JPS6219063B2 - - Google Patents

Info

Publication number
JPS6219063B2
JPS6219063B2 JP57141452A JP14145282A JPS6219063B2 JP S6219063 B2 JPS6219063 B2 JP S6219063B2 JP 57141452 A JP57141452 A JP 57141452A JP 14145282 A JP14145282 A JP 14145282A JP S6219063 B2 JPS6219063 B2 JP S6219063B2
Authority
JP
Japan
Prior art keywords
sealing resin
outer container
gel
chamber
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57141452A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5931044A (ja
Inventor
Takayuki Kitamura
Shinobu Takahama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57141452A priority Critical patent/JPS5931044A/ja
Publication of JPS5931044A publication Critical patent/JPS5931044A/ja
Publication of JPS6219063B2 publication Critical patent/JPS6219063B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/47—
    • H10W72/07551—
    • H10W72/50—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57141452A 1982-08-12 1982-08-12 半導体装置 Granted JPS5931044A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57141452A JPS5931044A (ja) 1982-08-12 1982-08-12 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57141452A JPS5931044A (ja) 1982-08-12 1982-08-12 半導体装置

Publications (2)

Publication Number Publication Date
JPS5931044A JPS5931044A (ja) 1984-02-18
JPS6219063B2 true JPS6219063B2 (enExample) 1987-04-25

Family

ID=15292236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57141452A Granted JPS5931044A (ja) 1982-08-12 1982-08-12 半導体装置

Country Status (1)

Country Link
JP (1) JPS5931044A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3621994A1 (de) * 1986-07-01 1988-01-14 Bbc Brown Boveri & Cie Leistungshalbleitermodul
JPH01144635A (ja) * 1987-11-30 1989-06-06 Mitsubishi Electric Corp 電子部品の固定方法
US5956231A (en) * 1994-10-07 1999-09-21 Hitachi, Ltd. Semiconductor device having power semiconductor elements
JP2021052094A (ja) 2019-09-25 2021-04-01 株式会社ミツバ ドライバ

Also Published As

Publication number Publication date
JPS5931044A (ja) 1984-02-18

Similar Documents

Publication Publication Date Title
US7723839B2 (en) Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device
US6261865B1 (en) Multi chip semiconductor package and method of construction
US5389739A (en) Electronic device packaging assembly
US20050056918A1 (en) Power module package having improved heat dissipating capability
US6424026B1 (en) Power module with closely spaced printed circuit board and substrate
US4012768A (en) Semiconductor package
CN103531581B (zh) 多芯片模块
US5093713A (en) Semiconductor device package
US3581387A (en) Method of making strip mounted semiconductor device
JPS6219063B2 (enExample)
KR101008534B1 (ko) 전력용 반도체모듈패키지 및 그 제조방법
JPH0228261B2 (enExample)
JPH047590B2 (enExample)
JPH0870066A (ja) 半導体装置
JPH1084009A (ja) 半導体装置
JPH1050897A (ja) 半導体装置
US20240371659A1 (en) Package with molding cavity
JPS59136953A (ja) 複合素子
JPS6148947A (ja) 半導体装置
JP3348973B2 (ja) 半導体装置
JPH0786497A (ja) インテリジェントパワーモジュール
JPS61148845A (ja) 半導体装置
JP2707984B2 (ja) 半導体装置
JPS6164144A (ja) 半導体装置
KR900001744B1 (ko) 반도체장치