JPS6217874B2 - - Google Patents

Info

Publication number
JPS6217874B2
JPS6217874B2 JP56015467A JP1546781A JPS6217874B2 JP S6217874 B2 JPS6217874 B2 JP S6217874B2 JP 56015467 A JP56015467 A JP 56015467A JP 1546781 A JP1546781 A JP 1546781A JP S6217874 B2 JPS6217874 B2 JP S6217874B2
Authority
JP
Japan
Prior art keywords
resin
metal
metal coating
lead
die pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56015467A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57128947A (en
Inventor
Sadami Yakuwa
Kazuharu Oonuki
Shozo Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamagata Ltd
Original Assignee
NEC Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamagata Ltd filed Critical NEC Yamagata Ltd
Priority to JP56015467A priority Critical patent/JPS57128947A/ja
Publication of JPS57128947A publication Critical patent/JPS57128947A/ja
Publication of JPS6217874B2 publication Critical patent/JPS6217874B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56015467A 1981-02-04 1981-02-04 Semiconductor device Granted JPS57128947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56015467A JPS57128947A (en) 1981-02-04 1981-02-04 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56015467A JPS57128947A (en) 1981-02-04 1981-02-04 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS57128947A JPS57128947A (en) 1982-08-10
JPS6217874B2 true JPS6217874B2 (enFirst) 1987-04-20

Family

ID=11889599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56015467A Granted JPS57128947A (en) 1981-02-04 1981-02-04 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57128947A (enFirst)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59117166U (ja) * 1983-01-27 1984-08-07 新電元工業株式会社 樹脂封止型半導体装置
US10062639B2 (en) * 2014-12-10 2018-08-28 Stmicroelectronics Sdn Bhd Integrated circuit device with plating on lead interconnection point and method of forming the device

Also Published As

Publication number Publication date
JPS57128947A (en) 1982-08-10

Similar Documents

Publication Publication Date Title
US6194777B1 (en) Leadframes with selective palladium plating
JPH0612796B2 (ja) 半導体装置
JP4362163B2 (ja) 半導体装置の製造方法
EP0074168B1 (en) Device and method for packaging electronic devices
JPS5864056A (ja) 半導体装置
US11935821B2 (en) Quad flat no-lead package with wettable flanges
JPS59161850A (ja) 樹脂封止型半導体装置およびそれに用いるリ−ドフレ−ム
JPS6217874B2 (enFirst)
JPH0590465A (ja) 半導体装置
JP2873685B2 (ja) 半導体パッケージ
JPH01196153A (ja) 樹脂封止半導体装置
JPH03149865A (ja) リードフレーム
JPH0666354B2 (ja) 半導体装置
JP2596542B2 (ja) リードフレームおよびそれを用いた半導体装置
JPS634945B2 (enFirst)
JPS61242051A (ja) 半導体装置
JPH01244653A (ja) 半導体装置
JPS624860B2 (enFirst)
JPS61135131A (ja) 樹脂封止型半導体装置
JP3644555B2 (ja) リードフレームおよび半導体装置
JPH03280456A (ja) 半導体装置に用いるリードフレーム
JPH04335558A (ja) 半導体装置
JPS6344991Y2 (enFirst)
JPS60119765A (ja) 樹脂封止型半導体装置およびそれに用いるリ−ドフレ−ム
JP2000091493A (ja) 表面実装型半導体装置