JPS62163325A - ドライエツチング方法 - Google Patents

ドライエツチング方法

Info

Publication number
JPS62163325A
JPS62163325A JP543386A JP543386A JPS62163325A JP S62163325 A JPS62163325 A JP S62163325A JP 543386 A JP543386 A JP 543386A JP 543386 A JP543386 A JP 543386A JP S62163325 A JPS62163325 A JP S62163325A
Authority
JP
Japan
Prior art keywords
etching
flow rate
pressure
etched
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP543386A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0513374B2 (enrdf_load_stackoverflow
Inventor
Masuo Tanno
丹野　益男
Kazuyuki Tomita
和之 富田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP543386A priority Critical patent/JPS62163325A/ja
Publication of JPS62163325A publication Critical patent/JPS62163325A/ja
Publication of JPH0513374B2 publication Critical patent/JPH0513374B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
JP543386A 1986-01-14 1986-01-14 ドライエツチング方法 Granted JPS62163325A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP543386A JPS62163325A (ja) 1986-01-14 1986-01-14 ドライエツチング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP543386A JPS62163325A (ja) 1986-01-14 1986-01-14 ドライエツチング方法

Publications (2)

Publication Number Publication Date
JPS62163325A true JPS62163325A (ja) 1987-07-20
JPH0513374B2 JPH0513374B2 (enrdf_load_stackoverflow) 1993-02-22

Family

ID=11611060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP543386A Granted JPS62163325A (ja) 1986-01-14 1986-01-14 ドライエツチング方法

Country Status (1)

Country Link
JP (1) JPS62163325A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03135024A (ja) * 1989-10-20 1991-06-10 Tokyo Electron Ltd 基板の処理方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0956951A (ja) * 1995-08-29 1997-03-04 Nara Sewing Mach Kogyo Kk ミシンの糸倒れ防止装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5561026A (en) * 1978-10-30 1980-05-08 Chiyou Lsi Gijutsu Kenkyu Kumiai Gas plasma etching device
JPS5729577A (en) * 1980-07-30 1982-02-17 Anelva Corp Automatic continuous sputtering apparatus
JPS6050924A (ja) * 1983-08-31 1985-03-22 Hitachi Ltd 半導体製造装置
JPS60138908A (ja) * 1983-12-27 1985-07-23 Toshiba Corp 減圧ｃｖｄ装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5561026A (en) * 1978-10-30 1980-05-08 Chiyou Lsi Gijutsu Kenkyu Kumiai Gas plasma etching device
JPS5729577A (en) * 1980-07-30 1982-02-17 Anelva Corp Automatic continuous sputtering apparatus
JPS6050924A (ja) * 1983-08-31 1985-03-22 Hitachi Ltd 半導体製造装置
JPS60138908A (ja) * 1983-12-27 1985-07-23 Toshiba Corp 減圧ｃｖｄ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03135024A (ja) * 1989-10-20 1991-06-10 Tokyo Electron Ltd 基板の処理方法

Also Published As

Publication number Publication date
JPH0513374B2 (enrdf_load_stackoverflow) 1993-02-22

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Legal Events

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