JPS5623756A - Ceramic package and manufacture thereof - Google Patents

Ceramic package and manufacture thereof

Info

Publication number
JPS5623756A
JPS5623756A JP9779779A JP9779779A JPS5623756A JP S5623756 A JPS5623756 A JP S5623756A JP 9779779 A JP9779779 A JP 9779779A JP 9779779 A JP9779779 A JP 9779779A JP S5623756 A JPS5623756 A JP S5623756A
Authority
JP
Japan
Prior art keywords
lid
package
glass
unit
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9779779A
Other languages
English (en)
Other versions
JPS6214098B2 (ja
Inventor
Akihiro Dotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9779779A priority Critical patent/JPS5623756A/ja
Publication of JPS5623756A publication Critical patent/JPS5623756A/ja
Publication of JPS6214098B2 publication Critical patent/JPS6214098B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9779779A 1979-07-31 1979-07-31 Ceramic package and manufacture thereof Granted JPS5623756A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9779779A JPS5623756A (en) 1979-07-31 1979-07-31 Ceramic package and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9779779A JPS5623756A (en) 1979-07-31 1979-07-31 Ceramic package and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS5623756A true JPS5623756A (en) 1981-03-06
JPS6214098B2 JPS6214098B2 (ja) 1987-03-31

Family

ID=14201781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9779779A Granted JPS5623756A (en) 1979-07-31 1979-07-31 Ceramic package and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5623756A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61147793A (ja) * 1984-12-18 1986-07-05 Makita Denki Seisakusho:Kk 電動工具の電池駆動による制御装置
JPH0621858U (ja) * 1992-03-25 1994-03-22 滋賀ボルト株式会社 ボルト締付け装置
JPH0621860U (ja) * 1992-03-25 1994-03-22 滋賀ボルト株式会社 ボルト締付け装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61147793A (ja) * 1984-12-18 1986-07-05 Makita Denki Seisakusho:Kk 電動工具の電池駆動による制御装置
JPH0621858U (ja) * 1992-03-25 1994-03-22 滋賀ボルト株式会社 ボルト締付け装置
JPH0621860U (ja) * 1992-03-25 1994-03-22 滋賀ボルト株式会社 ボルト締付け装置

Also Published As

Publication number Publication date
JPS6214098B2 (ja) 1987-03-31

Similar Documents

Publication Publication Date Title
NO119844B (ja)
DE3382551D1 (de) Verbinder mit schmelzeinsatz und innerer temperatursteuerung.
JPS5610244A (en) Temperature sensor controlling device
AT386714B (de) Vorrichtung zur heissanzeige und zur regelung bzw. begrenzung der temperatur von strahlungsbzw. kontaktheizkoerpern von elektrischen kochgeraeten
ES8703704A1 (es) Un calentador infrarrojo para una cocina de parte superior de ceramica vitrea.
GB2330291A (en) Electric heaters
JPS5623756A (en) Ceramic package and manufacture thereof
IT1280150B1 (it) Combinazione di componenti per piastre elettriche di riscaldamento, dispositivi di accensione, sensori di temperatura o simili
SE7901095L (sv) Elektriska ugnar, speciellt for smeltprocesser av typ goldsmith, dental och liknande
ES281644U (es) Elemento de calentamiento que funcione electricamente.
FR2572873B1 (fr) Electrode de paroi pour four metallurgique electrique a courant continu
US4171519A (en) Circuit breaker with parallel shorting element
ES8206948A1 (es) Dispositivo de placa de cocina limitado en cuanto a la tem- peratura
KR100403140B1 (ko) 반도체패키지 제조용 히트블럭 장치
JPS5767029A (en) Cylindrical electrode and melting method for glass using cylindrical electrode
ES339309A1 (es) Un metodo para ligar un material electricamente aislante a un material electricamente conductor.
KR940022941A (ko) 고온 반응형 전지의 가열방법 및 그 장치
GB769428A (en) Improvements relating to electrically heated glass furnaces
JPS5684542A (en) Electric heater
JPS5670642A (en) Semiconductor device
KR0166821B1 (ko) 와이어 본딩장비의 본딩온도 조절장치
GB883630A (en) An immersion temperature-sensing unit
SU531042A1 (ru) Термопара
JPS53124790A (en) Connecting means for metal wire
JPS5568057A (en) Electron gun