JPS55104495A - Gold plating liquid and gold plating method for using gold plating liquid - Google Patents
Gold plating liquid and gold plating method for using gold plating liquidInfo
- Publication number
- JPS55104495A JPS55104495A JP867179A JP867179A JPS55104495A JP S55104495 A JPS55104495 A JP S55104495A JP 867179 A JP867179 A JP 867179A JP 867179 A JP867179 A JP 867179A JP S55104495 A JPS55104495 A JP S55104495A
- Authority
- JP
- Japan
- Prior art keywords
- gold plating
- gold
- plating
- plating liquid
- carrying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract 9
- 239000010931 gold Substances 0.000 title abstract 9
- 229910052737 gold Inorganic materials 0.000 title abstract 9
- 239000007788 liquid Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 abstract 3
- 150000003839 salts Chemical class 0.000 abstract 3
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 abstract 2
- 239000002932 luster Substances 0.000 abstract 2
- 229910052761 rare earth metal Inorganic materials 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- ARHBWGMHXPPGCZ-UHFFFAOYSA-N [K].[Au](C#N)(C#N)C#N Chemical compound [K].[Au](C#N)(C#N)C#N ARHBWGMHXPPGCZ-UHFFFAOYSA-N 0.000 abstract 1
- -1 acetic acid Chemical class 0.000 abstract 1
- OZECDDHOAMNMQI-UHFFFAOYSA-H cerium(3+);trisulfate Chemical compound [Ce+3].[Ce+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O OZECDDHOAMNMQI-UHFFFAOYSA-H 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To form a metal plating layer presenting golden semi-luster, by carrying out plating on the substrate by using gold plating liquid containing gold cyanide complex ion, conductive salt and a fixed amount of rare earth elements or moreover, using a fixed pulse electric current.
CONSTITUTION: In case of carrying out gold plating of semiconductor parts substrate, etc., such as transistor header, etc., pure gold deposit having uniform golden semi-luster and contenting desirable gold plating characteristics, is formed by using gold plating liquid containing gold cyanide complex salt, such as gold cyanide potassium and moreover, containing conductive salt such as acetic acid, etc. and 1W200g/l of rare earth elements such as cerium sulphate, etc. or using the above plating liquid and also carrying out gold plating by using pulse wavy direct current having a period of 100W10,000Hz and ON and OFF time being the ratio of ON and OFF time 1:1W1:10.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP867179A JPS55104495A (en) | 1979-01-30 | 1979-01-30 | Gold plating liquid and gold plating method for using gold plating liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP867179A JPS55104495A (en) | 1979-01-30 | 1979-01-30 | Gold plating liquid and gold plating method for using gold plating liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55104495A true JPS55104495A (en) | 1980-08-09 |
| JPS6218637B2 JPS6218637B2 (en) | 1987-04-23 |
Family
ID=11699388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP867179A Granted JPS55104495A (en) | 1979-01-30 | 1979-01-30 | Gold plating liquid and gold plating method for using gold plating liquid |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55104495A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59104493A (en) * | 1982-12-01 | 1984-06-16 | Shinko Electric Ind Co Ltd | Gold striking bath |
| JPS62149895A (en) * | 1985-12-23 | 1987-07-03 | Hitachi Cable Ltd | Gold plating method for lead frame |
| JPS62151592A (en) * | 1985-12-25 | 1987-07-06 | Hitachi Cable Ltd | Production of gold plated lead frame |
| JPH05345997A (en) * | 1992-04-13 | 1993-12-27 | Electroplating Eng Of Japan Co | Production of gold plated articles |
| CN101818373A (en) * | 2010-04-27 | 2010-09-01 | 海洋王照明科技股份有限公司 | Method for forming rare earth film on metal surface and applications thereof |
| CN102154669A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for plating thick soft gold by utilizing plating thin golden cylinder |
-
1979
- 1979-01-30 JP JP867179A patent/JPS55104495A/en active Granted
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59104493A (en) * | 1982-12-01 | 1984-06-16 | Shinko Electric Ind Co Ltd | Gold striking bath |
| JPS634640B2 (en) * | 1982-12-01 | 1988-01-29 | Shinko Elec Ind | |
| JPS62149895A (en) * | 1985-12-23 | 1987-07-03 | Hitachi Cable Ltd | Gold plating method for lead frame |
| JPH0553878B2 (en) * | 1985-12-23 | 1993-08-11 | Hitachi Cable | |
| JPS62151592A (en) * | 1985-12-25 | 1987-07-06 | Hitachi Cable Ltd | Production of gold plated lead frame |
| JPH0553879B2 (en) * | 1985-12-25 | 1993-08-11 | Hitachi Cable | |
| JPH05345997A (en) * | 1992-04-13 | 1993-12-27 | Electroplating Eng Of Japan Co | Production of gold plated articles |
| CN101818373A (en) * | 2010-04-27 | 2010-09-01 | 海洋王照明科技股份有限公司 | Method for forming rare earth film on metal surface and applications thereof |
| CN102154669A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for plating thick soft gold by utilizing plating thin golden cylinder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6218637B2 (en) | 1987-04-23 |
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