JPS6218055Y2 - - Google Patents
Info
- Publication number
- JPS6218055Y2 JPS6218055Y2 JP1983074898U JP7489883U JPS6218055Y2 JP S6218055 Y2 JPS6218055 Y2 JP S6218055Y2 JP 1983074898 U JP1983074898 U JP 1983074898U JP 7489883 U JP7489883 U JP 7489883U JP S6218055 Y2 JPS6218055 Y2 JP S6218055Y2
- Authority
- JP
- Japan
- Prior art keywords
- glass film
- semiconductor
- multilayer structure
- semiconductor device
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 29
- 239000005360 phosphosilicate glass Substances 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 12
- 239000012535 impurity Substances 0.000 claims description 4
- 239000005388 borosilicate glass Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000009792 diffusion process Methods 0.000 claims description 2
- 239000005355 lead glass Substances 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 4
- 230000010354 integration Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7489883U JPS5918445U (ja) | 1983-05-19 | 1983-05-19 | 多層構造半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7489883U JPS5918445U (ja) | 1983-05-19 | 1983-05-19 | 多層構造半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5918445U JPS5918445U (ja) | 1984-02-04 |
| JPS6218055Y2 true JPS6218055Y2 (ko) | 1987-05-09 |
Family
ID=30204980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7489883U Granted JPS5918445U (ja) | 1983-05-19 | 1983-05-19 | 多層構造半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5918445U (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7943428B2 (en) * | 2008-12-24 | 2011-05-17 | International Business Machines Corporation | Bonded semiconductor substrate including a cooling mechanism |
| JP5183708B2 (ja) * | 2010-09-21 | 2013-04-17 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5387163A (en) * | 1977-01-12 | 1978-08-01 | Hitachi Ltd | Production of semiconductor device |
-
1983
- 1983-05-19 JP JP7489883U patent/JPS5918445U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5387163A (en) * | 1977-01-12 | 1978-08-01 | Hitachi Ltd | Production of semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5918445U (ja) | 1984-02-04 |
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