JPS6215909B2 - - Google Patents

Info

Publication number
JPS6215909B2
JPS6215909B2 JP54044661A JP4466179A JPS6215909B2 JP S6215909 B2 JPS6215909 B2 JP S6215909B2 JP 54044661 A JP54044661 A JP 54044661A JP 4466179 A JP4466179 A JP 4466179A JP S6215909 B2 JPS6215909 B2 JP S6215909B2
Authority
JP
Japan
Prior art keywords
electrode
pellet
bonding
coordinates
recognized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54044661A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55138250A (en
Inventor
Masayuki Naruse
Koichi Kawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP4466179A priority Critical patent/JPS55138250A/ja
Publication of JPS55138250A publication Critical patent/JPS55138250A/ja
Publication of JPS6215909B2 publication Critical patent/JPS6215909B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
JP4466179A 1979-04-12 1979-04-12 Position detector Granted JPS55138250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4466179A JPS55138250A (en) 1979-04-12 1979-04-12 Position detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4466179A JPS55138250A (en) 1979-04-12 1979-04-12 Position detector

Publications (2)

Publication Number Publication Date
JPS55138250A JPS55138250A (en) 1980-10-28
JPS6215909B2 true JPS6215909B2 (ko) 1987-04-09

Family

ID=12697621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4466179A Granted JPS55138250A (en) 1979-04-12 1979-04-12 Position detector

Country Status (1)

Country Link
JP (1) JPS55138250A (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935892A (ja) * 1982-08-20 1984-02-27 Nec Corp レ−ザ加工装置
JPH07119705B2 (ja) * 1986-04-11 1995-12-20 東京エレクトロン 株式会社 電子部品の検査装置
JPH0468531U (ko) * 1990-10-24 1992-06-17
JP3934473B2 (ja) 2002-05-09 2007-06-20 大日本スクリーン製造株式会社 パッチ測定装置およびそれを組み込んだ印刷装置
WO2018042590A1 (ja) * 2016-09-01 2018-03-08 富士機械製造株式会社 部品実装装置および位置認識方法

Also Published As

Publication number Publication date
JPS55138250A (en) 1980-10-28

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