JPS62133741A - Package - Google Patents
PackageInfo
- Publication number
- JPS62133741A JPS62133741A JP27336885A JP27336885A JPS62133741A JP S62133741 A JPS62133741 A JP S62133741A JP 27336885 A JP27336885 A JP 27336885A JP 27336885 A JP27336885 A JP 27336885A JP S62133741 A JPS62133741 A JP S62133741A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- silicone resin
- electronic component
- wiring board
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15182—Fan-in arrangement of the internal vias
- H01L2924/15184—Fan-in arrangement of the internal vias in different layers of the multilayer substrate
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子装置等に使用されるパッケージに係わシ、
特に信号等を授受する入出力ビンを配線基板に設は電子
部品を実装してシリコンコーティングされたパッケージ
に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a package used for an electronic device, etc.
In particular, it relates to a package in which input/output bins for transmitting and receiving signals, etc. are provided on a wiring board, electronic components are mounted, and the package is coated with silicon.
従来、この種のパッケージは、第２図に示すように内部
に複数層の導体配線層１を有し裏面に入出力ピン２が設
けられた配線基板３上に電子部品４が実装され、リード
５を介して前記導体配線層１に接続されて電子部品４の
周辺部はシリコン樹脂６によシ被覆されている（例えば
、ＢｒａｄＯｌｄｅｒ ａｎｄ Ｒｉｃｈａｒｄ Ａ、
、Ｎｏｎ−ｈｅｒｍｅｔ ｉｃｐａｃｋａｇｉｎｇ ｔ
ｅｃｈｎｉｑｕｅｓ ｆｏｒ ｈｙｂｒｉｄｓ 、 ”
Ｅｌｅｃｔｒｏｎｉｃ Ｐａｃｋａｇｉｎｇ ａｎｄ
Ｐｒｏｄｕｃｔｉｏｎ 。Conventionally, as shown in FIG. 2, in this type of package, electronic components 4 are mounted on a wiring board 3 that has a plurality of conductor wiring layers 1 inside and has input/output pins 2 on the back side. The periphery of the electronic component 4 is connected to the conductor wiring layer 1 through the conductor wiring layer 1 and covered with a silicone resin 6 (for example, as described by Brad Older and Richard A.
, Non-hermet icpackaging
echniques for hybrids,”
Electronic Packaging and
Production.
Ｊｕｎｅ 、 １９７９ 、 Ｐ１３７〜１３９ ）。June, 1979, P137-139).
上述した従来のパッケージでは、電子部品４の交換時に
、リード５と電子部品４と配線基板３とで囲まれた領域
に充填されたシリコン樹脂６の除去が困難であシ、特に
リード５が微細化したシ、電子部品４がフェイスダウン
実装となると、リード５と電子部品４と配線基板３とで
囲まれた領域が狭くなシ、シリコン樹脂６が除去できず
、才たシリコン樹脂を溶解させる有機溶剤への浸漬時に
シリコン樹脂６の膨張でリード５が切断されたシ、配線
基板１からリード５が剥れたシするなどの問題があった
。In the conventional package described above, when replacing the electronic component 4, it is difficult to remove the silicone resin 6 filled in the area surrounded by the lead 5, the electronic component 4, and the wiring board 3. When the electronic component 4 is mounted face-down, the area surrounded by the leads 5, the electronic component 4, and the wiring board 3 is narrow, and the silicone resin 6 cannot be removed, causing the silicone resin to dissolve. There were problems such as the leads 5 being cut due to expansion of the silicone resin 6 during immersion in an organic solvent, and the leads 5 peeling off from the wiring board 1.
本発明によるパッケージは、配線基板上に実装された電
子部品のリード部まで硬化しない第１のシリコン樹脂を
充填し、この第１のシリコン樹脂上に弾力性のあるゲル
状に硬化する第２のシリコン樹脂を充填するものである
。In the package according to the present invention, a first silicone resin that does not harden is filled up to the lead portion of an electronic component mounted on a wiring board, and a second silicone resin that hardens into an elastic gel-like state is filled on top of the first silicone resin. It is filled with silicone resin.
