JPS6216866A - 鋳物の余剰部除去装置 - Google Patents

鋳物の余剰部除去装置

Info

Publication number
JPS6216866A
JPS6216866A JP15794185A JP15794185A JPS6216866A JP S6216866 A JPS6216866 A JP S6216866A JP 15794185 A JP15794185 A JP 15794185A JP 15794185 A JP15794185 A JP 15794185A JP S6216866 A JPS6216866 A JP S6216866A
Authority
JP
Japan
Prior art keywords
casting
surplus
die
product
force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15794185A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0367468B2 (enrdf_load_stackoverflow
Inventor
Tamotsu Tao
田尾 存
Fujio Fujii
藤井 富士雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mazda Motor Corp
Original Assignee
Mazda Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mazda Motor Corp filed Critical Mazda Motor Corp
Priority to JP15794185A priority Critical patent/JPS6216866A/ja
Publication of JPS6216866A publication Critical patent/JPS6216866A/ja
Publication of JPH0367468B2 publication Critical patent/JPH0367468B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Punching Or Piercing (AREA)
JP15794185A 1985-07-16 1985-07-16 鋳物の余剰部除去装置 Granted JPS6216866A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15794185A JPS6216866A (ja) 1985-07-16 1985-07-16 鋳物の余剰部除去装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15794185A JPS6216866A (ja) 1985-07-16 1985-07-16 鋳物の余剰部除去装置

Publications (2)

Publication Number Publication Date
JPS6216866A true JPS6216866A (ja) 1987-01-26
JPH0367468B2 JPH0367468B2 (enrdf_load_stackoverflow) 1991-10-23

Family

ID=15660811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15794185A Granted JPS6216866A (ja) 1985-07-16 1985-07-16 鋳物の余剰部除去装置

Country Status (1)

Country Link
JP (1) JPS6216866A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009101412A (ja) * 2007-10-05 2009-05-14 Yasuaki Okuya 方案から鋳物製品と、方案の廃材を分離する堰折り方法と、その堰折り装置
CN102069179A (zh) * 2011-01-12 2011-05-25 江阴鑫宝利金属制品有限公司 一种涡轮浇口切割装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511256U (enrdf_load_stackoverflow) * 1978-07-04 1980-01-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511256U (enrdf_load_stackoverflow) * 1978-07-04 1980-01-24

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009101412A (ja) * 2007-10-05 2009-05-14 Yasuaki Okuya 方案から鋳物製品と、方案の廃材を分離する堰折り方法と、その堰折り装置
CN102069179A (zh) * 2011-01-12 2011-05-25 江阴鑫宝利金属制品有限公司 一种涡轮浇口切割装置

Also Published As

Publication number Publication date
JPH0367468B2 (enrdf_load_stackoverflow) 1991-10-23

Similar Documents

Publication Publication Date Title
JPS6216866A (ja) 鋳物の余剰部除去装置
JPH0371785B2 (enrdf_load_stackoverflow)
JP2995119B2 (ja) パワートランジスタ用リードフレームの製造方法
JPH02105448A (ja) リードフレーム
JP3784918B2 (ja) 半打ち抜き加工用パンチ、これを用いた半打ち抜き穴の加工方法
CN1111457C (zh) 电子器械与电子器械的制造方法及金属模装置
JPH0527218Y2 (enrdf_load_stackoverflow)
JPH0639470Y2 (ja) プリント配線用基板
JP2005007715A (ja) 二次成形部品
JP2963244B2 (ja) 電子部品用リードフレームの構造
KR200160429Y1 (ko) 리드프레임 패드 챔퍼용 금형
JPS59150459A (ja) リ−ドフレ−ム
JPS62275525A (ja) リ−ドフレ−ム曲げ型
JPH0628242Y2 (ja) 鬼瓦の成形装置
JP2714002B2 (ja) 樹脂封止型半導体装置の製造方法
JP3054244B2 (ja) 電子部品用リードフレームの構造
JPH07241630A (ja) プレス成形型
JPH03142959A (ja) リードピンの高位置精度を有するリードフレーム
JP2603814B2 (ja) 半導体装置及びその製造方法
JPS63302545A (ja) 樹脂封止型半導体リ−ドフレ−ム
JPH0222517B2 (enrdf_load_stackoverflow)
JPS5942455B2 (ja) 電子部品の樹脂モ−ルド装置
JPH04324970A (ja) 半導体装置のリードフレームの製造方法
JPH0242377Y2 (enrdf_load_stackoverflow)
JPS62173046A (ja) 閉塞鍛造方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees