JPS62151592A - 金めつきリ−ドフレ−ムの製造方法 - Google Patents

金めつきリ−ドフレ−ムの製造方法

Info

Publication number
JPS62151592A
JPS62151592A JP60296125A JP29612585A JPS62151592A JP S62151592 A JPS62151592 A JP S62151592A JP 60296125 A JP60296125 A JP 60296125A JP 29612585 A JP29612585 A JP 29612585A JP S62151592 A JPS62151592 A JP S62151592A
Authority
JP
Japan
Prior art keywords
gold
plating
time
lead frame
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60296125A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0553879B2 (enExample
Inventor
Satoshi Chinda
聡 珍田
Osamu Yoshioka
修 吉岡
Katsuhiro Aoki
青木　克裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP60296125A priority Critical patent/JPS62151592A/ja
Publication of JPS62151592A publication Critical patent/JPS62151592A/ja
Publication of JPH0553879B2 publication Critical patent/JPH0553879B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60296125A 1985-12-25 1985-12-25 金めつきリ−ドフレ−ムの製造方法 Granted JPS62151592A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60296125A JPS62151592A (ja) 1985-12-25 1985-12-25 金めつきリ−ドフレ−ムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60296125A JPS62151592A (ja) 1985-12-25 1985-12-25 金めつきリ−ドフレ−ムの製造方法

Publications (2)

Publication Number Publication Date
JPS62151592A true JPS62151592A (ja) 1987-07-06
JPH0553879B2 JPH0553879B2 (enExample) 1993-08-11

Family

ID=17829460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60296125A Granted JPS62151592A (ja) 1985-12-25 1985-12-25 金めつきリ−ドフレ−ムの製造方法

Country Status (1)

Country Link
JP (1) JPS62151592A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6468489A (en) * 1987-09-09 1989-03-14 Shinko Electric Ind Co Electrolytic gold plating method
JPH05345997A (ja) * 1992-04-13 1993-12-27 Electroplating Eng Of Japan Co 金めっき品の製造方法
EP0867528A1 (de) * 1997-03-27 1998-09-30 Allgemeine Gold- Und Silberscheideanstalt Ag Gelförmiger Edelmetalleelektrolyt
US6127205A (en) * 1996-07-26 2000-10-03 Nec Corporation Process for manufacturing a molded electronic component having pre-plated lead terminals
JP2006518553A (ja) * 2003-02-19 2006-08-10 ハネウエル・インターナシヨナル・インコーポレーテツド 熱相互接続システムの生成方法およびその使用法
CN111819310A (zh) * 2018-03-07 2020-10-23 住友电气工业株式会社 镀膜以及镀覆部件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4887755A (enExample) * 1972-01-31 1973-11-17
JPS55104495A (en) * 1979-01-30 1980-08-09 Electroplating Eng Of Japan Co Gold plating liquid and gold plating method for using gold plating liquid
JPS5698493A (en) * 1980-01-10 1981-08-07 Hamasawa Kogyo:Kk Plating method for decorative part

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4887755A (enExample) * 1972-01-31 1973-11-17
JPS55104495A (en) * 1979-01-30 1980-08-09 Electroplating Eng Of Japan Co Gold plating liquid and gold plating method for using gold plating liquid
JPS5698493A (en) * 1980-01-10 1981-08-07 Hamasawa Kogyo:Kk Plating method for decorative part

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6468489A (en) * 1987-09-09 1989-03-14 Shinko Electric Ind Co Electrolytic gold plating method
JPH05345997A (ja) * 1992-04-13 1993-12-27 Electroplating Eng Of Japan Co 金めっき品の製造方法
US6127205A (en) * 1996-07-26 2000-10-03 Nec Corporation Process for manufacturing a molded electronic component having pre-plated lead terminals
EP0867528A1 (de) * 1997-03-27 1998-09-30 Allgemeine Gold- Und Silberscheideanstalt Ag Gelförmiger Edelmetalleelektrolyt
JP2006518553A (ja) * 2003-02-19 2006-08-10 ハネウエル・インターナシヨナル・インコーポレーテツド 熱相互接続システムの生成方法およびその使用法
US7897437B2 (en) 2003-02-19 2011-03-01 Honeywell International Inc. Thermal interconnect systems methods of production and uses thereof
CN111819310A (zh) * 2018-03-07 2020-10-23 住友电气工业株式会社 镀膜以及镀覆部件
JPWO2019172010A1 (ja) * 2018-03-07 2021-02-18 住友電気工業株式会社 めっき膜、及びめっき被覆部材
EP3763851A4 (en) * 2018-03-07 2021-12-15 Sumitomo Electric Industries, Ltd. Plating film and plated member
US11380602B2 (en) 2018-03-07 2022-07-05 Sumitomo Electric Industries, Ltd. Plating film and plated member
CN111819310B (zh) * 2018-03-07 2022-11-25 住友电气工业株式会社 镀膜以及镀覆部件

Also Published As

Publication number Publication date
JPH0553879B2 (enExample) 1993-08-11

Similar Documents

Publication Publication Date Title
JP3513709B2 (ja) 前処理によるスズホイスカーの防止方法
US4681670A (en) Bath and process for plating tin-lead alloys
JP5026031B2 (ja) スズ層を有する金属デュプレックスの製造方法
US4640746A (en) Bath and process for plating tin/lead alloys on composite substrates
KR20070026832A (ko) 주석계 도금 피막 및 그 형성 방법
JP4639701B2 (ja) 錫めっき皮膜を有する金属板及びそれを備えた電子部品並びに錫めっき皮膜の製造方法
US7488408B2 (en) Tin-plated film and method for producing the same
CN113832509B (zh) 用于在镍镀层上电镀金的镀液和在镍镀层上电镀金的方法和镀金件
GB2321647A (en) Electroplating baths for nickel or nickel alloy
JPS62151592A (ja) 金めつきリ−ドフレ−ムの製造方法
US20230203693A1 (en) Surface modifier for electrolytic nickel plating and nickel electroplating solution including the same
JPH0222160B2 (enExample)
US6331240B1 (en) Tin-indium alloy electroplating solution
US6811674B2 (en) Palladium plating solution
US4589962A (en) Solder plating process and semiconductor product
JP4129363B2 (ja) 電解金めっき液及び金めっき方法
JP2005105307A (ja) リフローＳｎめっき部材、前記部材の製造方法、および前記部材が用いられた電気電子機器用部品
CN114016098B (zh) 一种PCB用覆铜板电镀Ni-Co-Ce薄膜镀液及薄膜制备方法
KR102693812B1 (ko) 와이어 금도금 조성물, 와이어 금 도금방법 및 이로부터 제조된 금도금 와이어
KR100760420B1 (ko) 팔라듐 도금액
TW202225489A (zh) 含有鎳電鍍皮膜之鍍敷結構體及引線框架
JP2892601B2 (ja) ホイスカーの発生しない電気・電子部品用光沢亜鉛メッキ品及び光沢亜鉛メッキ法
JPH0455340B2 (enExample)
JPS5983788A (ja) 高速銀めつき方法
JP2732947B2 (ja) リフロー錫及びリフローはんだめっき材の製造方法