumileds). However, problems also arise in such a structure.

  For example, a dome-shaped sealing portion for enhancing light extraction increases the light extraction efficiency to the outside, and increases the amount of light incident on the light guide plate of the backlight light source device to which the LED light emitting device is applied. It is done. However, since the height of the light source device is increased due to the dome shape of the sealing portion, when the LED light emitting device is applied to the backlight light source device, the area where the LED light emitting device is arranged becomes larger, and thus the liquid crystal display There exists a problem that the area of the frame part of an apparatus will become large.

  In an LED light-emitting device using a dome-shaped sealing portion, it is possible to effectively use light radiated laterally (side direction / horizontal direction) with respect to the optical axis formed by the dome-shaped sealing portion. Have difficulty. For example, when the LED light-emitting device is applied to a backlight light source device, the reflection sheet is installed on the side surface of the backlight light source device, so that the light traveling from the LED (sealing part) to the reflection sheet is reflected sheet Reflected by. Accordingly, the light emitted from the side surface of the LED is reflected by the reflection sheet, and then returns to the LED again. A part of the light is absorbed by the phosphor, LED chip, and substrate contained in the sealing portion, Cause loss.

That is, in the worst case, the light extraction efficiency from the sealing portion improved by adopting the dome-shaped sealing portion (lens structure) is the efficiency of the coupling between the light guide plate and the light emitting device. May be offset by decline.

  Further, such a decrease in coupling efficiency occurs not only in the dome-shaped sealing portion but also in the case of a rectangular parallelepiped sealing portion (for example, see Patent Document 3). That is, the light emitted from the side surface of the LED chip is subjected to the same action as that of the dome-shaped sealing portion, and there is a possibility that the light generated by the LED cannot be effectively used.

  Further, the above-described conventional LED light-emitting device needs to use a mold in fixing the lead frame and forming the sealing portion. The molding method using the mold has a problem that the mold and the molding apparatus are very expensive and the initial equipment cost is high. Moreover, since it is necessary to raise | generate a metal mold | die newly with respect to the design change of a molded object, a metal mold | die cost is required and a design change and cost are also required.

JP 2008-277189 A JP 2007-0195505 A JP 2005-005482 A

The present invention has been made in view of such circumstances, by providing the light scattering portion which is placed away from the sealing portion for sealing the light emitting device chip mounted on the substrate, the sealing portion To provide a light-emitting device and a lighting device that can effectively reduce the light loss by suppressing the return of light to the light source, improve the effective light-emitting efficiency (utilization efficiency) of the entire system, and reduce the thickness. Objective.

A light emitting device according to the present invention is a light emitting device including a substrate, a light emitting element chip mounted on the substrate, and a sealing portion that seals the light emitting element chip, and is separated from the sealing portion. A light scattering portion disposed on the substrate, wherein the light scattering portion is formed in an annular shape surrounding the sealing portion in a top view, and the sealing portion and the light scattering portion are mutually in a top view. It is characterized by being arranged in a separated area.

In the light emitting device according to the present invention, the light emitting element chip is a flip chip, and the sealing portion is provided corresponding to the surface side of the light emitting element chip and is formed of a translucent resin containing a phosphor. It is good also as the structure currently made.

In the light emitting device according to the present invention, the substrate may have a configuration in which an inner layer portion includes a metal plate and an insulating layer is formed on a surface thereof.

In the light emitting device according to the present invention, the height of the light scattering portion from the substrate may be the same as or higher than the height of the sealing portion from the substrate.

The lighting equipment according to the present invention includes the light emitting device according to the present invention.

According to the present invention, since the light scattering portion is provided at a position away from the sealing portion, the light emitted from the light emitting element chip is emitted to the outside of the sealing portion, and the light emitted from the sealing portion is scattered. The light loss is caused by reflection / absorption at the components when entering the external optical member disposed directly above the sealing portion because the light is scattered at the portion and converted into light directed to the external optical member as an irradiation target. As much as possible, the light can be directly incident, and the coupling efficiency to the external optical member can be increased. Moreover, since it is not necessary to make the sealing portion into a lens shape, it is possible to reduce the outer shape.

It is a top view which shows the planar state of the light-emitting device which concerns on Embodiment 1 of this invention. It is a conceptual diagram which shows the arrangement | positioning state when the light-emitting plate shown to FIG. 1A is applied to the light-guide plate of a backlight apparatus. It is a top view which shows the planar state of the light-emitting device (modification 1) which concerns on Embodiment 2 of this invention. It is a top view which shows the planar state of the light-emitting device (modification 2) which concerns on Embodiment 2 of this invention. It is a top view which shows the planar state of the light-emitting device (modification 3) which concerns on Embodiment 2 of this invention. It is a top view which shows the planar state of the light-emitting device (modification 4) which concerns on Embodiment 2 of this invention. It is a top view which shows the planar state of the light-emitting device (modification 5) which concerns on Embodiment 2 of this invention. It is a top view which shows the planar state of the light-emitting device (modification 6) which concerns on Embodiment 2 of this invention. It is the side view which shows the side surface state which looked at the light-emitting device shown to FIG. 2F from the arrow 2G direction. It is a top view which shows the planar state of the light-emitting device (modification 7) which concerns on Embodiment 2 of this invention. It is the side view which shows the side surface state which looked at the light-emitting device shown to FIG. 2H from the arrow 2J direction. It is a top view which shows the planar state of the light-emitting device (modification 8) which concerns on Embodiment 2 of this invention. It is a top view which shows the planar state of the light-emitting device (modification 9) which concerns on Embodiment 3 of this invention. It is sectional drawing which shows as a cross-sectional state which looked at the light-emitting device shown to FIG. 3A in the arrow 3B direction. It is a side view which shows notionally the arrangement state of the surface light source device which concerns on Embodiment 4 of this invention, and the liquid crystal display device to which the surface light source device is applied. FIG. 4B is a plan view conceptually showing a planar state when the surface light source device and the liquid crystal display device shown in FIG. 4A are viewed at the position of an arrow 4B. It is a top view which shows the planar state of the surface light source device shown to FIG. 4A. It is a top view which shows the planar state which mounted the light emitting element chip | tip in the board | substrate at the manufacturing process of the manufacturing method of the light-emitting device which concerns on this Embodiment. It is an expanded sectional view which expands and shows the section state in the manufacturing process shown in Drawing 5A. It is a top view which shows the planar state which mounted the resin molding frame member for sealing a light emitting element chip | tip in the manufacturing process of the manufacturing method of the light-emitting device which concerns on this Embodiment. It is an expanded sectional view which expands and shows the section state in the manufacturing process shown in Drawing 5C. It is a top view which shows the planar state which inject | poured the translucent resin for sealing to the through hole of the frame member for resin molding in the manufacturing process of the manufacturing method of the light-emitting device which concerns on this Embodiment. It is an expanded sectional view which expands and shows the section state in the middle of the manufacturing process shown in Drawing 5E. It is a top view which shows the planar state which formed the sealing part and peeled the resin molding frame member from the board | substrate at the manufacturing process of the manufacturing method of the light-emitting device which concerns on this Embodiment. It is an enlarged side view which expands and shows the side surface state in the manufacturing process shown to FIG. 5G. It is a top view which shows the planar state after forming a light-scattering part in the manufacturing process of the manufacturing method of the light-emitting device which concerns on this Embodiment. FIG. 5B is an enlarged side view showing an enlarged side surface state during the manufacturing process shown in FIG. 5J. It is a top view which shows a planar state when a collective substrate is divided | segmented into each board | substrate at the manufacturing process of the manufacturing method of the light-emitting device which concerns on this Embodiment. It is an enlarged side view which expands and shows the side surface state in the manufacturing process shown to FIG. 5L. FIG. 5B is an enlarged plan view showing, in an enlarged manner, the planar state of the substrates individually divided in the manufacturing process shown in FIG. 5L.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Embodiment 1>
With reference to FIG. 1A and FIG. 1B, the light-emitting device which concerns on this Embodiment is demonstrated.

