JPS62186458U - - Google Patents
Info
- Publication number
- JPS62186458U JPS62186458U JP1986074487U JP7448786U JPS62186458U JP S62186458 U JPS62186458 U JP S62186458U JP 1986074487 U JP1986074487 U JP 1986074487U JP 7448786 U JP7448786 U JP 7448786U JP S62186458 U JPS62186458 U JP S62186458U
- Authority
- JP
- Japan
- Prior art keywords
- tongue
- plate
- spacer
- lead
- ceramic wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 2
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図はスペーサの一例を示す斜視図および、第３図
は従来例を示す断面図である。
図において、１……リードタンシ、２……セラ
ミツク配線基板、３……電子部品、４……ケース
、５……段部、６……スペーサ、７……基板取付
円板、８……バネ板片、９……タンシ接合円板、
１０，１１，１２……リードタンシ挿通孔。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a perspective view showing an example of a spacer, and FIG. 3 is a sectional view showing a conventional example. In the figure, 1... Lead tank, 2... Ceramic wiring board, 3... Electronic component, 4... Case, 5... Step, 6... Spacer, 7... Board mounting disc, 8... Spring plate. Piece, 9...tanshi joint disk,
10, 11, 12... Lead tongue insertion hole.
Claims (1)
にタンシ接合板が設けられたスペーサの前記基板
取付板をセラミツク配線基板上に半田付け接合し
、このセラミツク配線基板と前記スペーサの基板
取付板及びタンシ接合板に開けられたリードタン
シ挿通孔にリードタンシを挿通し、このリードタ
ンシを前記スペーサのタンシ接合板に半田付け接
合したことを特徴とするセラミツク配線基板のリ
ードタンシ接合構造。 The board mounting plate of the spacer, in which the upper surface of a plurality of spring plate pieces standing upright on the board mounting plate is provided with a tongue joint plate, is soldered and joined onto a ceramic wiring board, and the ceramic wiring board and the board mounting plate of the spacer are bonded to each other by soldering. and a lead tongue joining structure for a ceramic wiring board, characterized in that a lead tongue is inserted into a lead tongue insertion hole opened in a tongue joining plate, and the lead tongue is joined to the tongue joining plate of the spacer by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986074487U JPS62186458U (en) | 1986-05-16 | 1986-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986074487U JPS62186458U (en) | 1986-05-16 | 1986-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62186458U true JPS62186458U (en) | 1987-11-27 |
Family
ID=30919747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986074487U Pending JPS62186458U (en) | 1986-05-16 | 1986-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62186458U (en) |
-
1986
- 1986-05-16 JP JP1986074487U patent/JPS62186458U/ja active Pending
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