JPS62171200A - 半導体装置の位置決め装置 - Google Patents
半導体装置の位置決め装置Info
- Publication number
- JPS62171200A JPS62171200A JP1209886A JP1209886A JPS62171200A JP S62171200 A JPS62171200 A JP S62171200A JP 1209886 A JP1209886 A JP 1209886A JP 1209886 A JP1209886 A JP 1209886A JP S62171200 A JPS62171200 A JP S62171200A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- stem
- clamp claw
- positioning
- outer periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 35
- 210000000078 claw Anatomy 0.000 claims description 15
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1209886A JPS62171200A (ja) | 1986-01-24 | 1986-01-24 | 半導体装置の位置決め装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1209886A JPS62171200A (ja) | 1986-01-24 | 1986-01-24 | 半導体装置の位置決め装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62171200A true JPS62171200A (ja) | 1987-07-28 |
JPH0423440B2 JPH0423440B2 (enrdf_load_stackoverflow) | 1992-04-22 |
Family
ID=11796094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1209886A Granted JPS62171200A (ja) | 1986-01-24 | 1986-01-24 | 半導体装置の位置決め装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62171200A (enrdf_load_stackoverflow) |
-
1986
- 1986-01-24 JP JP1209886A patent/JPS62171200A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0423440B2 (enrdf_load_stackoverflow) | 1992-04-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6505397B1 (en) | Die holding mechanism for a die with connecting wires thereon | |
KR100255000B1 (ko) | 와이어 본딩장치용 캐필러리 | |
JPS62171200A (ja) | 半導体装置の位置決め装置 | |
KR950012798B1 (ko) | 동일 평면의 다이 대기판의 접착방법 | |
JP3120267B2 (ja) | シングルポイントボンディング方法 | |
JP3789741B2 (ja) | 基板搬送用治具 | |
JPS5868951A (ja) | 半導体装置 | |
JP3157249B2 (ja) | 半導体装置実装体及び実装方法 | |
JP3056159B2 (ja) | 半導体パッケージの気密封止方法及びそれを適用した抵抗溶接装置 | |
US6746251B2 (en) | IC socket with a cover member and guiding members | |
JPH04324948A (ja) | ボンディング方法 | |
JPH0697350A (ja) | リ−ドフレ−ム | |
JP3100710B2 (ja) | ボンディングツールおよびボンディング方法 | |
JPS62256445A (ja) | キヤピラリツ−ル | |
JP2006049682A (ja) | 半導体装置及びその製造方法 | |
US6131792A (en) | Balancing of x and y axis bonding by 45 degree capillary positioning | |
JP2001018028A (ja) | 金型装置 | |
JPH0419797Y2 (enrdf_load_stackoverflow) | ||
JPH0422148A (ja) | 超音波ワイヤボンディング用ウェッジ | |
JPS6234445Y2 (enrdf_load_stackoverflow) | ||
JPH05299425A (ja) | ボールバンプボンダ | |
KR19990029775U (ko) | 집적회로 칩의 와이어 본딩에서 사용되는 히터 블록 | |
KR20020056810A (ko) | 반도체 소자의 검사용 캐리어 | |
JPH04177862A (ja) | 半導体装置用セラミックパッケージ | |
JPS6218057A (ja) | リ−ドフレ−ム加工方法 |