JPS55104495A - Gold plating liquid and gold plating method for using gold plating liquid - Google Patents

Gold plating liquid and gold plating method for using gold plating liquid

Info

Publication number
JPS55104495A
JPS55104495A JP867179A JP867179A JPS55104495A JP S55104495 A JPS55104495 A JP S55104495A JP 867179 A JP867179 A JP 867179A JP 867179 A JP867179 A JP 867179A JP S55104495 A JPS55104495 A JP S55104495A
Authority
JP
Japan
Prior art keywords
gold plating
gold
plating
plating liquid
carrying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP867179A
Other languages
Japanese (ja)
Other versions
JPS6218637B2 (en
Inventor
Kazuhiro Higuchi
Yoshiyasu Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP867179A priority Critical patent/JPS55104495A/en
Publication of JPS55104495A publication Critical patent/JPS55104495A/en
Publication of JPS6218637B2 publication Critical patent/JPS6218637B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To form a metal plating layer presenting golden semi-luster, by carrying out plating on the substrate by using gold plating liquid containing gold cyanide complex ion, conductive salt and a fixed amount of rare earth elements or moreover, using a fixed pulse electric current.
CONSTITUTION: In case of carrying out gold plating of semiconductor parts substrate, etc., such as transistor header, etc., pure gold deposit having uniform golden semi-luster and contenting desirable gold plating characteristics, is formed by using gold plating liquid containing gold cyanide complex salt, such as gold cyanide potassium and moreover, containing conductive salt such as acetic acid, etc. and 1W200g/l of rare earth elements such as cerium sulphate, etc. or using the above plating liquid and also carrying out gold plating by using pulse wavy direct current having a period of 100W10,000Hz and ON and OFF time being the ratio of ON and OFF time 1:1W1:10.
COPYRIGHT: (C)1980,JPO&Japio
JP867179A 1979-01-30 1979-01-30 Gold plating liquid and gold plating method for using gold plating liquid Granted JPS55104495A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP867179A JPS55104495A (en) 1979-01-30 1979-01-30 Gold plating liquid and gold plating method for using gold plating liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP867179A JPS55104495A (en) 1979-01-30 1979-01-30 Gold plating liquid and gold plating method for using gold plating liquid

Publications (2)

Publication Number Publication Date
JPS55104495A true JPS55104495A (en) 1980-08-09
JPS6218637B2 JPS6218637B2 (en) 1987-04-23

Family

ID=11699388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP867179A Granted JPS55104495A (en) 1979-01-30 1979-01-30 Gold plating liquid and gold plating method for using gold plating liquid

Country Status (1)

Country Link
JP (1) JPS55104495A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59104493A (en) * 1982-12-01 1984-06-16 Shinko Electric Ind Co Ltd Gold striking bath
JPS62149895A (en) * 1985-12-23 1987-07-03 Hitachi Cable Ltd Gold plating method for lead frame
JPS62151592A (en) * 1985-12-25 1987-07-06 Hitachi Cable Ltd Production of gold plated lead frame
JPH05345997A (en) * 1992-04-13 1993-12-27 Electroplating Eng Of Japan Co Production of gold plated articles
CN101818373A (en) * 2010-04-27 2010-09-01 海洋王照明科技股份有限公司 Method for forming rare earth film on metal surface and applications thereof
CN102154669A (en) * 2011-03-28 2011-08-17 冠锋电子科技(梅州)有限公司 Method for plating thick soft gold by utilizing plating thin golden cylinder

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59104493A (en) * 1982-12-01 1984-06-16 Shinko Electric Ind Co Ltd Gold striking bath
JPS634640B2 (en) * 1982-12-01 1988-01-29 Shinko Elec Ind
JPS62149895A (en) * 1985-12-23 1987-07-03 Hitachi Cable Ltd Gold plating method for lead frame
JPH0553878B2 (en) * 1985-12-23 1993-08-11 Hitachi Cable
JPS62151592A (en) * 1985-12-25 1987-07-06 Hitachi Cable Ltd Production of gold plated lead frame
JPH0553879B2 (en) * 1985-12-25 1993-08-11 Hitachi Cable
JPH05345997A (en) * 1992-04-13 1993-12-27 Electroplating Eng Of Japan Co Production of gold plated articles
CN101818373A (en) * 2010-04-27 2010-09-01 海洋王照明科技股份有限公司 Method for forming rare earth film on metal surface and applications thereof
CN102154669A (en) * 2011-03-28 2011-08-17 冠锋电子科技(梅州)有限公司 Method for plating thick soft gold by utilizing plating thin golden cylinder

Also Published As

Publication number Publication date
JPS6218637B2 (en) 1987-04-23

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