JPS6214098B2 - - Google Patents

Info

Publication number
JPS6214098B2
JPS6214098B2 JP9779779A JP9779779A JPS6214098B2 JP S6214098 B2 JPS6214098 B2 JP S6214098B2 JP 9779779 A JP9779779 A JP 9779779A JP 9779779 A JP9779779 A JP 9779779A JP S6214098 B2 JPS6214098 B2 JP S6214098B2
Authority
JP
Japan
Prior art keywords
joint
lid
glass
alumina substrate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9779779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5623756A (en
Inventor
Akihiro Dotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP9779779A priority Critical patent/JPS5623756A/ja
Publication of JPS5623756A publication Critical patent/JPS5623756A/ja
Publication of JPS6214098B2 publication Critical patent/JPS6214098B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W95/00—
    • H10W72/5363—
    • H10W72/884—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP9779779A 1979-07-31 1979-07-31 Ceramic package and manufacture thereof Granted JPS5623756A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9779779A JPS5623756A (en) 1979-07-31 1979-07-31 Ceramic package and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9779779A JPS5623756A (en) 1979-07-31 1979-07-31 Ceramic package and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS5623756A JPS5623756A (en) 1981-03-06
JPS6214098B2 true JPS6214098B2 (cg-RX-API-DMAC10.html) 1987-03-31

Family

ID=14201781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9779779A Granted JPS5623756A (en) 1979-07-31 1979-07-31 Ceramic package and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5623756A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61147793A (ja) * 1984-12-18 1986-07-05 Makita Denki Seisakusho:Kk 電動工具の電池駆動による制御装置
JP2555945Y2 (ja) * 1992-03-25 1997-11-26 滋賀ボルト株式会社 ボルト締付け装置
JP2583469Y2 (ja) * 1992-03-25 1998-10-22 滋賀ボルト株式会社 ボルト締付け装置

Also Published As

Publication number Publication date
JPS5623756A (en) 1981-03-06

Similar Documents

Publication Publication Date Title
JP6602480B2 (ja) 半導体装置
CN100449811C (zh) 热电变换装置
EP0280700B1 (en) Circuit package attachment apparatus and method
IL25656A (en) Method of bonding an insulating material to a conductive material and the product obtained thereby
JP5445344B2 (ja) 電力用半導体装置
JP2739954B2 (ja) 電力用半導体装置とその製造方法
CN102593020B (zh) 制造半导体设备的方法、半导体设备以及使用该半导体设备的点火器
JPS63221657A (ja) 半導体装置
JP2010141163A (ja) 半導体装置及び半導体装置の製造方法
WO2021085216A1 (ja) 半導体装置、電力変換装置、および半導体装置の製造方法
JPS6214098B2 (cg-RX-API-DMAC10.html)
JP2004319740A (ja) パワー半導体装置およびその製造方法
JPS6351538B2 (cg-RX-API-DMAC10.html)
JPH0723863Y2 (ja) 温度ヒューズ
US4066427A (en) Bonding method using a soldering glass
JPH08264262A (ja) 面状発熱体
JPH0519292B2 (cg-RX-API-DMAC10.html)
JP2538657B2 (ja) ハイブリッドモジュ―ル
JP3173086B2 (ja) 可溶合金型温度ヒューズ
JPH0119345Y2 (cg-RX-API-DMAC10.html)
JPH0436023Y2 (cg-RX-API-DMAC10.html)
JP2009026723A (ja) 面状発熱体
JP2002321399A (ja) サーマルヘッド及びその製造法
JP2564487B2 (ja) 回路基板及びその混成集積回路
JPH01135012A (ja) 固体電解コンデンサ