  FIG. 1A is a plan view showing a planar state of the light-emitting device according to Embodiment 1 of the present invention.

  The light emitting device 1 according to the present embodiment includes a substrate 10, a light emitting element chip 11 placed on the substrate 10, and a sealing portion 12 that seals the light emitting element chip 11. In addition, the light emitting device 1 includes a light scattering portion 15 disposed on the substrate 10 so as to face the sealing portion 12 apart from the sealing portion 12.

  Therefore, since the light emitting device 1 has the light scattering portion 15 at a position away from the sealing portion 12, the light emitted from the light emitting element chip 11 is emitted to the outside of the sealing portion 12 and from the sealing portion 12. Since the light LL1 emitted in the horizontal direction is scattered by the light scattering portion 15 and converted to light directed to an external optical member (for example, the light guide plate 38 shown in FIG. 1B) as an irradiation target, the light LL1 is directly above the sealing portion 12. When light is incident on the arranged external optical member (light guide plate 38), light loss caused by reflection / absorption at the constituent members can be reduced as much as possible to allow direct light incident, and the coupling efficiency to the external optical member is increased. be able to.

  The substrate 10 is a ceramic substrate on which an appropriate wiring pattern (not shown in FIG. 1A, illustrated in FIGS. 2A to 2K) is formed. A light emitting element chip 11 formed of an LED (Light Emitting Diode) chip is mounted corresponding to the wiring pattern and is appropriately connected via a wire 13. 1A shows a state where two light emitting element chips 11 are connected in series, it is also possible to connect them in parallel. The connection form may be appropriately set according to required electrical characteristics and optical characteristics.

  It is also possible to apply a metal core substrate with high heat dissipation having a metal plate in the inner layer portion and having an insulating layer formed on the surface, instead of the ceramic substrate. In addition, when high heat dissipation characteristics are not required so much, instead of a substrate material with good heat dissipation, an insulating substrate made of single-layer or multilayer resin such as a printed wiring board may be used. The planar shape of the substrate 10 can be about 3 mm to 4 mm square, for example.

  The electrode of the light emitting element chip 11 may have any form. For example, there are a flip chip method, a device in which anode electrodes / cathode electrodes are separately arranged on both upper and lower surfaces of a chip, and a device in which both anode electrodes / cathode electrodes are provided on the surface of the chip. Connection to the electrode includes application of a wire, ball connection with a bump electrode, and the like depending on the form of the anode electrode / cathode electrode of the light emitting element chip 11.

  The light emitting element chip 11 has a rectangular parallelepiped shape, and has a rectangular shape in plan view. The anode electrode / cathode electrode is formed in the vicinity of both ends in the longitudinal direction of the rectangle so as to be opposed to each other on the surface of the light emitting element chip 11. The light emitting element chip 11 is arranged so that the long side of the light emitting element chip 11 is parallel to one side of the substrate 10. There may be one light emitting element chip 11 or a plurality of light emitting element chips 11. FIG. 1A shows a state in which two light emitting element chips 11 are arranged.

  The plurality of light emitting element chips 11 are preferably arranged such that the long sides of each light emitting element chip 11 are parallel. With such an arrangement, the area viewed from the upper surface of the sealing portion 12 covering the light emitting element chip 11 described later can be reduced.

  The periphery of the light emitting element chip 11 is covered with a rectangular parallelepiped sealing portion 12 so as to cover the light emitting element chip 11. The sealing portion 12 is formed of a sealing light-transmitting resin 12r (see FIG. 5F) including a phosphor (which is a minute particle and is not shown in view of ease of drawing). That is, the sealing part 12 contains a phosphor. The sealing translucent resin 12r will be further described with reference to FIG. 5F.

  The phosphor absorbs part of the light from the light emitting element chip 11 and emits fluorescence of another wavelength. Therefore, white light can be emitted by the color mixture of the fluorescence converted and emitted by the phosphor and the light from the light emitting element chip 11. That is, since the light emitting device 1 adjusts the wavelength of the light emitted by the wavelength conversion of the phosphor particles, the light emitting device 1 can generate light having an appropriate wavelength.

  The planar shape of the substrate 10 is a quadrilateral, and the sealing portion 12 and the light scattering portion 15 are linearly extended so as to be parallel to, for example, one side 10 h of the substrate 10. Therefore, the light-emitting device 1 can ensure the controllability of light scattering easily and with high accuracy, and can improve productivity.

  The light scattering portion 15 is separated so as to open the end portion 12t of the sealing portion 12. That is, between the two light scattering portions 15, the end 12t has a shape exposed in the longitudinal direction (side surface in the longitudinal direction). Therefore, the light emitting device 1 can adjust the light scattering direction by the light scattering unit 15 by limiting the main direction exerting control by the light scattering unit 15 to the direction intersecting the light scattering unit 15 (longitudinal direction).

  For example, the light scattering portion 15 is arranged in parallel to one side 10h and extends linearly. Further, the end portion 15t of the light scattering portion 15 is formed in an approximately rounded arc shape and a substantially spherical shape. The cross section perpendicular to the longitudinal direction of the light scattering portion 15 is preferably a substantially semicircular shape or a convex shape whose outer periphery protrudes from the substrate 10.

  The end portion 12 t of the sealing portion 12 and the end portion 15 t of the light scattering portion 15 are disposed inside the peripheral edge of the substrate 10. Therefore, the light emitting device 1 can control the arrangement of the sealing portion 12 and the light scattering portion 15 with high accuracy, and an aggregate substrate 10s (see FIGS. 5A to 5M) in which a plurality of substrates 10 are juxtaposed. Productivity when dividing and manufacturing the substrate 10 can be improved.

  A distance Ls from the end 15t of the light scattering portion 15 to the periphery of the substrate 10 is shorter than a distance Lp from the end 12t of the sealing portion 12 to the periphery of the substrate 10. Therefore, the light emitting device 1 can effectively exert the action of the light scattering portion 15 on the light emitted from the end portion 12t of the sealing portion 12.

  In other words, the end 15t of the light scattering portion 15 is preferably extended so as to extend from the end 12t of the sealing portion 12 to the vicinity of the periphery of the substrate 10. With this configuration, light emitted from both end portions 12t of the sealing portion 12 can be acted on by the light scattering portion 15, and thus is sufficiently scattered. Light can be directed from the position 15 to the outside.

  The light scattering part 15 is light emitted from the light emitting element chip 11 in the lateral direction (chip side surface direction) out of light emitted from the light emitting element chip 11 or the phosphor and emitted to the outside (air) of the sealing part 12. And at least part of the scattered light is emitted (scattered) toward the opposite side of the substrate 10 in the vertical direction of the substrate 10.

  The height from the surface of the substrate 10 to the top surface of the light scattering portion 15 (the height of the vertex 15c) is the height from the surface of the substrate 10 to the top surface of the sealing portion 12 (the height of the top surface 12c). ) Or more. That is, the height of the light scattering portion 15 from the substrate 10 is preferably the same as or higher than the height of the sealing portion 12 from the substrate 10. With this configuration, the light emitted from the sealing portion 12 is easily affected by the light scattering portion 15, and the light LL2 can be further directed in the external direction (the external direction in the vertical direction of the substrate 10). .

  The light scattering portion 15 is formed of a translucent resin 15r (further described with reference to FIG. 5K) containing a light diffusing material (for example, titanium oxide: TiO2). Therefore, the light emitting device 1 can easily and accurately control the light diffusibility of the light scattering portion 15.

  The light diffusing material contained in the light scattering portion 15 is uniformly dispersed in the translucent resin 15r (see FIG. 5K) that is the base material of the light scattering portion 15. As the light diffusing material, SiO2, ZnO, polystyrene particles or the like can be used in addition to TiO2. Further, TiO2 as a light diffusing material and silica (SiO2) as a thickening material may be mixed and uniformly dispersed in the translucent resin 15r.

  The sealing part 12 may be configured to contain the phosphor dispersed in the whole, but the first sealing part 12f that contains the phosphor and seals the light emitting element chip 11; It is also possible to employ a form including a second sealing portion 12 s that overlaps the sealing portion 12 f. The second sealing portion 12s is formed of a sealing translucent resin that does not contain a phosphor.

  With this configuration, the light emitting device 1 limits the generation of light emitted by the wavelength conversion of the phosphor particles to the range of the first sealing portion 12f, and thus is emitted from the surface of the second sealing portion 12s into the space. The ratio of light having a small incident angle can be increased, and the ratio of light having an incident angle smaller than the critical angle causing total reflection on the surface of the second sealing portion 12s is increased and emitted to the outside. Can increase the light to be.

  That is, the light emitting device 1 limits the light generation source to the range of the first sealing portion 12f (the phosphor particles function as a point light source and the light emitting element chip 11 functions as a surface light source), and the light generation source. Since the light emitted from the light is emitted into the air (outside) by the second sealing portion 12s, the extraction efficiency can be improved. Further, since the second sealing portion 12s is disposed on the first sealing portion 12f, the surface of the second sealing portion 12s from the phosphor particles / light emitting element chip 11 acting as a point light source / surface light source ( The distance to the air interface) becomes longer. Therefore, the ratio of the light emitted from the phosphor particles and the light emitting element chip 11 is small although the incident angle is small with respect to the surface of the second sealing portion 12s that is the interface with air. In other words, the proportion of light having an incident angle smaller than the critical angle causing total reflection on the surface of the second sealing portion 12s increases, and the light emitted from the second sealing portion 12s to the outside increases. Is possible.

  Further, the sealing part 12 constituted by the first sealing part 12f and the second sealing part 12s has a quadrilateral shape in a plan view. Moreover, since the light-scattering part 15 is arrange | positioned on both sides, it becomes a rectangle which has a longitudinal direction as a basic shape. That is, one side in the longitudinal direction of the sealing portion 12 is parallel to one side 10 h of the substrate 10. Further, it is desirable that the sealing portion 12 is disposed at the center portion of the substrate 10. In addition, even if the basic shape is a rectangle, it is also possible to chamfer an arc at the corner. In the case of FIG. 1A, the four corners of the rectangle are semicircular arcs.

  When a flip chip is used as the light emitting element chip 11, the first sealing portion 12 f is formed so as to correspond only to the surface side of the chip, and the first sealing portion 12 f and the light emitting element chip 11 are covered so as to cover the first sealing portion 12 f. It is also possible to form the two sealing portions 12s.

  The first sealing portion 12f is formed of, for example, a sealing translucent resin containing a phosphor, and the second sealing portion 12s is formed of, for example, a sealing translucent resin that does not contain a phosphor. Is done. A specific method for manufacturing the sealing portion 12 (the first sealing portion 12f and the second sealing portion 12s) is illustrated in FIG. 5F.

  A light scattering portion 15 parallel to one side 10 h of the substrate 10 is formed outside the sealing portion 12 at a position away from the sealing portion 12 along the longitudinal direction of the sealing portion 12. Since the light scattering portions 15 are disposed on both sides of the sealing portion 12, they are formed along the sides of the substrate 10. That is, each light scattering portion 15 extends along the longitudinal direction of the sealing portion 12 and is formed on the inner side of the peripheral edge of the substrate 10.

  The light scattering portion 15 is formed along two sides of the substrate 10 and is not extended (formed) with respect to the remaining sides. Therefore, the end portion 12t in the longitudinal direction of the sealing portion 12 is not shielded by the light scattering portion 15 when viewed from the side surface corresponding to the surface of the substrate 10 and the position where the longitudinal direction of the sealing portion 12 is extended. It has an exposed configuration. That is, the two light scattering portions 15 are formed facing each other so as to open the end portion 12 t in the longitudinal direction of the sealing portion 12.

  The operation of the light emitting device 1 according to the present embodiment will be compared and described assuming that the sealing unit 12 and the light scattering unit 15 are brought into contact with each other without separating the sealing unit 12 and the light scattering unit 15.

  When the sealing portion 12 and the light scattering portion 15 are brought into contact with each other, the light emitted from the light emitting element chip 11 and the phosphor is not the surface (top surface 12c) of the sealing portion 12 but the side surface 12d (see FIG. 1B). ) From the light scattering portion 15 to the light scattering portion 15 is scattered by the light scattering portion 15, and part of the light reaches the surface of the substrate 10 and the light emitting element chip 11, and a part of the reached light is absorbed. In addition, among the light radiated toward the surface of the sealing portion 12, the light incident at an incident angle greater than the critical angle is totally reflected by the surface of the sealing portion 12, and thus the surface of the substrate 10 and the light emission. A part of the light reaching the element chip 11 is absorbed.

  That is, when the sealing portion 12 and the light scattering portion 15 are brought into contact with each other, the light from the light emitting element chip 11 is not taken out of the sealing portion 12 and is emitted from the constituent members (the substrate 10 and the light scattering portion 15) and the light emission. The probability that light loss will occur due to absorption by the element chip 11 increases.

  On the other hand, in the light emitting device 1 according to the present embodiment, the light emitted from the light emitting element chip 11 and the phosphor is sealed by adopting a configuration in which the sealing portion 12 and the light scattering portion 15 are separated from each other. It can be taken out of the part 12 as it is. Therefore, reflection and absorption by the constituent members arranged around the sealing portion 12 can be suppressed as much as possible, and light loss can be minimized.

  FIG. 1B is a conceptual diagram illustrating an arrangement state when the light-emitting device illustrated in FIG. 1A is applied to a light guide plate of a backlight device. Note that the wire 13 shown in FIG. 1A is omitted in view of easy viewing.

  The operation of the light emitting device 1 will be described by exemplifying a case where the present invention is applied to an edge light type backlight device including the light guide plate 38. The light guide plate 38 as an external optical member includes a light emitting surface 38s and an incident end surface 38t. The light emitting device 1 as a light source is disposed to face the incident end face 38t.

  As described above, since the light emitting device 1 is configured so that the sealing portion 12 and the light scattering portion 15 are separated from each other, not only from the surface (top surface 12c) of the rectangular parallelepiped sealing portion 12, but also from the side surface 12d. The light LL1 can also be extracted from (the surface in the height direction of the rectangular parallelepiped). The light LL1 emitted from the side surface 12d is emitted in a spatial direction perpendicular to the substrate 10 by the light scattering unit 15.

  That is, among the light emitted from the light emitting element chip 11 and the phosphor, the light LL1 emitted from the side surface 12d of the sealing portion 12 apart from the light directly incident from the top surface 12c toward the incident end surface 38t is the light It receives the action of the scattering part 15. That is, the light LL1 emitted from the side surface 12d to the light scattering portion 15 is scattered by the light scattering portion 15 and converted into light LL2 directed to the incident end surface 38t of the light guide plate 38.

  Therefore, for example, when the light emitting device 1 is applied to an edge light type backlight device including the light guide plate 38, the light from the light emitting device 1 can be efficiently incident on the incident end surface 38t of the light guide plate 38, and the coupling efficiency It is possible to improve the effective luminous efficiency of the entire system.