第１のシリコン樹脂が硬化されていないので、有機溶剤
に溶解される。Since the first silicone resin is not cured, it is dissolved in the organic solvent.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示す縦断面図であシ、前述
の図と同一部分には同一符号を付しである。同図におい
て、配線基板１の表面にはリード用パッド８が、その裏
面には入出力ピン２がそれぞれ設けられておシ、このリ
ード用パッド８と入出力ピン２とは配線基板３内で導体
配線層１によシミ気的に接続されている。また、この配
線基板１上には図示しないが例えばエポキシ樹脂などの
接着剤によりスペーサ９が固定配置され、さらにこのス
ペーサ９上には電子部品４がフェースダウンで接着配置
され、電子部品４のリード５が配線基板３上のリード用
パッド８に電気的に接続されている。また、この配線基
板３上にはその周辺部に枠体１０が図示しないが接着剤
により取付固定されている。そして、この枠体１０内に
は紫外線硬化形のシリコン樹脂が充填され、上方側から
紫外線を照射することにより、電子部品４および電子部
品４のリード５の影になる部分が未硬化ないしは半硬化
状態となる第１のシリコン樹脂１１が形成され、その周
辺部および上部には弾力性のあるゲル状に硬化する第２
のシリコン樹脂１２が形成されている。また、枠体１０
の開口部には電子部品４と図示しない熱伝導性コンパウ
ンドで接触してキャップ１３が図示しないが接着剤によ
シ取付固定されている。このキャップ１３は、ヒートシ
ンク等の放熱部品を接着、半田付けまたは熱伝導性コン
パウンドによる接続等により、電子部品４で発生する熱
を外部に導く機能を有しており、空冷するためのヒート
シンクまたは水冷するための冷却板と一体化しても良い
。才た、スペーサ９は、絶縁性であれば配線基板３と電
子部品４との接着剤も絶縁性であることが望ましいが、
電子部品４のスペーサ９との接する面が絶縁されていた
シ、配線基板３のスペーサ９との接する面が絶縁されて
いれば、スペーサ９および接着剤は導電性でも良い。ま
た、配線基板３の枠体１０との接する部分が絶縁されて
いれば、枠体１０および接着剤は導電性でも良い。さら
に配線基板３０枠体１゜と接する部分が絶縁され、かつ
その上に専用の金属層を設ければ、金属の場合の枠体１
０と配線基板３とを半田付けできる。FIG. 1 is a longitudinal sectional view showing one embodiment of the present invention, and the same parts as in the previous figures are given the same reference numerals. In the figure, a lead pad 8 is provided on the front surface of the wiring board 1, and an input/output pin 2 is provided on the back surface thereof. It is electrically connected to the conductor wiring layer 1. Further, although not shown, a spacer 9 is fixedly arranged on this wiring board 1 with an adhesive such as epoxy resin, and furthermore, an electronic component 4 is adhesively arranged face-down on this spacer 9, and the leads of the electronic component 4 are arranged face-down. 5 is electrically connected to a lead pad 8 on the wiring board 3. Further, a frame 10 is attached and fixed to the peripheral portion of the wiring board 3 using an adhesive (not shown). The frame 10 is filled with an ultraviolet curing type silicone resin, and by irradiating ultraviolet rays from above, the electronic component 4 and the portions of the electronic component 4 that are in the shadow of the leads 5 are left uncured or semi-cured. A first silicone resin 11 is formed, and a second silicone resin 11 that hardens into an elastic gel is formed around and above it.
A silicone resin 12 is formed. In addition, the frame body 10
A cap 13 is attached and fixed to the opening by an adhesive (not shown) in contact with the electronic component 4 using a thermally conductive compound (not shown). This cap 13 has the function of guiding heat generated in the electronic component 4 to the outside by bonding, soldering, or connecting a heat sink or other heat dissipating component with a thermally conductive compound. It may be integrated with a cooling plate for cooling. However, if the spacer 9 is insulating, it is desirable that the adhesive between the wiring board 3 and the electronic component 4 is also insulating.
The spacer 9 and the adhesive may be conductive as long as the surface of the electronic component 4 in contact with the spacer 9 is insulated, and the surface of the wiring board 3 in contact with the spacer 9 is insulated. Furthermore, the frame 10 and the adhesive may be conductive as long as the portion of the wiring board 3 that contacts the frame 10 is insulated. Furthermore, if the portion of the wiring board 30 in contact with the frame 1° is insulated and a dedicated metal layer is provided on it, the frame 1 can be made of metal.
0 and the wiring board 3 can be soldered.
このような構成によれば、電子部品４等を交換する場合
、まず第２のシリコン樹脂１２を剥がし、次に第１のシ
リコン樹脂１１を有機溶剤に浸漬することによシ、溶解
され、容易に除去することができる。According to such a configuration, when replacing the electronic component 4, etc., the second silicone resin 12 is first peeled off, and then the first silicone resin 11 is immersed in an organic solvent, so that it is easily dissolved and replaced. can be removed.
なお、前述した実施例において、第１のシリコン樹脂１
１および第２のシリコン樹脂１２として紫外線硬化形の
シリコン樹脂を用いた場合について説明したが、本発Ｆ
！Ａはこれに限定されるものではなく、加熱硬化形のシ
リコン樹脂を用いても前述と同様の効果が得られること
は勿論である。In addition, in the embodiment described above, the first silicone resin 1
Although the case where ultraviolet curable silicone resin is used as the first and second silicone resins 12 has been described, the present F
! A is not limited to this, and it goes without saying that the same effect as described above can be obtained even if a heat-curable silicone resin is used.
