JPS62141020A - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物

Info

Publication number
JPS62141020A
JPS62141020A JP28069885A JP28069885A JPS62141020A JP S62141020 A JPS62141020 A JP S62141020A JP 28069885 A JP28069885 A JP 28069885A JP 28069885 A JP28069885 A JP 28069885A JP S62141020 A JPS62141020 A JP S62141020A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
parts
epoxy
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28069885A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6325015B2 (enrdf_load_stackoverflow
Inventor
Yoshio Fujimura
藤村　嘉夫
Tetsuo Yoshida
哲夫 吉田
Hatsuji Shiraishi
白石　初二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP28069885A priority Critical patent/JPS62141020A/ja
Publication of JPS62141020A publication Critical patent/JPS62141020A/ja
Publication of JPS6325015B2 publication Critical patent/JPS6325015B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP28069885A 1985-12-13 1985-12-13 エポキシ樹脂組成物 Granted JPS62141020A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28069885A JPS62141020A (ja) 1985-12-13 1985-12-13 エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28069885A JPS62141020A (ja) 1985-12-13 1985-12-13 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS62141020A true JPS62141020A (ja) 1987-06-24
JPS6325015B2 JPS6325015B2 (enrdf_load_stackoverflow) 1988-05-24

Family

ID=17628700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28069885A Granted JPS62141020A (ja) 1985-12-13 1985-12-13 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS62141020A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6325015B2 (enrdf_load_stackoverflow) 1988-05-24

Similar Documents

Publication Publication Date Title
JP3995421B2 (ja) 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
JPS6325012B2 (enrdf_load_stackoverflow)
JPH1167982A (ja) エポキシ樹脂組成物及び半導体装置
JP3565118B2 (ja) 半導体封止用エポキシ樹脂組成物
JP3390335B2 (ja) 半導体装置
JPS62141020A (ja) エポキシ樹脂組成物
JP3582771B2 (ja) エポキシ樹脂組成物及び半導体装置
JP2003128750A (ja) エポキシ系樹脂組成物及び半導体装置
JP2001279064A (ja) 半導体封止用エポキシ樹脂組成物
JPH0834858A (ja) エポキシ樹脂組成物の製造方法及び半導体封止用エポキシ樹脂組成物
JPH09227765A (ja) エポキシ樹脂組成物
JP2004285316A (ja) エポキシ樹脂組成物及び半導体装置
JPH0618853B2 (ja) エポキシ樹脂組成物
JPH1045872A (ja) エポキシ樹脂組成物
JP4783994B2 (ja) エポキシ系樹脂組成物及び半導体装置
JPH11181244A (ja) エポキシ樹脂組成物及び半導体装置
JP2003226739A (ja) エポキシ樹脂組成物及び半導体装置
JP2003105174A (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP4743932B2 (ja) エポキシ樹脂組成物及び半導体装置
JP2003261647A (ja) エポキシ樹脂組成物及び半導体装置
JP2002284964A (ja) 半導体封止用エポキシ樹脂組成物および半導体装置
JPH021754A (ja) 成形用フエノール樹脂組成物及びその製法並びに該組成物で封止した半導体装置
JP2003238660A (ja) エポキシ樹脂組成物及び半導体装置
JPS6253325A (ja) エポキシ樹脂組成物
JPS6325011B2 (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term