  Moreover, since the light-emitting device 1 does not need to make the sealing part 12 into a lens shape, the top surface 12c of the sealing part 12 is planar. For example, when the light emitting device 1 is made to face the incident end surface 38t of the light guide plate 38, the thickness of the light emitting device 1 in the direction perpendicular to the substrate 10 (distance Ld from the surface of the substrate 10 to the incident end surface) can be reduced. In addition, the outer shape including the light emitting device 1 disposed on the incident end surface 38t of the light guide plate 38 can be reduced to reduce the area of the frame portion 36 disposed with respect to the light guide plate 38.

  That is, when the light-emitting device 1 is applied as the light source of the light guide plate 38, the distance Ld from the surface of the substrate 10 to the incident end surface 38t can be reduced to reduce the arrangement area necessary as the light source of the light guide plate 38. . Further, since the distance Ld is reduced, the coupling efficiency between the light emitting device 1 and the light guide plate 38 can be further improved.

<Embodiment 2>
With reference to FIG. 2A thru | or FIG. 2K, the light-emitting device which concerns on this Embodiment is demonstrated. In addition, since the light-emitting device according to the present embodiment is a modification (variation 1 to modification 8) of the light-emitting device 1 according to the first embodiment, the reference numerals are appropriately used (or omitted), and are mainly different. The matter will be explained.

  In the present embodiment, the wiring pattern 14 omitted in the first embodiment is illustrated. One of the wiring patterns 14 is an anode electrode wiring pattern, and the other is a cathode electrode wiring pattern. As for the wiring pattern 14, an appropriate means (for example, a wire) to the anode electrode and the cathode electrode of the light emitting element chip 11 is shown. In this embodiment, the wire is not shown in consideration of the visibility of the drawing. ).

  FIG. 2A is a plan view showing a planar state of the light-emitting device (Modification 1) according to Embodiment 2 of the present invention.

  In this modification, the layout of the two light emitting element chips 11 is changed as compared with the light emitting device 1 of FIG. 1A, and the long sides of the two light emitting element chips 11 are parallel to the longitudinal direction of the light scattering portion 15. It is arranged to become.

  In this modification, an anode electrode / cathode electrode (not shown) formed on the surface of the light emitting element chip 11 and acting as a light shielding portion is not disposed on the light scattering portion 15 side on the surface of the substrate 10. . Since the light emitting element chips 11 are arranged along the longitudinal direction of the sealing portion 12, the light emission intensity near the center of the light emitting device 1 can be increased.

  FIG. 2B is a plan view showing a planar state of the light-emitting device (Modification 2) according to Embodiment 2 of the present invention.

  In this modification, the end 15t of the light scattering portion 15 is formed so as to extend to the same position as the end 12t of the sealing portion 12 (see the reference line RF). Therefore, the light emitted from the end 12t of the sealing portion 12 is not affected by the light scattering portion 15 and is emitted in the horizontal direction as it is. However, when a plurality of light emitting devices 1 according to this modification are arranged side by side so that the longitudinal direction of the sealing portion 12 and the light scattering portion 15 is linear, the sealing portions 12 are close to each other and adjacent to each other. The luminance between the light emitting devices 1 can be increased.

  That is, in the light emitting device 1 according to this modification, the distance from the end 15t of the light scattering portion 15 to the periphery of the substrate 10 is the same as the distance from the end 12t of the sealing portion 12 to the periphery of the substrate 10. . Therefore, the light emitting device 1 can suppress a decrease in luminance between the light emitting devices 1 when a plurality of the light scattering portions 15 and the sealing portions 12 are arranged in the longitudinal direction.

  FIG. 2C is a plan view showing a planar state of the light-emitting device (modification 3) according to Embodiment 2 of the present invention.

  In this modification, the rectangular light emitting element chips 11 are linearly arranged in the longitudinal direction. Therefore, the shape of the sealing portion 12 in plan view can be further elongated. For example, since the shape can be matched with the shape of the incident end surface 38t of the light guide plate 38, the coupling efficiency to the light guide plate 38 can be further improved.

  Further, an anode electrode / cathode electrode (not shown) formed on the surface of the light emitting element chip 11 and acting as a light shielding portion is not arranged in the vicinity of the light scattering portion 15 on the surface of the substrate 10. As a result, the amount of light traveling from the sealing body 12 toward the light scattering portion 15 can be increased.

  FIG. 2D is a plan view showing a planar state of the light-emitting device (Modification 4) according to Embodiment 2 of the present invention.

  In this modification, the light scattering portion 15 is formed to extend to the periphery of the substrate 10. Further, the end portion 12 t of the sealing portion 12 is disposed closer to the center of the substrate 10 than the end portion 15 t of the light scattering portion 15. Since the light scattering portion 15 is formed to extend to the periphery of the substrate 10, the light emitted from the periphery of the end portion 12 t of the sealing portion 12 among the light emitted from the sealing portion 12. In addition, the operation of the light scattering portion 15 can be reliably performed.

  Therefore, since the light scattering portion 15 also acts on the periphery of the end portion 12t of the sealing portion 12, the light emitted to the outside (vertical direction) can be further increased, and the light emission efficiency is improved. Further, the brightness of the sealing portion 12 and the light scattering portion 15 can be improved in the longitudinal direction.

  FIG. 2E is a plan view showing a planar state of the light-emitting device (modification 5) according to Embodiment 2 of the present invention.

  This modification is a modification of Modification 4. That is, in the present modification, the light scattering portion 15 is formed not only in the longitudinal direction but also in the short side direction extending to the periphery of the substrate 10, so the light scattering portion 15 has three directions (adjacent to the substrate 10). 3 sides) to the periphery of the substrate 10. Therefore, the area of the light scattering portion 15 can be enlarged, and the light emitted to the outside (vertical direction) can be further increased.

  FIG. 2F is a plan view showing a planar state of the light-emitting device (Modification 6) according to Embodiment 2 of the present invention. FIG. 2G is a side view showing a side state of the light emitting device shown in FIG. 2F viewed from the direction of the arrow 2G.

  In this modification, the light scattering portion 15 is not a light-transmitting resin applied to the substrate 10 shown in the method for manufacturing the light-emitting device 1 described later (see FIG. 5K), but a hard resin member formed in advance is pasted. It is replaced with the light reflection part formed in this way. In other words, the light scattering portion 15 (light reflecting portion) is formed of a hard resin member having a sloped surface facing the sealing portion 12, and a metal film is deposited or reflected on the surface facing the sealing portion 12. Since the light-sensitive paint is applied, it has light scattering properties (light reflectivity) for the light from the light scattering portion 15.

  In the case of the light reflecting portion, the light reflection / scattering characteristics vary depending on the inclination and surface state of the reflecting surface. However, in the case of the light scattering portion 15, the light reflection / scattering characteristics are affected by the inclination of the scattering surface and It depends not only on the surface state but also on the arrangement of the light diffusing material inside the translucent resin and the particle size and shape of the light diffusing material.

  When the light scattering portion 15 is formed of a light scattering member instead of a reflection member, in order to increase the dependency of the light reflection / scattering characteristics on the inclination of the scattering surface and the surface state, light diffusion is performed inside the translucent resin. Measures such as excessive arrangement of the material in the vicinity of the scattering surface are performed.

  The light scattering unit 15 (light-emitting device 1) according to this modification can also have the same effect as other modifications.

  FIG. 2H is a plan view showing a planar state of the light-emitting device (modification example 7) according to Embodiment 2 of the present invention. FIG. 2J is a side view showing a side state of the light emitting device shown in FIG. 2H viewed from the arrow 2J direction.

  This modification is a modification of Modification 6. That is, in this modification, the light scattering portion 15 is formed to extend to the periphery of the substrate 10 in the longitudinal direction and the short direction, so that the light scattering portion 15 has three directions (three adjacent sides of the substrate 10). ) To the periphery of the substrate 10. Therefore, the area of the light scattering portion 15 can be enlarged, and the light emitted to the outside (vertical direction) can be further increased.

  The light scattering unit 15 (light-emitting device 1) according to this modification can also have the same effect as other modifications.