以上説明したように本発明によれば、配線基板上に実装
された電子部品のリード部の高さまで硬化しない第１の
シリコン樹脂を充填したことによシ、電子部品の交換時
に、電子部品のリード部上部の第２のシリコン樹脂のみ
を剥離し、第１のシリコン樹脂を有機溶剤に浸漬するこ
とによシ、溶解され、容易に除去されるので、電子部品
のｙ−ドの切断および配線基板からの剥れ等を確実に防
止することができるという極めて優れた効果が得られる
。As explained above, according to the present invention, since the first silicone resin that does not harden is filled to the height of the lead portion of the electronic component mounted on the wiring board, it is possible to remove the electronic component when replacing the electronic component. By peeling off only the second silicone resin on the upper part of the lead part and immersing the first silicone resin in an organic solvent, it is dissolved and easily removed, making it easy to cut and wire the y-do of electronic components. An extremely excellent effect can be obtained in that peeling from the substrate can be reliably prevented.
第１図は本発明によるパッケージの一実施例を示す縦断
面図、第２図は従来のパッケージを示す縦断面図である
。
１・・−・導体配線層、２・・・・入出力ピン、３・・
・Φ配線基板、４・・・争電子部品、５・・・・リード
、８・・・・リード用パッド、９・・・・スペーサ、１
０・・・・枠体、１１１Ｉ・・・第１のシリコン樹脂、
１２・・・・第２のシリコン樹脂、１３・・・［株］キ
ャップ。FIG. 1 is a vertical cross-sectional view showing an embodiment of a package according to the present invention, and FIG. 2 is a vertical cross-sectional view showing a conventional package. 1... Conductor wiring layer, 2... Input/output pin, 3...
・Φ Wiring board, 4... Electronic component, 5... Lead, 8... Lead pad, 9... Spacer, 1
0... Frame body, 111I... First silicone resin,
12...Second silicone resin, 13...[Co., Ltd.] Cap.
Claims (1)
線基板上に取付固定された枠体と、前記電子部品のリー
ド部の高さまで充填された硬化しない第１のシリコン樹
脂と、前記第１のシリコン樹脂上に充填された弾力性の
あるゲル状に硬化する第２のシリコン樹脂とを具備する
ことを特徴としたパッケージ。a wiring board on which an electronic component having leads is mounted; a frame mounted and fixed on the wiring board; a non-hardening first silicone resin filled up to the height of the lead portion of the electronic component; 1. A package comprising: a silicone resin and a second silicone resin that hardens into an elastic gel-like state filled on the silicone resin.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27336885A JPS62133741A (en) | 1985-12-06 | 1985-12-06 | Package |
| US06/900,532 US4709301A (en) | 1985-09-05 | 1986-08-26 | Package |
| EP86112244A EP0214621B1 (en) | 1985-09-05 | 1986-09-04 | A package comprising a substrate and at least one electronic component |
| DE86112244T DE3688164T2 (en) | 1985-09-05 | 1986-09-04 | Pack with a substrate and at least one electronic component. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27336885A JPS62133741A (en) | 1985-12-06 | 1985-12-06 | Package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62133741A true JPS62133741A (en) | 1987-06-16 |
| JPH0521342B2 JPH0521342B2 (en) | 1993-03-24 |
Family
ID=17526925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27336885A Granted JPS62133741A (en) | 1985-09-05 | 1985-12-06 | Package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62133741A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990000814A1 (en) * | 1988-07-15 | 1990-01-25 | Toray Silicone Co., Ltd. | Semiconductor device sealed with resin and a method of producing the same |
| JPH05218117A (en) * | 1991-10-25 | 1993-08-27 | Internatl Business Mach Corp <Ibm> | Microelectronic circuit package and its reworking method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59171343U (en) * | 1983-04-28 | 1984-11-16 | 株式会社デンソー | Hybrid integrated circuit device |
| JPS60116151A (en) * | 1983-11-28 | 1985-06-22 | Matsushita Electric Works Ltd | Sealing method of electronic parts |
| JPS6120771U (en) * | 1984-07-09 | 1986-02-06 | 日本フエラス工業株式会社 | Installation equipment for sash frame |
-
1985
- 1985-12-06 JP JP27336885A patent/JPS62133741A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59171343U (en) * | 1983-04-28 | 1984-11-16 | 株式会社デンソー | Hybrid integrated circuit device |
| JPS60116151A (en) * | 1983-11-28 | 1985-06-22 | Matsushita Electric Works Ltd | Sealing method of electronic parts |
| JPS6120771U (en) * | 1984-07-09 | 1986-02-06 | 日本フエラス工業株式会社 | Installation equipment for sash frame |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990000814A1 (en) * | 1988-07-15 | 1990-01-25 | Toray Silicone Co., Ltd. | Semiconductor device sealed with resin and a method of producing the same |
| JPH05218117A (en) * | 1991-10-25 | 1993-08-27 | Internatl Business Mach Corp <Ibm> | Microelectronic circuit package and its reworking method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521342B2 (en) | 1993-03-24 |
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