JPS5561026A - Gas plasma etching device - Google Patents
Gas plasma etching deviceInfo
- Publication number
- JPS5561026A JPS5561026A JP13393478A JP13393478A JPS5561026A JP S5561026 A JPS5561026 A JP S5561026A JP 13393478 A JP13393478 A JP 13393478A JP 13393478 A JP13393478 A JP 13393478A JP S5561026 A JPS5561026 A JP S5561026A
- Authority
- JP
- Japan
- Prior art keywords
- tank
- door
- closing
- opening
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE: To improve etching characteristics and controllability by providing a spare exhaust tank between a reaction tank and the air, so that the interior of the reaction tank may not be exposed directly to the air.
CONSTITUTION: First closing a screening door 18 separating a reaction tank 8 from a spare exhaust tank 16; pouring an inactive gas into the tank 16 while opening the front door 15 to insert the material 10 to be etched into the tank 16, the door 15 is closed to exhaust the contents in the tank 16. Then opening the back door 18 so as to transfer the material 10 from the tank 16 to the reaction tank 8, contents contained in the tank 8 is exhaused from the inside by closing the door 18. Thence gas plasma etching is conducted by applying high-frequency current to a plate high-frequency electrode 9 while adding a gas containing an etching agent. After the completion of etching, the tank 8 is exhaused while opening the door 9 so as to transfer the material 10 to a tank 16 under low pressure, then the material 10 is recovered by pouring an inactive gas into the tank 16 while closing the door 18. By so doing, the penetration of the air into the tank 8 can be prevented.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13393478A JPS5561026A (en) | 1978-10-30 | 1978-10-30 | Gas plasma etching device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13393478A JPS5561026A (en) | 1978-10-30 | 1978-10-30 | Gas plasma etching device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5561026A true JPS5561026A (en) | 1980-05-08 |
Family
ID=15116480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13393478A Pending JPS5561026A (en) | 1978-10-30 | 1978-10-30 | Gas plasma etching device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5561026A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57203779A (en) * | 1981-06-08 | 1982-12-14 | Fujitsu Ltd | Plasma etching device |
JPS58213429A (en) * | 1982-06-07 | 1983-12-12 | Nec Corp | Dry etching device |
JPS60150633A (en) * | 1984-01-18 | 1985-08-08 | Kokusai Electric Co Ltd | Loadlock chamber of plasma etching device |
JPS62163325A (en) * | 1986-01-14 | 1987-07-20 | Matsushita Electric Ind Co Ltd | Dry etching method |
JPH0285378A (en) * | 1988-09-22 | 1990-03-26 | Hitachi Ltd | Plasma etching method |
JPH0339837U (en) * | 1989-08-29 | 1991-04-17 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5298475A (en) * | 1976-02-16 | 1977-08-18 | Hitachi Ltd | Plasma treating apparatus |
-
1978
- 1978-10-30 JP JP13393478A patent/JPS5561026A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5298475A (en) * | 1976-02-16 | 1977-08-18 | Hitachi Ltd | Plasma treating apparatus |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57203779A (en) * | 1981-06-08 | 1982-12-14 | Fujitsu Ltd | Plasma etching device |
JPS6337191B2 (en) * | 1981-06-08 | 1988-07-25 | Fujitsu Ltd | |
JPS58213429A (en) * | 1982-06-07 | 1983-12-12 | Nec Corp | Dry etching device |
JPS60150633A (en) * | 1984-01-18 | 1985-08-08 | Kokusai Electric Co Ltd | Loadlock chamber of plasma etching device |
JPS62163325A (en) * | 1986-01-14 | 1987-07-20 | Matsushita Electric Ind Co Ltd | Dry etching method |
JPH0513374B2 (en) * | 1986-01-14 | 1993-02-22 | Matsushita Electric Ind Co Ltd | |
JPH0285378A (en) * | 1988-09-22 | 1990-03-26 | Hitachi Ltd | Plasma etching method |
JPH0339837U (en) * | 1989-08-29 | 1991-04-17 |
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