  FIG. 2K is a plan view showing a planar state of the light-emitting device (Modification 8) according to Embodiment 2 of the present invention.

  In this modification, the light scattering portion 15 is formed in a square ring surrounding the outer periphery of the sealing portion 12. The light scattering portion 15 is different only in planar shape and can be formed in the same manner as in the first embodiment. Since the light scattering portion 15 surrounds the periphery of the sealing portion 12, it is possible to scatter light emitted from the sealing portion 12 in the horizontal direction to the outside (vertical direction) in all directions, thereby reducing light loss. In addition, the luminance can be improved. The light scattering portion 15 is disposed inward with respect to the peripheral edge of the substrate 10. Therefore, since the light scattering portions 15 can be collectively formed in an annular shape, the light emitting device 1 can be formed with high productivity and low cost.

  Note that the shape of the light scattering portion 15 in a plan view is not limited to a quadrangular ring shape, and may be set as appropriate, such as a circular ring shape or a polygonal ring shape. In addition, the light emitting device 1 according to the present modification can be applied to various uses as a small surface light source (for example, a light emitting device applied as a light source of a general lighting device).

<Embodiment 3>
With reference to FIG. 3A and FIG. 3B, the light-emitting device which concerns on this Embodiment is demonstrated. In addition, since the light-emitting device according to the present embodiment is a modified example (modified example 9) of the light-emitting device 1 according to the first and second embodiments, reference numerals are appropriately used (or omitted), and mainly Explain the different points. In addition, illustration of a wiring pattern is abbreviate | omitted.

  FIG. 3A is a plan view showing a planar state of the light-emitting device (modification 9) according to Embodiment 3 of the present invention. 3B is a cross-sectional view showing the light-emitting device shown in FIG. 3A as a cross-sectional state viewed in the direction of the arrow 3B.

  The light emitting device 1 s according to the present embodiment includes a rectangular substrate 10 having a longitudinal direction, a light emitting element chip 11 (not shown), a sealing portion 12 arranged linearly in the longitudinal direction of the substrate 10, and a sealing portion 12. Is provided with a light scattering portion 15 formed integrally therewith. That is, the light emitting device 1 s includes a plurality of light emitting element chips 11 and a plurality of sealing portions 12, and the light scattering portion 15 extends along one side 10 h in the longitudinal direction of the substrate 10. Further, the auxiliary light scattering portion 16 is arranged between the adjacent sealing portions 12 in a direction intersecting with the light scattering portion 15. Therefore, the light emitting device 1s is formed into a linear surface light source module.

  The sealing part 12 is arrange | positioned under a fixed space | interval or fixed regularity. The light scattering portion 15 is arranged linearly along one side 10h on both sides of the plurality of sealing portions 12 arranged linearly, and sandwiches the sealing portion 12 from both sides. Therefore, the light emitting device 1s according to the present embodiment can operate in the same manner as in the first and second embodiments.

  The height of the sub-light scattering portion 16 is formed to be equal to or higher than the position (light emitting surface position) of the light emitting portion 11f included in the light emitting element chip 11. That is, it is formed to have a height Hd (> 0) with respect to the light emitting portion 11f. The auxiliary light scattering unit 16 scatters light emitted from the opposing sealing unit 12 in the planar direction in the vertical direction of the substrate 10, and improves brightness in an intermediate region between the adjacent sealing units 12. The brightness unevenness between the sealing portions 12 to be improved is improved.

  The outermost auxiliary light scattering portion 16 corresponding to the two short sides of the substrate 10 may or may not be formed. That is, it may be set as appropriate according to the state of the device to be applied.

  Further, the auxiliary light scattering portion 16 may be formed so as to be separated from the light scattering portion 15 or may be formed so as to come into contact with the light scattering portion 15. The light scattering portion 15 and the auxiliary light scattering portion 16 are translucent resins including a light diffusing material, similar to the light scattering portion 15 in the first and second embodiments, and are located on the inner side of the periphery of the substrate 10. It is formed.

  Further, the auxiliary light scattering portion 16 may have a flat shape that is wider and longer in the longitudinal direction of the substrate 10 as viewed from the upper surface than the light scattering portion 15. Thereby, a part of the light emitted from the side of the sealing part 12 can be emitted by changing the direction of the light in the upward direction perpendicular to the substrate 10, and between the adjacent sealing parts 12. The light intensity can be increased.

  According to the form of the light emitting device 1 s according to the present embodiment, a plurality of light emitting element chips 11 and the sealing portion 12 are arranged in advance in the longitudinal direction, and the integrated light is extended in the longitudinal direction corresponding to the sealing portion 12. Since the scattering unit 15 is provided, the mounting process of the light emitting device 1 can be simplified when applied to an edge light type backlight device including the light guide plate 38.

<Embodiment 4>
With reference to FIG. 4A thru | or FIG. 4C, the liquid crystal display device to which the surface light source device which concerns on this Embodiment and a surface light source device is applied is demonstrated. The surface light source device 20 according to the present embodiment is applied as an edge light type backlight device to the liquid crystal display device 30 according to the present embodiment.

  Note that a light emitting device applied to the surface light source device and the liquid crystal display device according to the present embodiment is the same as the light emitting device 1 according to the first embodiment and the second embodiment (except for FIG. 2K). Incorporated (or omitted) as appropriate, mainly different items will be described. The light emitting device 1s according to the third embodiment can also be applied to the surface light source device and the liquid crystal display device according to the present embodiment.

  FIG. 4A is a side view conceptually showing an arrangement state of a surface light source device and a liquid crystal display device to which the surface light source device according to Embodiment 4 of the present invention is applied. 4B is a plan view conceptually showing a planar state when the surface light source device and the liquid crystal display device shown in FIG. 4A are viewed at the position of the arrow 4B. In addition, the arrangement | positioning relationship of a light-guide plate and a surface light source device is shown transparently. 4C is a plan view showing a planar state of the surface light source device shown in FIG. 4A.

  The surface light source device 20 according to the present embodiment includes the light emitting device 1 according to the first embodiment and the second embodiment, and a mounting substrate 21 on which a plurality of the light emitting devices 1 are mounted. The part 12 is arranged on the mounting substrate 21 so as to be linear (FIG. 4C).

  Accordingly, since the surface light source device 20 functions as a linear (band-shaped) surface light source, when the surface light source device 20 is disposed to face the incident end surface 38t of the light guide plate 38, the coupling efficiency to the light guide plate 38 is improved. Is possible. Further, since the light emitting device 1 in which the sealing portion 12 is planar is applied, the thickness can be reduced.

  Moreover, in the surface light source device 20, the light-scattering part 15 of each light-emitting device 1 is arrange | positioned at the mounting substrate 21 so that it may become linear form. Therefore, the surface light source device 20 does not have a member that shields light between the light emitting devices 1, and thus suppresses a decrease in luminance in a region between the light emitting devices 1 and suppresses luminance unevenness. It is possible to improve luminance and uniformity.

  In other words, the surface light source device 20 effectively arranges the light emitting device 1 by aligning the longitudinal direction of the sealing portion 12 and the longitudinal direction of the light scattering portion 15 with respect to the longitudinal direction of the mounting substrate 21, thereby improving the light emission characteristics. Can be improved.

  The liquid crystal display device 30 according to the present embodiment includes a liquid crystal panel 31 serving as a display surface, an optical sheet 32 that adjusts optical characteristics, a surface-side reflective sheet 33 disposed around the liquid crystal panel 31, and light emission to the liquid crystal panel 31. A light guide plate 38 arranged in correspondence with the surface 38s and a back side reflection sheet 34 arranged in correspondence with the light guide plate 38 are provided so as to overlap each other, and the periphery is protected by a housing 35. Further, the surface light source device 20 is disposed so as to face the incident end surface 38t of the light guide plate 38, and the frame portion 36 is disposed so as to hide the surface light source device 20 from the outside.

  The back surface side reflection sheet 34 is disposed so as to extend to the surface light source device 20 on the lower surface of the light guide plate 38. In addition, it is good also considering the surface of the housing | casing 35 as a reflective surface instead of the back surface side reflection sheet 34. FIG. The light incident on the incident end surface 38t from the surface light source device 20 propagates through the light guide plate 38 and is reflected by the back surface side reflection sheet 34 disposed on the lower surface of the light guide plate 38. Released from (display screen side).

  That is, the liquid crystal display device 30 is disposed in parallel to the surface light source device 20, the light guide plate 38 having the light exit surface 38s that intersects the incident end surface 38t on which the light from the surface light source device 20 is incident, and the light exit surface 38s. A liquid crystal panel 31.

  Therefore, since the liquid crystal display device 30 includes the light guide plate 38 having the light emitting surface 38s having high luminance and excellent uniformity, excellent display characteristics can be realized. Further, since the surface light source device 20 that can be thinned is applied, the area of the frame portion 36 necessary for the arrangement of the surface light source device 20 can be reduced, so that the area of the frame portion 36 with respect to the display area can be reduced. Can do.

  The surface light source device 20 (sealing portion 12) configured as a linear surface light source is disposed so as to face the rectangular incident end surface 38t. In other words, the longitudinal direction of the incident end surface 38t corresponds to the longitudinal direction of the surface light source device 20, and the short direction of the incident end surface 38t (the thickness direction of the light guide plate 38) corresponds to the short direction of the surface light source device 20. .

  Note that the light-emitting device 1 s of the third embodiment can be applied in the same manner as the surface light source device 20 according to the present embodiment.

  In the surface light source device 20, the light scattering portion 15 is formed along two opposing sides of the mounting substrate 21 in the arrangement direction (longitudinal direction) of the sealing portion 12 arranged in a straight line. Since there is no wall that blocks light between the arranged light emitting devices 1, it is possible to suppress a decrease in luminance at an intermediate position between the adjacent light emitting devices 1. Accordingly, uniform light can be incident on the incident end face 38t, and the luminance distribution of the light emitted from the light emitting face 38s perpendicular to the incident end face 38t can be made uniform, and the display surface of the liquid crystal panel 31 can be made uniform. Brightness unevenness can be made uniform. In addition, the total luminous flux on the display surface can be improved.

<Embodiment 5>
With reference to FIG. 5A thru | or FIG. 5N, the manufacturing method of the light-emitting device which concerns on this Embodiment is demonstrated. The present embodiment is a manufacturing method of the light emitting device 1 according to the first embodiment and the first embodiment, but can be similarly applied to the light emitting device 1 according to another embodiment.

  FIG. 5A is a plan view showing a planar state in which the light emitting element chip is placed on the substrate in the manufacturing process of the method for manufacturing the light emitting device according to the present embodiment. FIG. 5B is an enlarged cross-sectional view showing an enlarged cross-sectional state in the manufacturing process shown in FIG. 5A.

  The light emitting element chip 11 is placed on the substrate 10. The substrate 10 is a 3.2 mm square ceramic substrate on which a wiring pattern 14 (anode electrode, cathode electrode) is formed. The wiring pattern 14 penetrates through the inside of the ceramic substrate and is connected to corresponding anode external electrodes (not shown) and cathode external electrodes (not shown) formed on the back surface of the ceramic substrate. The wiring pattern 14 is formed based on a general method for forming a metal layer of a conventional ceramic package.

  The light emitting element chip 11 is die-bonded to the center die-bonding area of the substrate 10 with a die-bonding paste or the like. The two light emitting element chips 11 are arranged side by side along one side of the substrate 10 so that one side in the longitudinal direction of each chip is perpendicular to one side of the substrate 10. That is, it arranges along the longitudinal direction of the sealing part 12 so that it may become substantially perpendicular | vertical to the longitudinal direction of the sealing part 12 (refer FIG. 5G).

  The light emitting element chip 11 is an LED chip, and is an InGaN blue LED chip formed on a sapphire substrate. An anode electrode and a cathode electrode of the LED chip are formed on the outermost surface and are connected to the wiring pattern 14 by wire bonding so as to be connected in series. In addition, between the two LED chips, the electrodes on the surface are connected by wire bonding.

  In this embodiment, the LED chips are shown as being connected in series, but can be connected in parallel. In addition, what is necessary is just to set the mounting number of LED chip suitably.

  The substrate 10 is a collective substrate 10s in which a plurality of substrates 10 are integrally formed in advance. Since the collective substrate 10s is used, the plurality of light emitting devices 1 are manufactured in a lump in the following manufacturing process, so that productivity can be improved. In addition, since the board | substrate 10 is arrange | positioned in the matrix form inside the collective board | substrate 10s, it can ensure the ease of work | work. In the collective substrate 10s, a separation groove 10g is formed on the back surface in advance in consideration of workability in the process of dividing the substrate 10 (see FIGS. 5L and 5M).

  FIG. 5C is a plan view showing a planar state in which a resin molding frame member for sealing the light emitting element chip is placed on the substrate in the manufacturing process of the light emitting device manufacturing method according to the present embodiment. FIG. 5D is an enlarged cross-sectional view showing an enlarged cross-sectional state in the manufacturing process shown in FIG. 5C.

  A resin-molding frame member 41 having a through-hole 41h formed at a position corresponding to the sealing portion 12 is placed on (attached to) the substrate 10 (an aggregate substrate 10s; hereinafter simply referred to as the substrate 10). Append) The resin molding frame member 41 has an appropriate thickness corresponding to the thickness of the sealing portion 12, and is released from the sealing translucent resin 12r (see FIG. 5F) forming the sealing portion 12. It is made of a highly functional material. In the present embodiment, a fluorine resin sheet material is applied. Note that an adhesive sheet is attached in advance to the surface to be bonded to the substrate 10.

  FIG. 5E is a plan view illustrating a planar state in which a sealing translucent resin is injected into the through hole of the resin molding frame member in the manufacturing process of the light emitting device manufacturing method according to the present embodiment. FIG. 5F is an enlarged cross-sectional view showing an enlarged cross-sectional state in the middle of the manufacturing process shown in FIG. 5E.

  The translucent resin 12r for sealing is injected into the through hole 41h of the frame member 41 for resin molding. A phosphor is mixed in the sealing translucent resin 12r in advance. As the translucent resin 12r for sealing, for example, a silicone resin, an epoxy resin, or the like can be applied. Injection of the sealing translucent resin 12r is performed with good workability by using the resin sealing / resin casting quantitative discharge device 45.

  In the present embodiment, the phosphor contained in the sealing translucent resin 12r is hardened by allowing it to stand for a predetermined time in order to precipitate it. A first sealing part 12f (phosphor-containing sealing layer) containing a phosphor by precipitating the phosphor and a second sealing part 12s (phosphor-free sealing layer) that does not contain a phosphor. They can be formed together (see FIG. 5H). When the phosphor is formed by sedimentation, the boundary between the first sealing portion 12f and the second sealing portion 12s is not strictly divided.

  Further, in the step of injecting the sealing light-transmitting resin 12r, the first sealing portion 12f is formed with the sealing light-transmitting resin 12r containing the phosphor (first sealing light-transmitting property). Resin injection step), sealing is performed with two stages of forming a second sealing portion 12s with a sealing translucent resin 12r that does not contain a phosphor (second sealing translucent resin injection step) It can also be a part forming step. At this time, after the resin injected in the first resin step is cured, the second resin injection step is performed to clearly define the boundary between the first sealing portion 12f and the second sealing portion 12s (see FIG. 5H). can do.

  The resin molding frame member 41 may be formed as a mask forming process by screen printing.

