JPS5670642A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5670642A
JPS5670642A JP14803879A JP14803879A JPS5670642A JP S5670642 A JPS5670642 A JP S5670642A JP 14803879 A JP14803879 A JP 14803879A JP 14803879 A JP14803879 A JP 14803879A JP S5670642 A JPS5670642 A JP S5670642A
Authority
JP
Japan
Prior art keywords
semiconductor element
lead wires
vicinity
container
short period
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14803879A
Other languages
Japanese (ja)
Inventor
Koichi Suzuki
Yukio Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14803879A priority Critical patent/JPS5670642A/en
Publication of JPS5670642A publication Critical patent/JPS5670642A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To accurately measure the temperature characteristics of a semiconductor element in a short period of time by providing an electric heater in the vicinity of the element in a state capable of being biased externally and containing it in a container. CONSTITUTION:The semiconductor element 6 and the electric heater 7 in the vicinity of the element 6 are disposed within the container 5 in which mounting substrate lead wires 4, external lead wires 2 and heating lead wires 3, 3' are provided, and are connected via bonding wires 8. Since the semiconductor element can be thus accurately heated by the heater 7 in a short period of time, the measurement of the temperature characteristics of the semiconductor element can be readily conducted.
JP14803879A 1979-11-15 1979-11-15 Semiconductor device Pending JPS5670642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14803879A JPS5670642A (en) 1979-11-15 1979-11-15 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14803879A JPS5670642A (en) 1979-11-15 1979-11-15 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5670642A true JPS5670642A (en) 1981-06-12

Family

ID=15443725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14803879A Pending JPS5670642A (en) 1979-11-15 1979-11-15 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5670642A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5958828A (en) * 1982-09-28 1984-04-04 Fujitsu Ltd Screening method for resin seal type semiconductor device
JPH08184504A (en) * 1994-12-28 1996-07-16 Nec Corp Method and apparatus for measuring temperature
EP0990918A2 (en) * 1998-09-28 2000-04-05 Nec Corporation Device and method for nondestructive inspection on semiconductor device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5958828A (en) * 1982-09-28 1984-04-04 Fujitsu Ltd Screening method for resin seal type semiconductor device
JPS6352711B2 (en) * 1982-09-28 1988-10-19 Fujitsu Ltd
JPH08184504A (en) * 1994-12-28 1996-07-16 Nec Corp Method and apparatus for measuring temperature
EP0990918A2 (en) * 1998-09-28 2000-04-05 Nec Corporation Device and method for nondestructive inspection on semiconductor device
EP0990918A3 (en) * 1998-09-28 2002-08-28 Nec Corporation Device and method for nondestructive inspection on semiconductor device
US6610918B2 (en) 1998-09-28 2003-08-26 Nec Electronics Corporation Device and method for nondestructive inspection on semiconductor device
US6759259B2 (en) 1998-09-28 2004-07-06 Nec Electronics Corporation Device and method for nondestructive inspection on semiconductor device
EP1580567A2 (en) * 1998-09-28 2005-09-28 NEC Electronics Corporation Device and method for nondestructive inspection on semiconductor device
EP1580567A3 (en) * 1998-09-28 2006-11-29 NEC Electronics Corporation Device and method for nondestructive inspection on semiconductor device

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