JPS55138250A - Position detector - Google Patents

Position detector

Info

Publication number
JPS55138250A
JPS55138250A JP4466179A JP4466179A JPS55138250A JP S55138250 A JPS55138250 A JP S55138250A JP 4466179 A JP4466179 A JP 4466179A JP 4466179 A JP4466179 A JP 4466179A JP S55138250 A JPS55138250 A JP S55138250A
Authority
JP
Japan
Prior art keywords
pellet
coordinates
electrode
central
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4466179A
Other languages
Japanese (ja)
Other versions
JPS6215909B2 (en
Inventor
Masayuki Naruse
Koichi Kawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4466179A priority Critical patent/JPS55138250A/en
Publication of JPS55138250A publication Critical patent/JPS55138250A/en
Publication of JPS6215909B2 publication Critical patent/JPS6215909B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Abstract

PURPOSE:To prevent a wrong connection by a method wherein the central coordinate is detected from a binary figure obtained after photoelectric scanning by the pattern matching method, and the result obtained is compared with the previous connecting position. CONSTITUTION:The position of a pellet previously recognized and connected is 101, and the central position of the electrode of the pellet is B1, then coordinates X1, Y1 are memorized 7. The position of the pellet is 102, and coordinates X2, Y2 of the central position of the electrode are memorized 9. B3 indicates the central coordinate of another pellet. A specified range + or -a, + or -b in the direction of an axis of coordinates from the position B1 previously recognized is provided beforehand, and the connection is carried out when the coordinates are within the range, based on the understanding that the electrode is normal, but, in case they are not within the range, they are recognized again or transferred to the next pellet. After the connection is carried out on the basis of recognizing the normal electrode, the coordinates are transferred from the register 9-7 in parallel, and they are treated as the central values within the specified range for the next pellet. By so doing, noise of the same figure as that of the electrode on the lead frame is recognized while preventing a wrong connection.
JP4466179A 1979-04-12 1979-04-12 Position detector Granted JPS55138250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4466179A JPS55138250A (en) 1979-04-12 1979-04-12 Position detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4466179A JPS55138250A (en) 1979-04-12 1979-04-12 Position detector

Publications (2)

Publication Number Publication Date
JPS55138250A true JPS55138250A (en) 1980-10-28
JPS6215909B2 JPS6215909B2 (en) 1987-04-09

Family

ID=12697621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4466179A Granted JPS55138250A (en) 1979-04-12 1979-04-12 Position detector

Country Status (1)

Country Link
JP (1) JPS55138250A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935892A (en) * 1982-08-20 1984-02-27 Nec Corp Laser working device
JPS62239040A (en) * 1986-04-11 1987-10-19 Tokyo Electron Ltd Inspection system for fitting state of electronic component
JPH0468531U (en) * 1990-10-24 1992-06-17
US7206097B2 (en) 2002-05-09 2007-04-17 Dainippon Screen Mfg. Co., Ltd. Patch measurement device and printing apparatus incorporating the same
WO2018042590A1 (en) * 2016-09-01 2018-03-08 富士機械製造株式会社 Component mounting device and position identification method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5935892A (en) * 1982-08-20 1984-02-27 Nec Corp Laser working device
JPS62239040A (en) * 1986-04-11 1987-10-19 Tokyo Electron Ltd Inspection system for fitting state of electronic component
JPH0468531U (en) * 1990-10-24 1992-06-17
US7206097B2 (en) 2002-05-09 2007-04-17 Dainippon Screen Mfg. Co., Ltd. Patch measurement device and printing apparatus incorporating the same
WO2018042590A1 (en) * 2016-09-01 2018-03-08 富士機械製造株式会社 Component mounting device and position identification method
JPWO2018042590A1 (en) * 2016-09-01 2019-06-24 株式会社Ｆｕｊｉ Component mounting apparatus and position recognition method

Also Published As

Publication number Publication date
JPS6215909B2 (en) 1987-04-09

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