  FIG. 5G is a plan view showing a planar state in which the sealing portion is formed and the resin-molding frame member is peeled from the substrate in the manufacturing process of the light emitting device manufacturing method according to the present embodiment. FIG. 5H is an enlarged side view showing an enlarged side surface state in the manufacturing process shown in FIG. 5G.

  After the sealing translucent resin 12r is cured, the resin molding frame member 41 is peeled off from the substrate 10. Sealing portions 12 (first sealing portion 12f and second sealing portion 12s) are formed on the substrate 10.

  FIG. 5J is a plan view showing a planar state after the light scattering portion is formed in the manufacturing process of the light emitting device manufacturing method according to the present embodiment. FIG. 5K is an enlarged side view showing an enlarged side surface state in the middle of the manufacturing process shown in FIG. 5J.

  The translucent resin 15r containing the light diffusing material is applied substantially parallel to the longitudinal direction of the sealing portion 12 along two opposing sides of the substrate 10. The application of the translucent resin 15r is performed easily and with high accuracy by applying a fixed amount discharge device 46 (dispenser).

  The position of the light scattering unit 15 is set in advance. In addition, by forming the light scattering portion 15 on the inner side of the outer periphery (the dividing groove 10g) of the substrate 10, the light scattering portion 15 is changed to the substrate 10 in the subsequent division step (step of dividing the substrate 10 from the collective substrate 10s). It is possible to prevent the problem of being peeled off.

  The light scattering portion 15 is formed by curing the translucent resin 15r applied in a straight line. As the translucent resin 15r, for example, a silicone resin, an epoxy resin, or the like can be applied. Further, the light diffusing material is uniformly dispersed inside the translucent resin 15r.

  The cross-sectional shape that intersects the longitudinal direction of the light scattering portion 15 can be adjusted by the viscosity, coating speed, curing conditions, and the like of the translucent resin 15r. The cross-sectional shape that intersects the longitudinal direction of the light scattering portion 15 can be a convex shape that protrudes from the substrate 10 as shown in a side view. The convex shape can be formed, for example, in a semicircular shape or a dome shape corresponding to a parabola. In the present embodiment, the line width could be 400 μm.

  According to the method of applying and forming the light scattering portion 15 by applying the fixed amount discharge device 46, the cross section of the light scattering portion 15 is a dome shape and has a line width of, for example, about several tens of μm to several hundreds of μm. Can do. Therefore, the manufacturing method of the light scattering unit 15 according to the present embodiment has sufficient mass productivity even when the substrate 10 is as small as about 1 mm square, for example.

  In addition, when the board | substrate 10 is a still smaller dimension, the light-scattering part 15 can be formed further small and with sufficient controllability by changing the formation of the light-scattering part 15 from the fixed-quantity discharge apparatus 46 to an inkjet printing system. it can. In this case, the light diffusing material added to the translucent resin 15r is desirably a nanocomposite having a small particle size.

  Further, after picking up the individual light emitting devices 1 after the dividing step, a blank portion having a certain width or more is provided between the light scattering portion 15 and the peripheral edge of the substrate 10 so that it can be held by the pickup suction nozzle. Is preferably provided.

  Note that supplementary explanation will be given for the precautions in the method for manufacturing the light-emitting device 1 shown in FIGS. 2F and 2G of the second embodiment.

  The light scattering portion 15 (light reflecting portion) shown in FIGS. 2F and 2G has a light scattering property and a light reflecting property on a slope in advance. Further, the light scattering portion 15 (light reflecting portion) is formed of a hard resin member and is attached to the substrate 10. The size of the light scattering portion 15 (light reflecting portion) and the position to be attached are set so as to be inside the outer periphery (separation groove 10g) of the substrate 10 in the same manner as the application of the translucent resin 15r.

  In the case of the manufacturing method in which the light scattering portion 15 (light reflecting portion) is attached to the substrate 10, the adhesive layer used when the light scattering portion 15 is attached to the substrate 10 has a thickness of about 40 μm to 60 μm. At this time, the height of the adhesive layer from the substrate 10 and the height of the light emitting portion 11f (light emitting surface position; see FIG. 3B) of the light emitting element chip 11 from the substrate 10 are approximately the same. That is, most of the light emitted in the horizontal direction from the light emitting element chip 11 (sealing portion 12) does not reach the light scattering portion 15 (light reflecting portion) but is taken into the adhesive layer.

  Since the adhesive layer functions as a light absorption layer, the function of the light scattering portion 15 cannot be exhibited, and the light extraction efficiency may be reduced. Therefore, in this case, it is necessary to adjust in advance the relationship between the height of the adhesive layer and the height of the light emitting portion 11f.

  As a method for avoiding the above-described problem, the surface portion of the substrate 10 to which the light scattering portion 15 (light reflecting portion) is attached is formed one step lower by the thickness of the adhesive layer or more, and a step portion is provided. There is a way. In this case, the above-described problem does not occur.

  The light scattering portion 15 (light reflecting portion) is attached to the substrate 10 when the light scattering portion 15 (light reflecting portion) is formed so as to be shared by a plurality of light emitting devices 1 (for example, in FIGS. 2H and 2J). However, there is a need for a dividing step including the light scattering portion 15 (light reflecting portion), and there is a risk of occurrence of burrs at the interface between the substrate 10 and the light scattering portion 15 (light reflecting portion). is there.

  In order to avoid division including the light scattering portion 15 (light reflection portion), when the light scattering portion 15 (light reflection portion) is attached to each individual light emitting device 1 as a separate member, the light scattering portion The trouble and accuracy of the pasting work of 15 (light reflection part) become a problem. In any case, the light scattering portion 15 (light reflecting portion) is attached to the substrate 10 by the method of directly applying the translucent resin 15r containing the light diffusing material to the inside from the periphery of the substrate 10 described above. Compared to the manufacturing method to be attached, the process is simple, the cost is low, and it can be said to be a superior method. In addition, such a problem does not occur when the translucent resin 15r containing the light diffusing material is directly applied to the substrate 10.

  Note that supplementary explanation will be given on the precautions in the method for manufacturing the light-emitting device 1 shown in FIGS. 2E and 2H of the second embodiment.

  2E and 2H are extended to the three adjacent sides of the substrate 10. A plurality of adjacent light scattering portions 15 corresponding to the dividing line DL (see FIGS. 5L and 5M) can be collectively formed on the collective substrate 10s before being divided. It is not necessary to form each light emitting device 1 individually, and in that respect, the process can be simplified. However, it is necessary to deal with the division of the light scattering portion 15 in the subsequent division step. The dividing process will be described later.

  FIG. 5L is a plan view showing a planar state when the aggregate substrate is divided into individual substrates in the manufacturing process of the method for manufacturing the light emitting device according to the present embodiment. FIG. 5M is an enlarged side view illustrating a side state in the manufacturing process illustrated in FIG. 5L in an enlarged manner. FIG. 5N is an enlarged plan view showing an enlarged planar state of the substrates individually divided in the manufacturing process shown in FIG. 5L.

  After the step of forming the light scattering portion 15, the collective substrate 10s is separated (divided) into individual substrates 10 by folding (breaking) the dividing substrate DL along the separation groove 10g. The separation grooves 10g are formed in advance so as to correspond between the substrates 10 so that the substrates 10 arranged in a matrix can be separated. The separation grooves 10g are formed in a lattice shape corresponding to the divided regions 10d corresponding to the substrates 10 arranged in a matrix shape.

  Since the light scattering portion 15 is arranged so as to be inside the divided region 10d, that is, inside the peripheral edge of the substrate 10 of the light emitting device 1, it can be easily divided.

