JPS62154746A - 電子部品の接合方法 - Google Patents

電子部品の接合方法

Info

Publication number
JPS62154746A
JPS62154746A JP29401685A JP29401685A JPS62154746A JP S62154746 A JPS62154746 A JP S62154746A JP 29401685 A JP29401685 A JP 29401685A JP 29401685 A JP29401685 A JP 29401685A JP S62154746 A JPS62154746 A JP S62154746A
Authority
JP
Japan
Prior art keywords
lsi
bonding agent
conductive particles
pellet
terminal parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29401685A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0436574B2 (enrdf_load_stackoverflow
Inventor
Toshiharu Tamaki
玉木　敏晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP29401685A priority Critical patent/JPS62154746A/ja
Publication of JPS62154746A publication Critical patent/JPS62154746A/ja
Publication of JPH0436574B2 publication Critical patent/JPH0436574B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP29401685A 1985-12-27 1985-12-27 電子部品の接合方法 Granted JPS62154746A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29401685A JPS62154746A (ja) 1985-12-27 1985-12-27 電子部品の接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29401685A JPS62154746A (ja) 1985-12-27 1985-12-27 電子部品の接合方法

Publications (2)

Publication Number Publication Date
JPS62154746A true JPS62154746A (ja) 1987-07-09
JPH0436574B2 JPH0436574B2 (enrdf_load_stackoverflow) 1992-06-16

Family

ID=17802160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29401685A Granted JPS62154746A (ja) 1985-12-27 1985-12-27 電子部品の接合方法

Country Status (1)

Country Link
JP (1) JPS62154746A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0228340A (ja) * 1988-06-09 1990-01-30 Fujitsu Ltd 半導体チップの実装方法
JPH03274789A (ja) * 1990-03-23 1991-12-05 Toshiba Corp 実装回路ユニットの製造方法
JPH03128937U (enrdf_load_stackoverflow) * 1990-04-10 1991-12-25
JPH07159197A (ja) * 1993-12-02 1995-06-23 Mitsubishi Steel Mfg Co Ltd 磁気式エンコーダ用磁気抵抗効果センサー
JP2000113919A (ja) * 1998-08-03 2000-04-21 Sony Corp 電気的接続装置と電気的接続方法
DE4304747C2 (de) * 1992-02-19 2001-01-25 Shinetsu Polymer Co Heißverschweißbare elektrische Anschlußfolie

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0228340A (ja) * 1988-06-09 1990-01-30 Fujitsu Ltd 半導体チップの実装方法
JPH03274789A (ja) * 1990-03-23 1991-12-05 Toshiba Corp 実装回路ユニットの製造方法
JPH03128937U (enrdf_load_stackoverflow) * 1990-04-10 1991-12-25
DE4304747C2 (de) * 1992-02-19 2001-01-25 Shinetsu Polymer Co Heißverschweißbare elektrische Anschlußfolie
JPH07159197A (ja) * 1993-12-02 1995-06-23 Mitsubishi Steel Mfg Co Ltd 磁気式エンコーダ用磁気抵抗効果センサー
JP2000113919A (ja) * 1998-08-03 2000-04-21 Sony Corp 電気的接続装置と電気的接続方法

Also Published As

Publication number Publication date
JPH0436574B2 (enrdf_load_stackoverflow) 1992-06-16

Similar Documents

Publication Publication Date Title
US6544428B1 (en) Method for producing a multi-layer circuit board using anisotropic electro-conductive adhesive layer
JPS62154746A (ja) 電子部品の接合方法
JP2553491B2 (ja) 電子部品の接合方法
JPS58132941A (ja) 部品搭載基板のリ−ド接続方法
JPS63150930A (ja) 半導体装置
JPS6127089Y2 (enrdf_load_stackoverflow)
JPH06168982A (ja) フリップチップ実装構造
JPS60140790A (ja) 連結シ−ト
JP3129218B2 (ja) ファインピッチコネクタ部材
JPS60140896A (ja) 配線基板
JP3572994B2 (ja) 固体装置接合用シートの製造方法および固体装置の基板搭載方法
JPS587078B2 (ja) プリントバンノ タンシセツゾクホウホウ
JPH0440277Y2 (enrdf_load_stackoverflow)
JP4590088B2 (ja) フレキシブル基板素片、及び、多層フレキシブル配線板
JP3308951B2 (ja) 多層フレキシブル配線板
JPS61277179A (ja) 導電異方性接着シ−ト
KR100271680B1 (ko) 반도체 장치의 제조방법
JP2954559B2 (ja) 配線基板の電極構造
JP2511909B2 (ja) 電気的接続材料のマイクロ形成方法
JPH0779192B2 (ja) 電子部品の接合方法
JPS60140791A (ja) 配線基板
JPH0638440Y2 (ja) 回路基板の接着構造
JPS61196594A (ja) 電子部品の実装構造
JPH06120656A (ja) 基板間接続方法
KR930006826Y1 (ko) 연결 시트

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees