JPS62184785U - - Google Patents

Info

Publication number
JPS62184785U
JPS62184785U JP1986073828U JP7382886U JPS62184785U JP S62184785 U JPS62184785 U JP S62184785U JP 1986073828 U JP1986073828 U JP 1986073828U JP 7382886 U JP7382886 U JP 7382886U JP S62184785 U JPS62184785 U JP S62184785U
Authority
JP
Japan
Prior art keywords
solder resist
component mounting
mounting seats
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986073828U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986073828U priority Critical patent/JPS62184785U/ja
Priority to US07/012,945 priority patent/US4767892A/en
Publication of JPS62184785U publication Critical patent/JPS62184785U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は、本考案に係るプリント配線板の断面
概略図、第２図は、従来のプリント配線板を示す
断面概略図である。 １…絶縁基板、２…導電体パターン、２１，２
１…部品取付座（ランド）、３…ソルダーレジス
ト層、５…ソルダーレジスト境壁、５１…頂面。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 絶縁基板の上面に複数の部品取付座を有す
    る導電体パターンを形成し、該導電体パターン上
    に該部品取付座を残してソルダーレジスト層を形
    成したものであつて、該部品取付座間のソルダー
    レジスト層上には頂面が該部品取付座の表面より
    高位となるソルダーレジスト境壁を設けたプリン
    ト配線板。 (2) 前記ソルダーレジスト境壁は速硬性シルク
    インク液によつて形成されることを特徴とする実
    用新案登録請求の範囲第１項記載のプリント配線
    板。
JP1986073828U 1986-05-16 1986-05-16 Pending JPS62184785U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1986073828U JPS62184785U (ja) 1986-05-16 1986-05-16
US07/012,945 US4767892A (en) 1986-05-16 1987-02-10 Printed-wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986073828U JPS62184785U (ja) 1986-05-16 1986-05-16

Publications (1)

Publication Number Publication Date
JPS62184785U true JPS62184785U (ja) 1987-11-24

Family

ID=13529394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986073828U Pending JPS62184785U (ja) 1986-05-16 1986-05-16

Country Status (2)

Country Link
US (1) US4767892A (ja)
JP (1) JPS62184785U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002158429A (ja) * 2000-11-16 2002-05-31 Murata Mfg Co Ltd 部品の実装構造
JP2008060182A (ja) * 2006-08-30 2008-03-13 Hitachi Ltd 車載用電子回路装置
JP2015056228A (ja) * 2013-09-10 2015-03-23 株式会社小糸製作所 プリント基板および車両用灯具

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63302595A (ja) * 1987-06-02 1988-12-09 Murata Mfg Co Ltd チップ部品の取付構造
US4859808A (en) * 1988-06-28 1989-08-22 Delco Electronics Corporation Electrical conductor having unique solder dam configuration
JPH02230792A (ja) * 1989-03-03 1990-09-13 Cmk Corp プリント配線板の製造方法におけるソルダランドの形成方法
GB2258183A (en) * 1991-08-01 1993-02-03 Motorola Inc Solder mask defined printed circuit board
CA2055148C (en) * 1991-10-25 2002-06-18 Alain Langevin Method of forming an electrically conductive contact on a substrate
US5227589A (en) * 1991-12-23 1993-07-13 Motorola, Inc. Plated-through interconnect solder thief
JP3494443B2 (ja) * 1991-12-26 2004-02-09 住友スリーエム株式会社 磁気ヘッド用２層テープリード線
JP2554542Y2 (ja) * 1992-02-17 1997-11-17 台灣杜邦股▲ふん▼有限公司 プリント回路基板
JPH05315734A (ja) * 1992-05-01 1993-11-26 Mitsubishi Electric Corp 電子部品の実装基板と実装方法
US5644475A (en) * 1994-09-30 1997-07-01 Allen-Bradley Company, Inc. Solder mask for a finger connector on a single in-line package module
JPH11220234A (ja) * 1998-01-29 1999-08-10 Smk Corp 回路基板
JP3951779B2 (ja) * 2002-04-10 2007-08-01 株式会社デンソー プリント回路板およびその製造方法
TWI221343B (en) * 2003-10-21 2004-09-21 Advanced Semiconductor Eng Wafer structure for preventing contamination of bond pads during SMT process and process for the same
JP4734995B2 (ja) * 2005-03-29 2011-07-27 ミツミ電機株式会社 ランド構造及びプリント配線板並びに電子装置
JP2008147458A (ja) * 2006-12-11 2008-06-26 Nec Electronics Corp プリント配線板およびその製造方法
JP2008205132A (ja) * 2007-02-19 2008-09-04 Nec Corp プリント配線板及びこれとフレキシブルプリント基板とのはんだ接続構造並びに方法
JP2008210993A (ja) * 2007-02-26 2008-09-11 Nec Corp プリント配線板及びその製造方法
JP2012156257A (ja) * 2011-01-25 2012-08-16 Fujitsu Ltd 回路基板及び電子装置
KR102434435B1 (ko) * 2015-10-26 2022-08-19 삼성전자주식회사 인쇄회로기판 및 이를 가지는 반도체 패키지

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1187282B (de) * 1964-06-12 1965-02-18 Nordmende Schaltungsplatte mit aufkaschierten Leiterbahnen und im Tauchloetverfahren elektrisch leitend verbundenen Schaltungsbauteilen
JPS5441102B2 (ja) * 1975-03-04 1979-12-06
JPS54158661A (en) * 1978-06-01 1979-12-14 Tokyo Purinto Kougiyou Kk Printed circuit board
JPS5724775U (ja) * 1980-07-17 1982-02-08
US4389771A (en) * 1981-01-05 1983-06-28 Western Electric Company, Incorporated Treatment of a substrate surface to reduce solder sticking

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002158429A (ja) * 2000-11-16 2002-05-31 Murata Mfg Co Ltd 部品の実装構造
JP2008060182A (ja) * 2006-08-30 2008-03-13 Hitachi Ltd 車載用電子回路装置
JP2015056228A (ja) * 2013-09-10 2015-03-23 株式会社小糸製作所 プリント基板および車両用灯具

Also Published As

Publication number Publication date
US4767892A (en) 1988-08-30

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