  Further, when the light scattering portion 15 is formed so as to overlap the divided region 10d, measures such as peeling of the light scattering portion 15 and generation of burrs with the substrate 10 are required. If the peeling countermeasure and the burr countermeasure are sufficient, it is possible to divide by a full die instead of a break using the separation groove 10g.

  In addition, in the cutting | disconnection using a cutting machine (dicer), a dedicated expensive cutting device is needed. When the cutting device is applied, the manufacturing tact becomes longer because cutting takes time unlike the break using the separation groove 10g. Moreover, since the blades for cutting are worn and clogged, expensive blades need to be replaced, and the running cost increases. In addition, the light scattering portion 15 cannot be peeled off and burrs are not generated between the substrate 10 and the like. Therefore, it is desirable to divide without using a cutting machine.

  When the collective substrate 10 s is divided into the substrates 10 by applying a cutting device, a step of dividing the aggregate substrate 10 s by avoiding the formed light scattering portion 15 may be possible. By dividing the light scattering portion 15 while avoiding the light scattering portion 15, each light emitting device 1 can be manufactured while maintaining the shape of the light scattering portion 15 formed with high accuracy. In addition, an excessive load on the cutting device such as generation of burrs can be reduced.

  In the method for manufacturing the light emitting device 1 according to the present embodiment, the light scattering portion 15 is formed inside the divided region 10d, that is, inside the peripheral edge of the substrate 10, and the separation groove 10g formed in the divided region 10d is used. The substrate 10 is divided at once. In the manufacturing method according to the present embodiment, there is no problem related to the cutting device such as peeling of the light scattering portion 15 and generation of burrs with the substrate 10, and the substrates 10 arranged in a matrix are arranged for each row. Alternatively, since the data can be divided for each column, productivity can be improved.

  Although the quantitative discharge device 46 is applied to the formation of the light scattering portion 15, the quantitative discharge device 46 can be shared with the quantitative discharge device 45 that forms the sealing portion 12. Therefore, the cost associated with the apparatus can be greatly reduced, and no new investment is required. That is, the manufacturing method of the light emitting device according to the present embodiment can manufacture the light emitting device 1 with extremely high productivity and low cost.

  As described above, the method of manufacturing the light emitting device 1 according to the present embodiment includes the substrate 10, the light emitting element chip 11 placed on the substrate 10, the sealing portion 12 that seals the light emitting element chip 11, and the sealing. A method of manufacturing the light emitting device 1 including the light scattering portion 15 disposed on the substrate 10 away from the stopper 12 and facing the sealing portion 12, the step of placing the light emitting element chip 11 on the substrate 10; The process of forming the sealing part 12 and the process of forming the light-scattering part 15 are provided.

  Therefore, since the manufacturing method of the light emitting device 1 according to the present embodiment can form the sealing portion 12 and the light scattering portion 15 easily and with high accuracy, the inexpensive light emitting device 1 can be manufactured. Become.

  Further, in the method for manufacturing the light emitting device 1, the collective substrate 10s in which the plurality of substrates 10 are integrated with each other through the divided region 10d is configured in advance, and the light scattering portion 15 is formed avoiding the divided region 10d. .

  Therefore, the method for manufacturing the light emitting device 1 forms the light scattering portion 15 while avoiding the divided regions for each substrate 10 in the state of the collective substrate 10s, so that the light scattering portion 15 can be formed with high accuracy. Further, the collective substrate 10s can be easily divided into the respective substrates 10 with good workability.

  In addition, the method for manufacturing a light emitting device includes a step of previously forming a collective substrate 10 s in which a plurality of substrates 10 are integrated, and dividing the collective substrate 10 s into each substrate 10 while avoiding the light scattering portion 15.

  Therefore, since the manufacturing method of the light emitting device 1 avoids the light scattering portion 15 and divides the collective substrate 10 s into the respective substrates 10, each light emitting device 1 is formed while maintaining the light scattering portion 15 formed with high accuracy. be able to. Moreover, the excessive load by the light-scattering part 15 with respect to a cutting device can be reduced.

  Further, in the method for manufacturing a light emitting device, the light scattering portion 15 is formed by applying a translucent resin 15r containing a light scattering agent to the substrate 10. Therefore, the method for manufacturing the light emitting device 1 can form the light scattering portion 15 easily and with high accuracy.

  Further, in the method for manufacturing the light emitting device, the translucent resin 15r is applied to the substrate 10 by applying the quantitative discharge device 46. Therefore, the method for manufacturing the light emitting device 1 can easily and accurately form the light scattering portion 15.

  Further, in the method for manufacturing the light emitting device, the light scattering portion 15 is formed in a linear shape separated so as to open the end portion 12t of the sealing portion 12 with the sealing portion 12 interposed therebetween. Therefore, the method for manufacturing the light emitting device 1 can easily and accurately form the two light scattering portions 15 facing each other on both sides of the sealing portion 12, so that the light emitting device 1 with reduced light loss can be easily obtained. And can be formed with high accuracy.

  In the method of manufacturing the light emitting device, the step of forming the sealing portion 12 is performed by placing the resin molding frame member 41 having the through hole 41h corresponding to the sealing portion 12 on the substrate 10 and sealing the through hole 41h. A step of injecting the light-transmitting resin 12r for stopping is provided.

  Therefore, the light emitting device 1 can be manufactured with high productivity because the sealing portion 12 is easily and accurately formed by applying the resin molding frame member 41 that can be formed at low cost. .

  In the method for manufacturing the light emitting device, the step of forming the sealing portion 12 is performed by injecting the sealing translucent resin 12r containing the phosphor into the through hole 41h, and then setting the phosphor to the substrate 10 side. A step of causing

  Therefore, the manufacturing method of the light emitting device 1 does not include the first sealing portion 12f that contains the phosphor and constitutes the lower layer side (the side that covers the light emitting element chip 11) of the sealing portion 12 and the phosphor. Since the second sealing portion 12s constituting the upper layer side of the sealing portion 12 that overlaps the lower layer side of the sealing portion 12 is formed by a single resin injection, the sealing portion 12 is easily formed with high productivity. be able to.

DESCRIPTION OF SYMBOLS 1 Light-emitting device 1s Light-emitting device 10 Substrate 10d Divided area 10g Dividing groove 10h One side 10s Collective substrate 11 Light emitting element chip 12 Sealing part 12c Top surface 12d Side surface 12f First sealing part 12s Second sealing part 12t End part 12r Sealing Light-transmitting resin for stopping 15 Light scattering portion 15c Apex 15r Light-transmitting resin 15t End portion 16 Sub-light scattering portion 20 Surface light source device 21 Mounting substrate 30 Liquid crystal display device 31 Liquid crystal panel 33 Front side reflection sheet 34 Back side reflection sheet 35 Case 36 Frame portion 38 Light guide plate 38t Incident end surface 38s Light exit surface 41 Resin molding frame member 41h Through hole 45, 46 Fixed discharge device

Claims (5)

A light emitting device comprising a substrate, a light emitting element chip mounted on the substrate, and a sealing portion for sealing the light emitting element chip,
Comprises a light scattering portion positioned in front Symbol substrate away from said sealing portion,
The light scattering portion is formed in an annular shape surrounding the sealing portion in a top view,
The light-emitting device, wherein the sealing portion and the light scattering portion are arranged in regions separated from each other in a top view . The light-emitting device according to claim 1,
The light emitting element chip is a flip chip,
The sealing portion is provided corresponding to the surface side of the light emitting element chip, and is formed of a translucent resin containing a phosphor.
A light emitting device characterized by the above. The light-emitting device according to claim 1 or 2,
The substrate has a metal plate in the inner layer and an insulating layer formed on the surface
A light emitting device characterized by the above. A light-emitting device according to any one of claims 1 to 3,
The height of the light scattering portion from the substrate is the same as or higher than the height of the sealing portion from the substrate. An illumination device comprising the light emitting device according to any one of claims 1 to 4.

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