JPS62133741A - パツケ−ジ - Google Patents

パツケ−ジ

Info

Publication number
JPS62133741A
JPS62133741A JP60273368A JP27336885A JPS62133741A JP S62133741 A JPS62133741 A JP S62133741A JP 60273368 A JP60273368 A JP 60273368A JP 27336885 A JP27336885 A JP 27336885A JP S62133741 A JPS62133741 A JP S62133741A
Authority
JP
Japan
Prior art keywords
resin
silicone resin
electronic component
wiring board
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60273368A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0521342B2 (enExample
Inventor
Yukio Yamaguchi
幸雄 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60273368A priority Critical patent/JPS62133741A/ja
Priority to US06/900,532 priority patent/US4709301A/en
Priority to DE86112244T priority patent/DE3688164T2/de
Priority to EP86112244A priority patent/EP0214621B1/en
Publication of JPS62133741A publication Critical patent/JPS62133741A/ja
Publication of JPH0521342B2 publication Critical patent/JPH0521342B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/47—
    • H10W72/00—
    • H10W70/656—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP60273368A 1985-09-05 1985-12-06 パツケ−ジ Granted JPS62133741A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60273368A JPS62133741A (ja) 1985-12-06 1985-12-06 パツケ−ジ
US06/900,532 US4709301A (en) 1985-09-05 1986-08-26 Package
DE86112244T DE3688164T2 (de) 1985-09-05 1986-09-04 Packung mit einem Substrat und mindestens einem elektronischen Bauelement.
EP86112244A EP0214621B1 (en) 1985-09-05 1986-09-04 A package comprising a substrate and at least one electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60273368A JPS62133741A (ja) 1985-12-06 1985-12-06 パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS62133741A true JPS62133741A (ja) 1987-06-16
JPH0521342B2 JPH0521342B2 (enExample) 1993-03-24

Family

ID=17526925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60273368A Granted JPS62133741A (ja) 1985-09-05 1985-12-06 パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS62133741A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990000814A1 (fr) * 1988-07-15 1990-01-25 Toray Silicone Co., Ltd. Dispositif a semi-conducteurs scelle par une resine et procede de production
JPH05218117A (ja) * 1991-10-25 1993-08-27 Internatl Business Mach Corp <Ibm> マイクロ電子回路パツケージ及びその再加工方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171343U (ja) * 1983-04-28 1984-11-16 株式会社デンソー 混成集積回路装置
JPS60116151A (ja) * 1983-11-28 1985-06-22 Matsushita Electric Works Ltd 電子部品の封止法
JPS6120771U (ja) * 1984-07-09 1986-02-06 日本フエラス工業株式会社 サツシ枠の建付装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171343U (ja) * 1983-04-28 1984-11-16 株式会社デンソー 混成集積回路装置
JPS60116151A (ja) * 1983-11-28 1985-06-22 Matsushita Electric Works Ltd 電子部品の封止法
JPS6120771U (ja) * 1984-07-09 1986-02-06 日本フエラス工業株式会社 サツシ枠の建付装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990000814A1 (fr) * 1988-07-15 1990-01-25 Toray Silicone Co., Ltd. Dispositif a semi-conducteurs scelle par une resine et procede de production
JPH05218117A (ja) * 1991-10-25 1993-08-27 Internatl Business Mach Corp <Ibm> マイクロ電子回路パツケージ及びその再加工方法

Also Published As

Publication number Publication date
JPH0521342B2 (enExample) 1993-03-24

Similar Documents

Publication Publication Date Title
KR100220154B1 (ko) 반도체 패키지의 제조방법
US5519936A (en) Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
US5773884A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
US5610442A (en) Semiconductor device package fabrication method and apparatus
US5633533A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
JPH09162322A (ja) 表面実装型半導体装置とその製造方法
JP3239640B2 (ja) 半導体装置の製造方法および半導体装置
WO1992011655A1 (en) Semiconductor device package with improved heat dissipation characteristics
JPS62133741A (ja) パツケ−ジ
KR101008534B1 (ko) 전력용 반도체모듈패키지 및 그 제조방법
JP2949969B2 (ja) フィルムキャリア半導体装置
JP2904154B2 (ja) 半導体素子を含む電子回路装置
JPS58122753A (ja) 高密度チツプキヤリア
JPS61137349A (ja) 半導体装置
JPS62133742A (ja) パツケ−ジ
KR100197876B1 (ko) 반도체 패키지 및 그 제조방법
JP2614495B2 (ja) 電子部品搭載用基板
KR100406499B1 (ko) 반도체패키지의 몰딩장비 및 이를 이용한 몰딩방법
KR100520443B1 (ko) 칩스케일패키지및그제조방법
JP2975782B2 (ja) 混成集積回路装置およびこれに用いるケース材
KR100459820B1 (ko) 칩스케일패키지및그제조방법
KR100639210B1 (ko) 볼 그리드 어레이 패키지
JP2000200862A (ja) 半導体装置およびその製造方法
JPH03255655A (ja) 半導体装置
KR950004510A (ko) 버텀리드형 반도체 패키지의 구조 및 그 제조방법